Innodisk Industrial Grade SSD
Innodisk SSDs bring a whole new level of high-performance to memory storage
Innodisk's wide selection of SSDs are designed for different applications, including industrial/embedded, enterprise server, aerospace, defense, and other semi-industrial applications, such as thin clients, POS, and kiosks.
Diamond Point RD103
Rugged Customisable Industrial DIN Rail / Wall Mount PC
The RD-103 provides the user with a state of the art embedded DIN rail computer suitable for many different applications. Supporting a wide range of embedded processors, the RD-103 is available with a low cost 500MHz AMD Geode LX800 up to a dual core AMD G-Series APU at 1.6GHz for maximum performance but with very low power consumption
Compact quad core 1.91GHz Atom Box PC with dual GBit LAN and DVI-D/DP graphics.
Contec's BX-220 is a fanless computer for embedded applications. It features an Intel Atom processor E3845 CPU. Thanks to this quad-core CPU, simultaneous stable high-speed processing for four applications is possible.
DSC Aries SBC
Ext temp quad core 1.91GHz Atom PC/104+ SBC with dual GBit LAN and data acquisition.
Diamond Systems' Aries is a compact, rugged, single board computer featuring the Intel E3800 Bay Trail processor in an extended PC/104-Plus form factor along with a professional-quality DAQ circuit.
MEN Mikro MH70I
Rugged 19" Modular Industrial PC, up to Intel i7 CPU, up to 16GB DRAM
The MH70I is a modular application-ready industrial PC which meets the requirements of any industrial environment, e.g., control stations for industrial automation or in-vehicle applications.
Trimble ICM SMT 360
Miniature Multi-GNSS Timing Module with Holdover, PPS, PP2S and 10MHz Outputs
Trimble® designed the ICM SMT 360™ Timing Module to work in the most demanding weak signal environments, including femtocells and in-building systems
Industrial pico-ITX Motherboard with soldered Intel Atom E38xx SoC CPU (Bay Trail)
The pITX-E38 form factor is ideal for compact PC applications. Due to its small size (100 x 72mm) it's easily integrated into virtually any system with severe space constraints and/or thermal restrictions, where other form factor simply will not fit the requirements.