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Diamond Point International

Kontron CP6004-RA_RC - 6U CompactPCI® Intel® Core™ 3rd Gen CPU Board

Up to 16 GB DDR3 ECC SDRAM, up to -40 to +70°C Operation

Kontron CP6004-RA_RC - 6U cPCI® Intel Core 3rd Gen CPU
Key Features
64-bit 4HP CompactPCI® system slot
Intel® Core™ i7, 3rd generation
Up to 16GB SODIMM DDR3 with ECC
HDD and onboard flash options
4 SATA interface via rear I/O, DP, USB
2 UARTs, 6x Gb Ethernet, 1 PMC/XMC slot
Up to -40 to +70°C fanless operation

Introduction

The CP6004-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.

Based on the Intel® Core™ i7 third generation processor and the QM77 platform controller hub, the CP6004-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.

The CP6004-RA version is designed for harsh application requirements in air-cooled environments, where the CP6004-RC is made for conduction cooled environments.

With the 2.1 GHz Intel® Core™ i7-3612QE and the LV 2.5 GHz Intel® Core™i7-3555LE, the CP6004-RA/RC has extraordinary performance per watt values. Up to 16 GByte of soldered DDR3 1600 MHz memory with ECC provide the foundation of demanding software applications.

Based on the Intel® Mobile QM77 I/O controller hub the CP6004-RA/RC provides high graphics performance for VGA and two independent digital video outputs to the rear I/O as well as HDA audio capabilities.

Besides the outstanding graphics performance, the CP6004-RA/RC offers comprehensive I/O capability with up to 5x 1Gb Ethernet, 4 x rear I/O SATA with RAID 0/1/5/10 functionality, a local SATA Flash disk connector, as well as 6x USB 2.0, 2 x COM.

It can also accommodate a conduction cooled PMC/XMC slot for I/O intensive applications. The board provides safety and security via an optional trusted platform module, (TPM 1.2), two redundant firmware hubs (failover) and IPMI support according PICMG 2.9 R1.0.

Specification

CPU

CPU SpecIntel® Core™ i7 Processor Third Generation (22 nm manufacturing process)
Intel® Core™ i7-3612QE (quad core) or Intel® Core™ i7-3555LE (dual core) low voltage processor
ChipsetMobile Intel® QM77 Platform Controller Hub
MemoryUp to 16GB soldered dual channel DDR3 memory with ECC and data speed of up to 1600 MHz per channel
GraphicsIntel® HD Graphics 4000 integrated
Front: Displayport connector (adapters for VGA available, on CP6004-RA version only)
Rear: 1x VGA, 2x DVI/HDMI
NetworkCP6004-RC: 4 ports 10/100/1000BASE-T to rear I/O
CP6004-RA: 2 ports according PICMG2.16, 3 ports front I/O; 2 of them switchable to rear I/O
StorageNAND Flash: Socket for optional Kontron Solid State Drive up to 64GB SLC flash technology
SATA:
• Four ports fixed to rear I/O
• One port routed to a standard SATA connector
• One port available for mounting an optional 2.5" HDD
USBFront: 2x USB2.0 interface (on CP6004-RA version only)
Read: 4x USB2.0 interface
SerialFront: 1x RS232 serial interface (on CP6004-RA version only)
Rear: 2x RS232 serial interface
Front I/O3x Gigabit Ethernet channel, 2 switchable to rear I/O*
2x USB2.0 interface
1x RS232 serial interface
Displayport connector (adapters for VGA available)
Rear I/OJ3: 2x ETH acc. PICMG 2.16, 2x ETH, VGA, COM 1/2, 4x USB, GPIO, Speaker, fan sense
J4: PMC rear I/O
J5: 4x SATA, 2xHDMI, HDA, battery, fan control, additional GPIO
AudioHD audio on rear I/O
OtherWatchdog, software confi gurable, 125 msec to 256 sec, generates IRQ or hardware reset. Hardware monitor for thermal control, fan speed, and all onboard voltages RTC battery backup
IPMI 1.5-compliant for IPMI based management and CompactPCI® System Management PICMG 2.9 R1.0
CommonLAN boot support
Board identification number accessible via EEPROM
BIOSAMI EFI (BIOS) with POST codes, setup console redirection to serial port (VT100 mode) with CMOS setup access.
BIOS parameters saved in EEPROM, diskless, keyboardless, videoless operation.

