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Diamond Point International

Congatec conga-TS170 - COM Express® basic Type 6 with 6th Gen Intel® Core™ CPU

Speeds to 2.8GHz (Quad Core), Up To 32GB DDR4 Memory, SATA RAID, 4k Display support

Introduction

The Congatec conga-TS170 is a type 6 COM Express Basic module featuring the sixth generation Intel® Core™ processor. It's available with a wide range of processors, from a dual-core i3 up to a quad core i7 CPU. The board is also available with a range of Intel® Xeon ® processors. The board has dual DDR4 SODIMM memory sockets supporting up to a maximum of 32GB of DDR4 memory. Standard onboard features include Intel® i219-LM GbE LAN Controller with AMT 11 support, 4 SATA III interfaces, four USB 3.0 channels, eight USB 2.0 channels, one PCIe x16 Gen 3 l interface and eight PCIe Gen3 lanes.

Software support includes support for Microsoft Windows 10, Windows 8.1, Windows 7, WES7 and Linux.

 

 

Specification

CPU

CPU SpecIntel® Core™ i7-6820EQ (4 x 2.8 / 3.5 GHz, 8MB cache, 45 W)
Intel® Core™ i7-6822EQ (4 x 2.0 / 2.8 GHz, 8MB cache, 25 W)
Intel® Core™ i5-6440EQ (4 x 2.7 / 3.4 GHz, 6MB cache, 45 W)
Intel® Core™ i5-6442EQ (4 x 1.9 / 2.7 GHz, 6MB cache, 25 W)
Intel® Core™ i3-6100E (2 x 2.7 GHz, 3MB cache, 35 W)
Intel® Core™ i3-6102E (2 x 1.9 GHz, 3MB cache, 25 W)
Intel® Xeon™ E3-1505M V5 (4 x 2.8 / 3.7 GHz, 8MB cache, 45 W)
Intel® Xeon™ E3-1505L V5 (4 x 2.0 / 2.8 GHz, 8MB cache, 25 W)
Intel® Xeon® E3-1515MV5 (4 x 2,8GHz / 3.7GHz, 8MB cache, 35 W)
Intel® Xeon® E3-1578L V5 (4 x 2.0 GHz / 3.4 GHz , 8MB cache, 45 W)
Intel® Xeon® E3-1558LV5 (4 x 1.9GHz / 3.3GHz, 8MB cache, 45 W)
ChipsetMobile Intel® 100 Series Chipset
Memory2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support
GraphicsIntel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3 and DirectX12 (for Windows 10) support
Up to three independent displays:
• HDMI 1.4a
• DisplayPort 1.2
• eDP 1.3
High performance hardware MPEG-2 decoding
WMV9 (VC-1) and H.265 (HEVC) support
Blu-ray support @ 40 MBit/s
HEVC, VP8, VP9 and VDENC encoding
LVDS (eDP optional):
• Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface
• VESA and openLDI colour mappings
• Resolutions up to 1920x1200
• Automatic Panel Detection via EDID/EPI
Digital Display Interface (DDI)
• 3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST)
• Resolutions up to 4k
• VGA (optional)
NetworkIntel® i219-LM GbE LAN Controller with AMT 11 support
Storage4x SATA 6Gb/s
USB4 x USB 3.0 (XHCI)
8 x USB 2.0 (XHCI)
Serial2x serial interface (RX/TX only)
AudioDigital High Definition Audio Interface with support for multiple audio codecs
CommonMulti Stage Watchdog
Non-volatile User Data Storage
Manufacturing and Board Information
Board Statistics
BIOS Setup Data Backup
Power Loss Control
I²C bus (fast mode, 400 kHz, multi-master)
BIOSAMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
OptionsThe conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
Power ManagementACPI 4.0 with battery support

General

Expansion8x PCI Express™ gen. 3.0 lanes
1x PEG x16 Gen 3
Electrical12V DC ± 5%
Refer to manual for detailed power consumption figures
Mechanical125 x 95 mm
Conformal CoatingOn request
SoftwareMicrosoft® Windows 10
Microsoft® Windows 8.1
Microsoft® Windows 7
Linux |
Microsoft® Windows embedded Standard
TemperatureOperation (standard): 0 to 60°C
Non-operation: -20 to 80deg;C
HumidityOperating: 10 - 90% r. H. non-cond
Storage: 5 - 95% r. H. non-cond
Warranty2 Years
RoHSCompliant

Ordering Details

Board045900
conga-TS170/i7-6820EQ
COM Express Type 6 Basic module with Intel® Core™ i7-6820EQ quad core processor with 2.8GHz up to 3.5GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170

045901
conga-TS170/i7-6822EQ
COM Express Type 6 Basic module with Intel® Core™ i7-6822EQ quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170

045902
conga-TS170/i5-6440EQ
COM Express Type 6 Basic module with Intel® Core™ i5-6440EQ quad core processor with 2.7GHz up to 3.4GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170

045903
conga-TS170/i5-6442EQ
COM Express Type 6 Basic module with Intel® Core™ i5-6442EQ quad core processor with 1.9GHz up to 2.7GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170

045904
conga-TS170/i3-6100E
COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170

045905
conga-TS170/i3-6102E
COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170

045906
conga-TS170/E3-1505MV5
COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support

045907
conga-TS170/E3-1505LV5
COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V5 quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support

045908
conga-TS170/i3-6100E ECC COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support

045909
conga-TS170/i3-6102E ECC
COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support

045910
conga-TS170/G3900E
COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3900E dual core processor with 2.4GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Chipset HM170

045911
conga-TS170/G3902E
COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3902E dual core processor with 1.6GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Chipset HM170

045912
conga-TS170/E3-1515MV5
COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support

045913
conga-TS170/E3-1578LV5
COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1578L V5 quad core processor with 2.0GHz up to 3.4GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support

045914
conga-TS170/E3-1558LV5 COM Express Type 6 Basic module with Skylake-H Intel Xeon® E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT3e graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support
Accessories045930
conga-TS170/CSA-HP-B
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

045931
conga-TS170/CSA-HP-T
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

045932
conga-TS170/CSP-HP-B
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.

045933
conga-TS170/CSP-HP-T
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.

045934
conga-TS170/HSP-HP-B
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

045935
conga-TS170/HSP-HP-T Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.

046450
conga-TS67/HSP-HP-B Standard heatspreader for high performance COM Express modules conga-TS170, conga-TS67 and TS77 with integrated heat pipes. All standoffs are with 2.7mm bore hole

046451
conga-TS67/HSP-HP-T Standard heatspreader for high performance COM Express modules conga-TS170, conga-TS67 and TS77 with integrated heat pipes. All standoffs are M2.5mm thread

065800
conga-TEVAL
Evaluation Carrier Board for COM Express Type 6 Modules.

068790 DDR4-SODIMM-2400 (4GB) DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
068791 DDR4-SODIMM-2400 (8GB) DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
068792 DDR4-SODIMM-2400 (16GB) DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM

068795 DDR4-SODIMM-2400 ECC (4GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 4GB RAM
068796 DDR4-SODIMM-2400 ECC (8GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 8GB RAM
068797 DDR4-SODIMM-2400 ECC (16GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 16GB RAM

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