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Diamond Point International

MEN Mikro F19P - 3U CompactPCI® PlusIO Intel® Core™ 2 Duo CPU Board

Up to 4 GB DDR3 SDRAM, -40 to +85°C Operation

MEN Mikro F19P - 3U cPCI® PlusIO Intel Core 2 Duo Card
Key Features
3U, Intel® Core™ 2 Duo SP9300, 2.26 GHz
CompactPCI® 2.0 or CompactPCI® PlusIO 2.30
Dual-core 64-bit processor
32-bit 4HP system master (or stand-alone)
Up to 4 GB DDR3 DRAM soldered
CompactFlash® and microSD™ card slots
Up to -40 to +85°C operation, screened

Introduction

The F19P versatile 4HP/3U single-board computer is a continuation of MEN's proven range of Intel® CPU boards. It is equipped with the Intel® Core™ 2 Duo processor SP9300 running at 2.26 GHz and offering multi-core processor architecture from Intel® with full 64-bit support. The CPU card delivers an excellent graphics performance and is designed especially for embedded systems which require high computing performance with low power consumption.

The F19P offers a 32-bit/33-MHz CompactPCI® bus interface and can also be used without a bus system. It offers 4 USB 2.0 and 4 fast (3Gb/s) SATA interfaces as well as 4 PCI Express® x1 links and one Gigabit Ethernet on the J2 rear I/O connector which is compatible with the PICMG 2.30 CompactPCI® PlusIO specification.

A total of seven PCI Express® lanes for high-speed communication (such as Gigabit Ethernet) are supported on the F19P. 3 x1 PCIe® links are used for the three onboard Ethernet interfaces. 4 x1 PCIe® links are available via rear I/O or on a specific side card.

The F19P is equipped with a fast DDR3 DRAM which is soldered to the F19P to guarantee optimum shock and vibration resistance. A robust CompactFlash® and microSD™ card device which are connected via a USB interface offer nearly unlimited space for user applications.

The standard I/O available at the front panel of F19P includes graphics on a VGA connector, two PCIe®-driven Gigabit Ethernet as well as two USB 2.0 ports.

The F19P can be extended by different side cards. Additional functions include two digital video interfaces for flat panel connection via DVI (multimedia), a variety of different UARTs or another four USBs, SATA for hard disk connection and HD audio.

Thermal supervision of the processor and a watchdog for the operating system complete the functionality of the F19P.

The F19P operates in Windows® and Linux environments as well as under real-time operating systems that support Intel®'s multi-core architecture. The InsydeH2O™ EFI BIOS was specially designed for embedded system applications.

Equipped with Intel® components exclusively from the Intel® Embedded Line, the F19P has a guaranteed minimum standard availability of 7 years.

The F19P is suited for a wide range of industrial applications, e.g. for monitoring, vision and control systems as well as test and measurement.

The F19P comes with a tailored passive heat sink within 4 HP height. The robust design of the F19P make the board especially suited for use in rugged environments with regard to shock and vibration according to applicable DIN, EN or IEC industry standards. The F19P is also ready for coating so that it can be used in humid and dusty environments.

Specification

CPU

CPU SpecIntel® Core™ 2 Duo SP9300
• Up to 2.26 GHz processor core frequency
• 1066 MHz system bus frequency
• Up to 6 MB L2 cache integrated in Core 2 Duo

Intel® Celeron® M Processor ULV 722
• 1.2 GHz processor core frequency
• 800 MHz system bus frequency
• Up to 1 MB L2 cache integrated
ChipsetNorthbridge: Intel® GS45
Southbridge: Intel® ICH9M-SFF
MemoryUp to 4 GB DDR3 SDRAM system memory
• Soldered
• 800/1067 MHz memory bus frequency locked to the FSB frequency
16 Mbits boot Flash
Serial EEPROM 2kbits for factory settings
GraphicsIntegrated in GS45 chipset
• Up to 533 MHz graphics core
• Maximum resolution: 2048 x 1536 pixels

VGA connector at front panel

Two SDVO ports available via side-card connector
• Two additional DVI connectors at front panel optional via side card
• Simultaneous connection of two monitors
NetworkEthernet
• Two 10/100/1000Base-T Ethernet channels at the front
• RJ45 connectors at front panel
• Ethernet controllers are connected by two x1 PCIe® links from ICH9M
• Onboard LEDs to signal activity status and connection speed
• One 10/100/1000Base-T Ethernet channel via rear I/O
• Ethernet controller is connected by one x1 PCIe® link from GS45
StorageSerial ATA (SATA)
• Four channels via rear I/O, one channel via side-card connector (switchable)
• Transfer rates up to 3 Gbit/s
• RAID level 0/1 support

