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Diamond Point International

Congatec conga-TS175 - COM Express® basic Type 6 with 7th Gen Intel® Core™ CPU

Speeds to 3.00GHz (Quad Core), Up To 32GB DDR4 Memory, SATA RAID, 4k Display support

Introduction

The new conga-TS175 COM Express Basic module is available with two quad-core Intel® Xeon® processors with hyperthreading as well as 5 different Intel® Core™ i7, i5 and i3 processors within a 45 to 25 W TDP envelope. Bandwidth intensive applications will benefit from up to 32 gigabytes of fast dual channel 2400 DDR4 memory – including ECC support option. In regards to visual experience, they feature the new Intel® HD630 graphics supporting up to three independent displays with up to 4k @ 60 Hz via DisplayPort 1.4 and HDMI 2.0 – both with HDCP 2.2, and eDP 1.4 support. Additionally, the modules also offer dual channel LVDS and VGA for legacy displays. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions.

The modules offer all the common I/O interfaces of the Type 6 pinout. Powerful system extensions including Intel® Optane™ memory can be connected via PCI Express Gen 3.0 Lanes. 4x SATA 6G ports with RAID0/1 support are available for conventional storage media. Further I/O interfaces include 1x Gigabit Ethernet with Intel® AMT support, 4x USB 3.0, 8x USB 2.0, HDA, 4x GPIOs, LPC, SPI, I2C Bus, and 2x UART. The modules support the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT as well as all common Linux operating systems. Individual integration support, an extensive range of accessories as well as optional Embedded Design & Manufacturing Services for individual carrierboard and system designs complete the package.

Specification

CPU

CPU SpecIntel® Core™ i7-7820EQ (4 x 3.0 / 3.7 GHz, 8MB Cache, 45W)
Intel® Core™ i5-7440EQ (4 x 2.9 / 3.6 GHz, 6MB Cache, 45W)
Intel® Core™ i5-7442EQ (4 x 2.1 / 2.9 GHz, 6MB Cache, 25W)
Intel® Core™ i3-7100E (2 x 2.9 GHz, 3MB Cache, 35W)
Intel® Core™ i3-7102E (2 x 2.1 GHz, 3MB Cache, 25W)
Intel® Xeon® E3-1505M V6 (4 x 3.0 / 4.0 GHz, 8MB Cache, 45W)
Intel® Xeon® E3-1505L V6 (4 x 2.2 / 3.0 GHz, 8MB Cache, 25W)
ChipsetMobile Intel® 100 Series Chipset
Memory2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support
GraphicsIntel® Gen9 HD Graphics Engine
OpenCL 2.1, OpenGL 5.0 and DirectX12 (for Windows 10) support
Up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.3 |
High-performance hardware MPEG-2 decoding
WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s
HEVC, VP9 and VDENC encoding
LVDS (eDP optional):
• Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface
• VESA and openLDI colour mappings
• Resolutions up to 1920x1200
• Automatic Panel Detection via EDID/EPI
Digital Display Interface (DDI):
• 3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST)
• Resolutions up to 4k | VGA (optional)
NetworkIntel® i219-LM GbE LAN Controller with AMT 11.6 support
Storage4x SATA 6Gb/s
USB4 x USB 3.0 (XHCI)
8 x USB 2.0 (XHCI)
Serial2x serial interface (RX/TX only)
AudioDigital High Definition Audio Interface with support for multiple audio codecs
CommonMulti Stage Watchdog
Non-volatile User Data Storage
Manufacturing and Board Information
Board Statistics
LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master)
Power Loss Control
BIOSAMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
OptionsThe conga-TS175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
Power ManagementACPI 4.0 with battery support

General

Expansion8x PCIe x1
1x PEG x16
Electrical12V DC ± 5%
Refer to manual for detailed power consumption figures
Mechanical125 x 95 mm
Conformal CoatingOn request
SoftwareMicrosoft® Windows 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Linux
Fedora 24
Ubuntu
SuSe
Red Hat Enterprise
Yocto Project v2.2
Chromium 2
Wind River VxWorks
TemperatureOperation (standard): 0 to 60°C
Non-operation: -20 to 80deg;C
HumidityOperating: 10 - 90% r. H. non-cond
Storage: 5 - 95% r. H. non-cond
Warranty2 Years
RoHSCompliant

Ordering Details

Board045950
conga-TS175/i7-7820EQ
COM Express Type 6 Basic module with Intel® Core™ i7-7820EQ quad core processor with 3GHz up to 3.7GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory

045951
conga-TS175/i5-7440EQ
COM Express Type 6 Basic modul Intel® Core™ i5-7440EQ quad core processor with 2.9GHz up to 3.6GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory

045952
conga-TS175/i5-7442EQ
COM Express Type 6 Basic module with Intel® Core™ i5-7442EQ quad core processor with 2.1GHz up to 2.9GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory

045953
conga-TS175/i3-7100E
COM Express Type 6 Basic module with Intel® Core™ i3-7100E dual core processor with 2.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory

045954
conga-TS175/i3-7102E
COM Express Type 6 Basic module with Intel® Core™ i3-7102E dual core processor with 2.1GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory

045955
conga-TS175/E3-1505MV6
COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V6 quad core processor with 3GHz up to 4GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support

045956
conga-TS175/E3-1505LV6
COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V6 quad core processor with 2.2GHz up to 3GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H).
Accessories045930
conga-TS170/CSA-HP-B
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

045931
conga-TS170/CSA-HP-T
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

045932
conga-TS170/CSP-HP-B
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.

045933
conga-TS170/CSP-HP-T
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.

045934
conga-TS170/HSP-HP-B
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

045935
conga-TS170/HSP-HP-T
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.

065800
conga-TEVAL
Evaluation Carrier Board for COM Express Type 6 Modules.

011115
conga-LDVI/EPI
LVDS to DVI converter board for digital flat panels with onboard EEPROM.

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