General

ExpansionPICMG 2.0 Rev. 3.0 compatible, 64-bit / 66 MHz Universal V(I/O) 5V or 3.3V signaling
Operating in system slot as system master and in peripheral slot in PCI passive mode (no communication to CompactPCI® bus)

CompactPCI® Core Specification PICMG 2.0 Rev. 3.0
CompactPCI® Hot Swap Specification PICMG 2.1 R2.0
CompactPCI® System Management PICMG 2.9 R1.0
CompactPCI® Packet Switching Backplane PICMG 2.16 R1.0

One 64-bit / 133 MHz conduction cooled PMC slot, Pn1-Pn4, rear I/O Pn3 to J4, 3.3 volt V(I/O)
Alternatively one conduction cooled XMC slot via P15, supporting XMC.3 x8 PCIExpress
ElectricalMaximum: up to 60 watts (quad-core), 40 watts (dual-core)
Mechanical233 x 160 x 20.5 mm, 6U, 4HP
Conformal CoatingCoating standard for CP6003-RC; on request for CP6004-RA
SoftwareSupport for Windows® 7, XP, XP Embedded, Windows® Server 2008R2, Linux®, VxWorks®
TemperatureTemperature range CP6004-RA (operation):
• Quad-Core: VITA 47 V2/OS1, -40 to +70°C, forced air cooling required
• Dual-Core LV: VITA 47 V2/OS1 -40 to +70°C, forced air cooling required
Temperature range CP6004-RC (operation):
• Quad-Core: VITA 47 V3/OS2 -40 to +70°C
• Dual-Core LV: VITA 47 V3/OS2 -40 to +70°C
Temperature range (storage): -55 to +85°C (without battery or HDD)
Humidity93% RH at 40°C, non condensing (acc. to IEC 60068-2-78)
WeightApprox. 800gr
Altitude50,000 ft (15,240 m)
MTBFCP6004R 156125 h MIL-HDBK-217 FN2 Ground Benign 30°C
CP6004R 82762 h Bellcore Issue 6 Ground Benign 30°C
Safety/CertificationUL 1950, UL 94, CSA 22.2 No 950, EN 60950, IEC 950
EMCEN 55022 / EN 55024, EN 50081-1 / EN 6100-6-2
Warranty2 Years
RoHSCompliant

Ordering Details

BoardCP6004-RA-2.1Q-8-E1X
• Quad-Core 2.1 GHz, Core i7-3612QE
• 8GB soldered dual channel DDR3 memory 1600 MHz with ECC
• Temperature range -40°C to +70°C
• Rugged air cooled

CP6004-RA-2.5D-8-E1X
• Dual-Core 2.5 GHz, Core i7-3555LE
• 8GB soldered dual channel DDR3 memory 1600 MHz with ECC
• Temperature range -40°C to +70°C
• Rugged air cooled

CP6004-RC-2.1Q-16-E1X-C
• Quad-Core 2.1 GHz, Core i7-3612QE
• 16GB soldered dual channel DDR3 memory 1600 MHz with ECC
• Temperature range -40°C to +70°C
• Rugged conduction cooled, conformal coating

CP6004-RC-2.5D-8-E1X-C
• Dual-Core 2.5 GHz, Core i7-3555LE
• 8GB soldered dual channel DDR3 memory 1600 MHz with ECC
• Temperature range -40°C to +70°C
• Rugged conduction cooled, conformal coating

All: Extended temperature versions on request.
AccessoriesRefer to datasheet

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