CompactFlash® card interface
• Via USB
• Type I
• True IDE
• DMA support

MicroSD card interface
• Via USB
ExpansionThree x1 links to connect local 1000Base-T Ethernet controllers
• Data rate 250 MB/s in each direction (2.5 Gbit/s per lane)

Four x1 links for extension through side-card connector or rear I/O
• Data rate up to 1 GB/s in each direction (2.5 Gbit/s per lane)

CompactPCI® Bus
• Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
• System slot
• 32-bit/33-MHz CompactPCI® bus
• V(I/O): +3.3 V (+5 V tolerant)
USBUSB
• Two USB 2.0 ports via Series A connectors at front panel
• Four USB 2.0 ports via side-card connector
• Four USB 2.0 ports via rear I/O
• One USB for connection of CompactFlash®/MicroSD or USB NAND Flash
• UHCI implementation
• Data rates up to 480Mbit/s
Front I/O4 PCIe®, 4 USB, 4 SATA, 1 Gb Ethernet
Rear I/O4 PCIe®, 4 USB, 4 SATA, 1 Gb Ethernet
AudioHigh Definition (HD) audio
• Accessible via side-card connector
OtherOther I/O (onboard, side card): SATA, SDVO, HD audio, USB, UART etc.

Busless Operation
• Board can be supplied with +5 V only, all other voltages are generated on the board
• Backplane connectors used only for power supply
CommonReal-time clock buffered by a GoldCap or alternatively a battery (5 years life cycle)
Power supervision and watchdog
Temperature measurement
One status LED from board controller
One FPGA status LED
Six user LEDs (FPGA-controlled)
Reset button
BIOSInsydeH2O™ UEFI Framework

General

ElectricalSupply voltage/power consumption with Celeron® M722 processor:
• +5 V (-3%/+5%), 2.2 A typ., 2.7 A max.
• +3.3 V (-3%/+5%), 1.4 A (2 Gb Ethernet), 1 A (1 Gb Ethernet)
• +12 V (-10%/+10%), approx. 10 mA
• If the board is supplied with 5 V only (typically without a bus connection), the 3.3 V are generated on the board and fed to the backplane (3 A max.)

Supply voltage/power consumption with SP9300 processor:
• +5 V (-3%/+5%), 4.9 A typ., 6.4 A max.
• +3.3 V (-3%/+5%), 1.4 A (2 Gb Ethernet), 1 A (1 Gb Ethernet)
• +12 V (-10%/+10%), approx. 10 mA
• If the board is supplied with 5 V only (typically without a bus connection), the 3.3 V are generated on the board and fed to the backplane (3 A max.)
MechanicalDimensions: conforming to CompactPCI® specification for 3U boards
Front panel: 8HP with ejector
Conformal Coatingon request
SoftwareNote that 64-bit hardware technology can be used in an optimal way with 64-bit operating system support
Windows® (Windows® XP, Windows® 7)
Linux
• tested/verified with: Ubuntu 10.04 (kernel 2.6.32-21) 32-bit and 64-bit versions
• OpenSuse 11.3 32-bit and 64-bit versions
• and: CentOS 5.5 (kernel 2.6.18) 32-bit and 64-bit versions
• Detailed matrix of supported interfaces under Ubuntu 10.04 and OpenSuse 11.3
VxWorks®
QNX®
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems
TemperatureTemperature range (operation):
• Depends on system configuration (CPU, hard disk, heat sink...)
• Maximum: +85°C
• Minimum: -40°C (all processors)
• Conditions: airflow 1.5 m/s, typical power dissipation: 9.8 W (F19P version with Celeron® M722), 13.4 W (F19P version with SP9300 Core 2 Duo) with Windows® XP operating system and 1 Gb Ethernet connection
Temperature range (storage): -40..+85°C
HumidityRelative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Weight430 g
VibrationVibration (function): 1 m/s², 5 Hz - 150 Hz
Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz
ShockShock: 15g/11ms
Bump: 10g/16ms
MTBF552,030h @ 40°C according to IEC/TR 62380 (RDF2000)
Safety/CertificationPCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMCTested according to EN 55022 (radio disturbance), IEC 61000-4-3 (electromagnetic field immunity), IEC 61000-4-4 (burst), IEC 61000-4-5 (surge) and IEC 61000-4-6 (conducted disturbances)
Warranty2 Years
RoHSCompliant

Ordering Details

Board02F019P00
Intel® Celeron® M 722, 1.2 GHz, 2 GB DDR3 DRAM, -40..+85°C screened

02F019P01
Intel® Core™ 2 Duo SP9300, 2.26 GHz, 4 GB DDR3 DRAM, 0..+60°C
AccessoriesN/A

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