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Diamond Point International

Kontron COMe-bSC# - COM Express® basic Type 6 with 2nd Gen Intel® Core™ Processors

Speeds to 2.5GHz (Dual/Quad Core), Up To 16GB DDR3 Memory, SATA RAID

Kontron COMe-bSC#  - COM Express® basic Type 2/6
Key Features
COM Express® basic 2nd Gen Intel® Core CPU
2.1GHz (quad) and 2.5GHz (dual) versions
Up to 16GB DDR3-SDRAM
5x PCIe g2 x1, 1x PCIe g2 PEG x16 lanes, PCI
COM.0 Pin-out Type 2 or Type 6
0° to 60°C operation

Introduction

The Kontron COMe-bSC Computer-on-Modules integrate the new monolithic Intel® microarchitecture with a CPU, graphics and ECC memory controller as well as a PCI Express controller all on an energy-efficient 32 nm die. First benchmarks show a performance gain of 205 percent for the CPU (Dhrystone Alu MIPS) and a 170 percent graphics performance improvement (3DMark06) as compared to platforms with the previous Intel® Core™ i7 processor and comparable core speed. Additionally, users benefit from a 20 percent performance/watt ratio improvement on average compared to designs with the previous Intel® Core™ processor architecture. This enables new Computer-On-Module based applications, with an unmatched level of performance, to fit within a tight thermal envelope. Furthermore, with the new Intel® iGFX® Gen6 graphics, 2D and 3D graphics performance, now on par with dedicated graphics cards, is readily available. Applications that are built around the Kontron COMe-bSC will be able to simultaneously utilise two high-quality HD video streams, enabling economic multi-display solutions with one platform supporting several displays. Technologies, like the latest 3D BluRay for infotainment solutions, will also be supported. With PCI Express 2.0, the data transfer rates to external components are doubled as compared to previous solutions.

The Kontron COMe-bSC features up to seven PCI Express lanes and the PCI Express graphics port (PEG) can be split variably into dedicated lanes (x8, x4, x1) to link extra peripheral components resulting in even more flexibility for the overall solution. This makes the new Computer-on-Module an ideal fit for feature-rich, graphics-oriented applications such as Digital-Signage servers running several displays, gaming systems and high-performance medical appliances.

Note: this module was previously known as the ETXexpress-SC.

Specification

CPU

CPU SpecIntel® Core™ i7-2715QE (4x 2.1GHz, 45W)
Intel® Core™ i7-2655LE (2x 2.2GHz, 25W)
Intel® Core™ i7-2610UE (2x 1.5GHz, 17W)
Intel® Core™ i5-2515E (2x 2.5GHz, 35W)
Intel® Core™ i3-2310E (2x 2.1GHz, 35W)
Intel® Core™ i3-2340UE (2x 1.3GHz, 17W)
Intel® Celeron® B810E (2x 1.6GHz, 35W)
Intel® Celeron® 847E (2x 1.1GHz, 17W)
Intel® Celeron® 827E (1x 1.4GHz, 17W)
Intel® Celeron® 807UE (1x 1.0GHz, 10W)
ChipsetIntel® Mobile QM67 (Core™ i3, i5, i7)
Intel® Mobile HM65 (Celeron®)
MemoryUp to 16 GB DDR3 SO-DIMM, Dual Channel with ECC support
800/1066/1333 MHz
GraphicsIntel® iGFX HD3000 (Gen6) integrated: DirectX® 10.1, PS 4.0, OpenGL 3.0, De-/Encoder for MPEG2, VC-1, Blu-ray support (3D), HDCP 1.4, Dual Independent Display Support
Type 2:
• 1x DisplayPort/embedded DP/SDVO/HDMI/DVI multiplexed with PEG,
• 1x CRT up to QXGA (2048x1536),
• 1x Dual Channel LVDS 18/24 bit up to UXGA (1600x1200)

