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Diamond Point International

Congatec conga-TR4 - COM Express® basic Type 6 with AMD’s Next Gen V1000

Speeds to 3.00GHz (Quad Core), Up To 32GB DDR4 Memory, SATA RAID, 4k Display support

Introduction

Congatec's conga-TR4 high-performance module with COM Express Type 6 pinout is based on the latest AMD Ryzen™ Embedded V1000 multi-core processors. These modules offer up to 52 per cent more processor performance, reaching up to 3.75 GHz. Thanks to symmetrical multiprocessing, they also provide particularly high parallel processing performance. They support up to 32GB energy-efficient and fast dual-channel DDR4 memory with up to 3200 MT/s and optional ECC for maximum data security.

The new integrated AMD Radeon™ Vega graphics with up to 11 compute units marks the cutting edge of embedded graphics. It supports up to four independent displays with up to 4k UHD resolution and 10-bit HDR, as well as DirectX 12 and OpenGL 4.4 for 3D graphics. The integrated video engine enables hardware-accelerated streaming of HEVC (H.265) video  in both directions. Thanks to HSA and OpenCL 2.0 support, deep learning workloads can be assigned to the GPU. In safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated encryption and decryption of RSA, SHA and AES.

The new conga-TR4 is also the first congatec COM Express Type 6 module to allow a complete USB-C implementation on the carrier board including USB 3.1 Gen 2 with 10 Gbit/s, Power Delivery and DisplayPort 1.4, for example to connect external touchscreens with a single cable. Further performance-oriented interfaces offered, includes 1x PEG 3.0 x8, 4x PCIe Gen 3 and 4x PCIe Gen 2, 3x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 8x USB 2.0, 2x SATA Gen 3, 1x Gbit Ethernet. I/Os for SD, SPI, LPC, I²C as well as 2x legacy UART from the CPU and High Definition Audio round off the range of interfaces.

The supported operating systems include Linux, Yocto 2.0 and Microsoft Windows 10, or optionally Windows 7. congatec provides an extensive range of passive and active cooling solutions for workstation designs up to 54W performance, application-ready carrier boards as well as best practice carrier board layouts and circuit diagrams, e.g. for USB-C implementations, to help simplify the design-in of the modules. To bring new designs to market even fast

Specification

CPU

CPU SpecAMD V1807B (4 x 3.35 - 3.75 GHz, L2 cache 2MB shared, 35-54W)
AMD V1756B (4 x 3.25 - 3.6 GHz, L2 cache 2MB shared, 35-54W)
AMD V1605B (4 x 2.0 - 3.6 GHz, L2 cache 2MB shared, 12-25W)
AMD V1202B (2 x 2.5 - 3.4 GHz, L2 cache 1MB shared, 12-25W)
ChipsetIntegrated in SoC
Memory2 Sockets, SO-DIMM DDR4 up to 32 GByte with ECC
GraphicsIntegrated AMD Radeon™ Graphics supports DirectX 12 | OpenGL 4.6 and OpenCL™ 2.1
Up to 3 Simultaneous Displays
Unified Video Decoder 6 (H.265, H.264, MVC, MPEG4, MPEG2, VC-1, WMV and MJPEG)
Video Compression Engine 3.1 (dual, H.264, SVC)
Digital Display Interface: 3x DisplayPort 1.2/ HDMI 2.0 supporting 4K @60Hz
LVDS:
• 18/24-bit Single/Dual Channel LVDS Interface (default) or 1x eDP (optional)
• Resolutions up to 1920X1200@60Hz
• VESA standard or JEIDA datam mapping
• Automatic Panel Detection via EDID/EPI
NetworkGigabit Ethernet
Storage2 x SATA 6 Gb/s
SD
USB3 x USB 3.1 Gen2
1 x USB 3.1 Gen1
8 x USB 2.0
Serial2 x UART
AudioHigh Definition Audio Interface
OtherI²C bus (fast mode, 400 kHz, multi-master)
LPC bus
SPI
SM-Bus
CommonMulti Stage Watchdog
Non-volatile User Data Storage
Manufacturing and Board Information
Board Statistics
LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master)
Power Loss Control
Power ManagementACPI 5 .0 compliant, Smart Battery Management
PlatformThe conga-TR4 offers a discrete TPM 2.0 (Infineon SLB9665).

General

Expansion4 x PCI Express™ 3.0 lanes
4 x PCI Express™ 2.0 lanes
1 x PEG 3.0 x8
Electrical12V DC ± 5%
Refer to manual for detailed power consumption figures
Mechanical125 x 95 mm
Conformal CoatingOn request
SoftwareMicrosoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise (64bit only)
Microsoft® Windows 10 Core Pro
Linux
Yocto
TemperatureOperation (standard): 0 to 60°C
Operation (industrial): -40 to 85°C
Non-operation: -20 to 80deg;C
HumidityOperating: 10 - 90% r. H. non-cond
Storage: 5 - 95% r. H. non-cond
Warranty2 Years
RoHSCompliant

Ordering Details

Board041600
conga-TR4/V1807B
COM Express Type 6 Basic module with AMD embedded V-Series V1807B (Great Horned Owl) quad core processor with 3.35 GHz up to 3.75 GHz core frequency, 2MB L2 cache and 3200MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 11 CU. TDP 35-54W.

041601
conga-TR4/V1756B
COM Express Type 6 Basic module with AMD embedded V-Series V1756B (Great Horned Owl) quad core processor with 3.25 GHz up to 3.6 GHz core frequency, 2MB L2 cache and 3200MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 8 CU. TDP 35-54W.

041602
conga-TR4/V1605B
COM Express Type 6 Basic module with AMD embedded V-Series V1605B (Great Horned Owl) quad core processor with 2.0 GHz up to 3.6 GHz core frequency, 2MB L2 cache and 2400MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 8 CU. TDP 12-25W.

041603
conga-TR4/V1202B
COM Express Type 6 Basic module with AMD embedded V-Series V1202B (Great Horned Owl) dual core processor with 2.5 GHz up to 3.4 GHz core frequency, 1MB L2 cache and 2400MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 3 CU. TDP 12-25W.

041610
conga-TR4/i-V1404I
COM Express Type 6 Basic module with AMD embedded V-Series V1404I (Great Horned Owl) quad core processor with TBD GHz up to TBD GHz core frequency, 2MB L2 cache and 2400MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 6 CU. Industrial temperature range from -40°C to 85°C. TDP 15W.
Accessories041651
TR4/HSP-HP-B
Standard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

041652
TR4/HSP-HP-T
Standard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes.All standoffs are M2.5mm thread.

041653
TR4/CSP-HP-B
Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.

041654
TR4/CSP-HP-T
Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.

041655
TR4/CSA-HP-B
Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins,20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

041656
TR4/CSA-HP-T
Standard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.


068790 4 GByte DDR4 SODIMM memory module | 2400 MT/s
068791 8 GByte DDR4 SODIMM memory module | 2400 MT/s
068792 16 GByte DDR4 SODIMM memory module | 2400 MT/s
068795 4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
068796 8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
068797 16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V

065800 conga-TEVAL Evaluation carrier board for Type 6 COM Express modules
011115 conga-LDVI/EPI LVDS to DVI converter board for digital flat panels with onboard EEPROM
400007 COM-Express-Carrier-Socket-5 Connector for COM Express carrier boards | height 5mm | packing unit 4 pieces
400004 COM-Express-Carrier-Socket-8 Connector for COM Express carrier boards | height 8mm | packing unit 4 pieces

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