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Diamond Point International

Kontron AT8070 - 40G Advanced TCA Xeon Xeon® 5600 Processor Blade

Dual Intel® Xeon® E5-2600 v2 10-Core Series and High speed dual 40GBase-KR4 to fabric interface

Kontron AT8070 - 40G Advanced TCA Xeon Processor Blade
Key Features
40G ATCA Xeon Processor Blade
Dual Intel® Xeon® E5-2600 v2
High speed dual 40GBase-KR4 to fabric interface
Up to 64GB via 4 DDR3 channels per CPU
Onboard drive 2.5" SAS/SATA HDD/SSD
NEBS mode up to 225W/high power mode up to 350W
-5 to +55°C operating range


Kontron has a full range of ATCA board and application-ready platforms for Telecom Equipment Manufacturers (TEMs) to help accelerate their network system development for LTE Evolved Packet Core, carrier cloud and content delivery applications.

TEMs designing for 40G based platforms can begin development immediately with the OM9141-40G ATCA platform which consists of a 40G chassis with advanced cooling, 40G switching, 40G packet processing, and now, 40G general purpose multicore processing capabilities.

Introducing the Kontron AT8070, a 40G ATCA Dual Xeon processor blade with the highest performance and flexibility for addressing the high traffic and increasing delivery costs of fixed broadband and wireless network applications managed by budget-constrained service providers.

For superior processing and I/O performance, the Kontron AT8070 is designed with the 10-core Intel® Xeon® processor E5-2600 v2 family, a larger storage capacity, and virtualization technology. Key benefits of the Kontron AT8070 include:

  • Massive I/O bandwidth increase: a total of 80 lanes of PCIe (40 lanes per processor);
  • Faster memory bandwidth: each processor has 4 channels running at 1600MHz, more than a 60% improvement over previous generation Intel® Xeon® processor 5600 series;
  • Large inter-processor connection: reduced latency with two 8GT/s QPI, which accelerates access a processor needs to access resources (PCIe and/or memory) attached to second processor;
  • More cores, same power budget: Kontron supports up to 10 cores (20 threads). Dual-socket supplies 20 cores (40 threads).

Security workloads with compatible Kontron Rear Transition Modules (RTM)

For consolidating application, control and packet/content processing workloads onto one platform, the Kontron AT8070 is compatible with the Kontron RTM8063-CC, which features two SAS disk drives and the Intel® Communications Chipset 89xx Series. This enables support for crypto-acceleration, compression, and other security application designs. The AT8070 is also available with only storage options with the RTM8063 and RTM8066 rear transition modules.

Kontron Active Power Management

Kontron has developed Active Power Management, a software interface for clients to intelligently pre-set and regulate the processor power settings on its AdvancedTCA® processor blade via the Intel® Node Manager embedded in the Intel® Xeon® processor E5-2600 family. The Active Power Management fully integrates existing Kontron Management Solutions and is accessible using known standards such as IPMI and PICMG® interfaces. It allows dynamic power monitoring, power capping controls, and power threshold alerting, thus enabling platforms to achieve maximum performance and power for a single node.



CPU SpecDual (up to) 10-Core Intel® Xeon® Processor E5-2600 v2 Family; Passive heatsink

AVX: Float 16 accelerates data conversion between 16?bit floating point format to 32?bit and vice?versa; useful for image processing and graphical applications allowing for compression of data so less memory and less bandwidth is required

VT: APIC virtualization (APICv) to decrease overhead in the handling of instruction interrupts in the core

Data Direct I/O Technology (Intel® DDIO) to reduce memory accesses from I/O on local socket and speed up processor data transfers. Security features include Execute Disable (XD) and Intel® Trusted Execution Technology (Intel® TXT) for malware resistance.
ChipsetIntel® C600 Chipset
MemoryUp to 128 GB Memory, 4DIMMS per processor (Up to 64 GB across 4 independent DDR3 channels per processor)
StorageOnboard drive 2.5" SAS/SATA HDD/SSD
Dual Hot-Swap SAS HDD via Rear Transition Module, RTM8063
Single eUSB flash drive supported are 16GB or more capacity
Front I/OFront Panel: Two RJ45 Gigabit Ethernet; One RS-232 serial interface, two USB
Rear I/OBase Interface: Two 10/100/1000Base-T interfaces are provided by the 82576 controller
Fabric Interface: each channel supports 40GbE - 40GBASE-KR4; 10GbE - 10GBASE-KX4 (XAUI); 1GbE - 1000BASE-KX
BIOSUEFI BIOS from AMI (UEFI Aptio4) with Compatibility Support Module (CSM), providing legacy BIOS compatibility
Automatic BIOS settings content backup in flash memory
OptionsRTM (RTM8063): Regular PICMG3.0 Managed FRU/Hot Swap Dual SAS/SATA Hard Disk; 2x USB, 2x SFP, Serial RJ-45; and external SAS connector


ExpansionPICMG3.0 R3.0; PICMG 3.1 R1.0 specification options 1 and 9
ElectricalBoard power consumption is less than 315W; no RTM. Power Policies can be used to control power requirements
SoftwareRed Hat Enterprise Linux Server version 5.8 64-bit; Red Hat Enterprise Linux Server 6.1 64-bit
Support for Intel® Data Plane Development Kit (Intel® DPDK)
TemperatureTemperature range (operation): -5 to +55°C
Temperature range (storage and rransit): -40 to +85°C
HumidityOperating: 5% to 93% @40°C non-condensing
Storage and Transit: 5% to 93% @40°C non-condensing
AltitudeOperating: -300 m to 4000 m / -984ft to 13,123 ft
Storage and Transit: -300 m to 14 000m / -9,84 ft to 45,931 ft
•5 Hz to 10 Hz @ +12 dB/oct (slope up)
•10 Hz to 50 Hz @ 0.02 m2/s3 (0.0002 g2/ Hz) (flat)
•50 Hz to 100 Hz @ -12 dB/oct (slope down)
Storage and Transit: 5 to 200 Hz 0.2 g
ShockOperating: 11 ms half sine, 3 g, 3 shocks in each direction
Storage and Transit: 6 ms half sine, 18 g, 100 shocks in each direction
MTBFTargeted MTBF is 250000 @ 30°C, calculations based on Telcordia SR-332
Safety/CertificationSafety: meets all requirements of UL/CSA/EN/IEC 60950-1
EMCEMC: compliant with the Electromagnetic Compatibility Directive, EC Council Directive 2004/108/EC
Warranty2 Years

Ordering Details

BoardOn request

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