Type 6:
• 1x DDI: SDVO/DisplayPort/HDMI/DVI,
• 1x DDI: DisplayPort/embedded DP/HDMI/DVI,
• 1x DDI: DisplayPort/HDMI/DVI,
• 1x CRT up to QXGA (2048x1536),
• 1x Dual Channel LVDS 18/24 bit up to UXGA (1600x1200)
Network10/100/1000 MBit Ethernet, Intel® 82579
StorageType 2: 2x SATA with 6 Gb/s, 2x SATA with 3 Gb/s, 1x PATA
Type 6: 2x SATA with 6 Gb/s, 2x SATA with 3 Gb/s
ExpansionType 2 module:
• 5x PCI Express gen2 x1, 1x PEG gen2 x16
• PCI 2.3, 32 bit / 33 MHz PCI bus

Type 6 module:
• 7x PCI Express gen2 x1, 1x PEG gen2 x16
• No PCI
USBType 2: 8x USB 2.0 (UHCI/EHCI)
Type 6: 2x USB 3.0 (xHCI) and 6x USB 2.0 (UHCI/EHCI) or alternatively 8x USB 2.0 (UHCI/EHCI)
Serial2x serial interface (RX/TX only) on Type 6
AudioIntel® High Definition Audio
CommonSPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS
POSCAP capacitors
Trusted Platfom Module TPM 1.2
PEG/DDI sharing on Type 2
BIOSAMI Aptio UEFI
Options1x PCIe x1 additional w/o onboard LAN
vPRO (AMT/TXT/AES Support - on request only)
Power ManagementACPI 4.0, S5 Eco

General

Electrical8.5V – 20V Wide Range, Single Supply Power
Maximum Power Consumption of the different COMe-bHL6 variants is 17 - 48W (100% CPU load on all cores; 90°C CPU temp)
Mechanical125 x 95 mm
SoftwareWindows® 8, Windows® 7, WES7, WinXP, XPe, Linux, VxWorks
TemperatureOperation (standard): 0° to 60°C
Operation (extended): -25° to 75°C
Operation (industrial): -40° to 85°C
Storage: (standard, extended): -30° to 85°C
Storage: (industrial): -40° to 85°C
HumidityOperation: 10% to 90%, storage: 5% to 95% (non condensing)
ShockThe COM Express® basic form factor Computer-on-Modules successfully passed shock and vibration tests according to
IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
MTBF225998 hours (25.8 years) @ 40°C (w/PCB, Telcordia Issue 2 Method 1 Case 3)
453913 hours (51.8 years) @ 40°C (wo/PCB, Telcordia Issue 2 Method 1 Case 3)
EMCValidated in Kontron reference housing for EMC the COMe-bHL6 follows the requirements for electromagnetic compatibility standards: EN55022
Warranty2 Years
RoHSCompliant

Ordering Details

UpdateNovember 2015 - Kontron have notified us that they have 30+ 38013-0000-13-2 (COMe-bSC2 Intel® Core™ i3-2340UE 2x1.30GHz) in stock, ready to ship
BoardCOMe-bSC2 COM Express® Pin-out Type 2
38013-0000-21-4
COMe-bSC2 Intel® Core™ i7-2715QE 4x2.10GHz, QM67, 2x DDR3 ECC, PEG/3xDDI

38013-0000-22-2
COMe-bSC2 Intel® Core™ i7-2655LE 2x2.20GHz, QM67, 2x DDR3 ECC, PEG/3xDDI

38013-0000-15-2
COMe-bSC2 Intel® Core™ i7-2610UE 2x1.50GHz, QM67, 2x DDR3 ECC, PEG/3xDDI

38013-0000-25-2
COMe-bSC2 Intel® Core™ i5-2515E 2x2.50GHz, QM67, 2x DDR3 ECC, PEG/3xDDI

38013-0000-21-2
COMe-bSC2 Intel® Core™ i3-2310E 2x2.10GHz, QM67, 2x DDR3 ECC, PEG/3xDDI

38013-0000-13-2
COMe-bSC2 Intel® Core™ i3-2340UE 2x1.30GHz, QM67, 2x DDR3 ECC, PEG/3xDDI

38013-0000-16-1
COMe-bSC2 Intel® Celeron® B810E 2x1.60GHz, HM65, 2x DDR3 ECC

38013-0000-13-2
COMe-bSC2 Intel® Core™ i3-2340UE 2x1.30GHz, QM67, 2x DDR3, PEG/3xDDI

38013-0000-11-1
COMe-bSC2 Intel® Celeron® 847E 2x1.10GHz, HM65, 2x DDR3, PEG/3xDDI

