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Diamond Point International

MEN Mikro F50P - 3U cPCI/CompactPCI® PowerPC® MPC8548 SBC

Up to 2 GB DDR SDRAM, -40 to +70°C Operation

Introduction

The F50P is a versatile, rugged PowerPC® based single-board computer for embedded applications. It is controlled by an MPC8548, or optionally an MPC8543 PowerPC® processor (alternatively with encryption unit) with clock frequencies between 800 MHz and 1.5 GHz. The SBC is equipped with ECC-controlled, soldered-on DDR2 RAM for data storage, with up to 16 GB of solid-state Flash disk for program storage as well as industrial FRAM and SRAM.

The CPU card provides up to three Gigabit Ethernet channels, six USB ports, up to two SATA interfaces and up to 64 user-definable I/O lines controlled by an optional onboard FPGA. These interfaces can be combined in many variations and are available at the front or at the rear using the board's J2 connector. The J2 pin assignment and connector type are in compliance with the PICMG 2.30 CompactPCI® PlusIO standard - the migration path towards CompactPCI® Serial. Two USB and two RJ45 Ethernet connectors are already provided at the front panel, and space is left for an optional VGA connector.

The large FPGA on the F50P allows to add additional user-defined functions such as graphics, touch, serial interfaces, fieldbus controllers, binary I/O etc. for the needs of the individual application in an extremely flexible way. Before boot-up of the system, the FPGA is loaded from boot Flash. Updates of the FPGA contents can be made inside the boot Flash during operation. If the FPGA is assembled, the card needs an extra 4 HP in front panel space.

Equipped with a PCI-bridge chip, the F50P offers a full CompactPCI® interface (system slot functionality) for reliable system expansion. Apart from that, the F50P can also be used as a busless, stand-alone board, with power supply from the backplane.

Being designed for operation in a conduction or convection cooled environment, the F50P provides flexibility also in its cooling concept. Its firmly plugged-on CPU module is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling for the F50C model, which is also available by standard. For air cooling, the F50P version comes with a tailor-made heat sink on top of the cover, requiring an 8-HP front panel, for an extended temperature range of -40 to +70°C. The soldered components on the F50P withstand shock and vibration, and the board design is optimized for conformal coating.

The F50P comes with MENMON support. This firmware/BIOS can be used for bootstrapping operating systems (from disk, Flash or network), for hardware testing, or for debugging applications without running any operating system.

Specification

CPU

CPU SpecPowerPC® PowerQUICC™ III MPC8548, MPC8548E, MPC8543 or MPC8543E
• 800MHz up to 1.5GHz
• 2x32KB L1 data and instruction cache, 512KB/256KB L2 cache integrated in MPC8548/MPC8543
• e500 PowerPC® core with MMU and double-precision embedded scalar and vector floating-point APU
ChipsetIntegrated Northbridge and Southbridge
MemoryUp to 2GB SDRAM system memory
• Soldered
• DDR2 with or without ECC
• Up to 300 MHz memory bus frequency, depending on CPU

Up to 16GB soldered Flash disk (SSD solid state disk)

Up to 32MB additional DDR2 SDRAM, FPGA-controlled, e.g. for video data

16MB boot Flash

2MB non-volatile SRAM
• With GoldCap backup

128KB non-volatile FRAM

Serial EEPROM 4kbits for factory settings
NetworkEthernet
• Up to three 10/100/1000Base-T Ethernet channels with MPC8548/E (two channels with MPC8543/E)
• Two RJ45 connectors at front panel
• Two front-panel LEDs for channels for LAN link, activity status and connection speed
• All three possible also via rear I/O J2 (Note: requires additional Ethernet transformers on rear I/O board or backplane.)
StorageParallel IDE (PATA)
• Up to 16GB soldered ATA Flash disk (SSD solid state disk)

Serial ATA (SATA)
• Up to two ports via rear I/O J2
• Transfer rates up to 150MB/s (1.5 Gbit/s)
• Via PCI-to-SATA bridge
ExpansionCompliance with CompactPCI® Core Specification PICMG 2.0 R3.0
System slot
32-bit/32-MHz PCIe®-to-PCI bridge
V(I/O): +3.3V (+5V tolerant)
USBUSB (host)
• Five USB 2.0 host ports
• One series A connector at front panel
• Four ports via rear I/O J2
• OHCI and EHCI implementation
• Data rates up to 480 Mbit/s

USB (client)
• One USB client port on series A connector at front panel
• Via UART-to-USB converter
• Data rates up to 115.2 kbit/s
• 16-byte transmit/receive buffer
• Handshake lines: none
Front I/OOne USB 2.0 host (Series A)
One USB client (Series A)
Two Ethernet (RJ45)
Rear I/OFour USB 2.0
Up to three 1000Base-T Ethernet
Up to two SATA
Up to 64 I/O lines, FPGA-controlled
• Reduces Ethernet/SATA interfaces

Standard version compatible with PICMG 2.30 CompactPCI® PlusIO
• Two SATA
• Four USB 2.0
• 1PCI33/0PCIE/2SATA1.5/4USB2/0ETH
OtherThe FPGA offers the possibility to add customized I/O functionality
Standard: FPGA not assembled

Board can be supplied with +5V, +3.3V and +12V from backplane, all other voltages are generated on the board
• Backplane J1 connector used only for power supply
CommonReal-time clock with GoldCap backup
Temperature sensor, power supervision and watchdog
Status LED at the front
Reset button
BIOSMENMON

General

ElectricalSupply voltage/power consumption:
• +5V (-3%/+5%), 800mA approx.
• +3.3V (-3%/+5%), 350mA approx.
• ±12V (-5%/+5%), 1A approx.
MechanicalDimensions: conforming to CompactPCI® specification for 3U boards

Front panel:
• 8 HP without FPGA
• 12 HP with FPGA
Conformal Coatingon request
SoftwareLinux
VxWorks®
QNX® (on request; support of the FPU is currently not provided by QNX®)
INTEGRITY® (Green Hills® Software) support available. Please contact Green Hills® for further information.
OS-9® (on request)
TemperatureTemperature range (operation):
• -40..+70°C (screened)
• 0..+60°C (screened, with 16 GB SSD Flash disk)
• Airflow: min. 1.0 m/s
Conduction cooled variety F50C also available
Temperature range (storage): -40..+85°C
HumidityRelative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Weight626g
Vibration1 g, 10..150 Hz
ShockShock: 15g/11ms
Bump: 10g/16ms
MTBF162,822 h @ 40°C according to IEC/TR 62380 (RDF 2000)
Safety/CertificationPCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMCTested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)
Warranty2 Years
RoHSCompliant

Ordering Details

Board02F050P00
F50P, MPC8548, 1.33 GHz, 2 GB SSD Flash, 512 MB DDR2 RAM, 2 MB SRAM, 128 KB FRAM, front I/O and PICMG 2.30 rear I/O (2 SATA, 4 USB), 8 HP, no FPGA, -40..+70°C screened
AccessoriesN/A

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