The new conga-TC175 COM Express Basic module is available with a range of different Intel® Core™ i7, i5, i3 and Celeron processors all with a 15W TDP dissipation. Bandwidth intensive applications will benefit from up to 32-gigabyte dual-channel channel 2133 DDR4 memory. In regards to graphical experience, they feature the latest generation Intel® HD graphics supporting up to three independent displays with up to 4k @ 60 Hz via DisplayPort 1.4 and HDMI 2.0 – both with HDCP 2.2, and eDP 1.4 support. Additionally, the modules also offer dual channel LVDS and VGA for legacy displays. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions.
The modules offer all the common I/O interfaces of the Type 6 pinout including 4x SATA 6G ports with RAID0/1 support Further I/O interfaces include 1x Gigabit Ethernet with Intel® AMT support, 4x USB 3.0, 8x USB 2.0, HDA, LPC, I2C Bus, and 2x UART. The modules support the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT as well as all common Linux operating systems. Individual integration support, an extensive range of accessories as well as optional Embedded Design & Manufacturing Services for individual carrierboard and system designs complete the package.
|CPU Spec||Intel® Core™ i7-7600U (2 x 2.8 / 3.9 GHz, 4MB Cache, 15W)|
Intel® Core™ i5-7300U (2 x 2.6 / 3.5 GHz, 3MB Cache, 15W)
Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB Cache, 15W)
Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB Cache, 15W)
|Memory||2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32 GByte dual channel|
|Graphics||Intel® Gen9 HD Graphics Engine |
OpenCL 2.1, OpenGL 5.0 and DirectX12 (for Windows 10) support
Up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.3 |
High-performance hardware MPEG-2 decoding
WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s
HEVC, VP9 and VDENC encoding
LVDS (eDP optional):
• Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface
• VESA and openLDI colour mappings
• Resolutions up to 1920x1200
• Automatic Panel Detection via EDID/EPI
Digital Display Interface (DDI):
• 3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST)
• Resolutions up to 4k | VGA (optional)
|Network||Intel® i219-LM GbE LAN Controller with AMT 11.6 support|
|Storage||3 x Serial ATA® Gen 3 (can be configured as RAID)|
|USB||4 x USB 3.0 (XHCI)|
8 x USB 2.0 (XHCI)
|Serial||2x serial interface (RX/TX only)|
|Audio||Digital High Definition Audio Interface with support for multiple audio codecs|
|Common||Multi Stage Watchdog|
Non-volatile User Data Storage
Manufacturing and Board Information
LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master)
Power Loss Control
|BIOS||AMI AptioV® UEFI 2.x firmware|
8/16 MByte serial SPI firmware flash
|Options||The conga-TC175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e-commerce will benefit also with improved authentication, integrity and confidence levels.|
|Power Management||ACPI 4.0 with battery support|
|Expansion||8x PCIe x1 gen 3|
1x PEG x16 gen 3
|Electrical||12V DC ± 5%|
Refer to manual for detailed power consumption figures
|Mechanical||95 x 95 mm|
|Conformal Coating||On request|
|Software||Microsoft® Windows 10 (64bit only)|
Red Hat Enterprise
Yocto Project v2.2
Wind River VxWorks
Microsoft® Windows 10 IoT Enterprise (64bit only)
|Temperature||Operation (standard): 0 to 60°C|
Non-operation: -20 to 80deg;C
|Humidity||Operating: 10 - 90% r. H. non-cond|
Storage: 5 - 95% r. H. non-cond
COM Express Type 6 Compact module with Intel® Core™ i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
COM Express Type 6 Compact module with Intel® Core™ i5-7300U dual core processor with 2.6GHz up to 3.5GHz, 3MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
COM Express Type 6 Compact module with Intel® Core™ i3-7100U dual core processor with 2.4GHz, 3MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
COM Express Type 6 Compact module with Intel® Celeron® 3955U dual core processor with 2.2GHz, 2MB Intel® Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
Standard passive cooling solution for COM Express modules conga-TC87, TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for COM Express modules conga-TC87, TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard heatspreader for COM Express modules conga-TC87, TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM Express modules conga-TC87, TC97 , TC170 and TC175.All standoffs are M 2.5 threaded.
Standard active cooling solution for COM Express Compact modules conga-TC87, TC97 , TC170 and TC175 with 70mm radial FAN. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for COM Express module conga-TC87, TC97 and TC175 with 70mm radial FAN. All stand-offs are M2.5 threaded.
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