38013-0000-14-0
COMe-bSC2 Intel® Celeron® 827E 1x1.40GHz, HM65, 2x DDR3 ECC, PEG/3xDDI

38013-0000-10-0
COMe-bSC2 Intel® Celeron® 807UE 1x1.00GHz, HM65, 1x DDR3 ECC, 3xDDI, no PEG


COMe-bSC6 COM Express® Pin-out Type 6
38014-0000-21-4
COMe-bSC6 Intel® Core™ i7-2715QE 4x2.10GHz, QM67, 2x DDR3 ECC, PEG/3xDDI, 2xUSB 3.0

38014-0000-22-2
COMe-bSC6 Intel® Core™ i7-2655LE 2x2.20GHz, QM67, 2x DDR3 ECC, PEG/3xDDI, 2xUSB 3.0

38014-0000-25-2
COMe-bSC6 Intel® Core™ i5-2515E 2x2.10GHz, QM67, 2x DDR3 ECC, PEG/3xDDI, 2xUSB 3.0

38014-0000-21-2
COMe-bSC6 Intel® Core™ i3-2310E 2x2.10GHz, QM67, 2x DDR3 ECC, PEG/3xDDI, 2xUSB 3.0

38014-0000-15-2
COMe-bSC6 Intel® Core™ i7-2610UE 2x1.50GHz, QM67, 2x DDR3 ECC, PEG/3xDDI, 2xUSB 3.0

38014-0000-13-2
COMe-bSC6 Intel® Core™ i3-2340UE 2x1.30GHz, QM67, 2x DDR3 ECC, PEG/3xDDI, 2xUSB 3.0

38014-0000-16-1
COMe-bSC6 Intel® Celeron® B810E 2x1.60GHz, HM65, 2x DDR3 ECC,PEG/3xDDI

38014-0000-11-1
COMe-bSC6 Intel® Celeron® 847E 2x1.10GHz, HM65, 2x DDR3 ECC, PEG/3xDDI

The COMe-bSC# modules come without a heatspreader (see accessories)

Please note that boards are supplied with no cables, software or manuals.
Software/manuals are available electronically.
Accessories38013-0000-99-0 Heatspreader for COMe-bSC# and COMe-bIP#, threaded mounting holes
38013-0000-99-1 Heatspreader for COMe-bSC# and COMe-bIP#, through holes
38013-0000-99-0C05 Active cooling solution for COMe-bSC# and COMe-bIP#, threaded mounting holes
38013-0000-99-0C06 Passive cooling solution for COMe-bSC# and COMe-bIP#, threaded mounting holes

97015-1024-10-0 DDR3-SODIMM-1GB - DDR3 SDRAM SODIMM memory module with 1GB 0° to 60°C
97015-2048-10-0 DDR3-SODIMM-2GB - DDR3 SDRAM SODIMM memory module with 2GB 0° to 60°C
97015-4096-10-0 DDR3-SODIMM-4GB - DDR3 SDRAM SODIMM memory module with 4GB 0° to 60°C

97016-1024-13-0 DDR3-SODIMM-1GB - DDR3 SDRAM SODIMM ECC memory module with 1GB 0° to 60°C
97016-2048-13-0 DDR3-SODIMM-2GB - DDR3 SDRAM SODIMM ECC memory module with 2GB 0° to 60°C
97016-4096-13-0 DDR3-SODIMM-4GB - DDR3 SDRAM SODIMM ECC memory module with 4GB 0° to 60°C

38017-0000-00-5 COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions
38017-0000-00-0 COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions
38017-0100-00-5 COM Express® Mounting Kit 5mm 100sets
38017-0100-00-0 COM Express® Mounting Kit 8mm 100sets

38110-0072-05-0 COM Express® Connector Baseboard 5mm 2x220 pin 72 pcs
38110-0054-08-0 COM Express® Connector Baseboard 5mm 2x220 pin 54 pcs

38106-0000-00-0 COM Express® Eval Carrier Type 6
38114-0000-00-0 COM Express® Ref Carrier Type 6
38106-0000-00-S COM Express® Evaluation Starter Kit Type 6
38114-0000-00-S COM Express® Reference Starter Kit Type 6

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