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MEN Mikro F75P - 3U CompactPCI® PlusIO Safe Railway Computer

2x Intel® Atom™ E6xx, 512 MB DDR2 RAM (Each) for Onboard Dual Redundancy

MEN Mikro F75P - 3U cPCI PlusIO Safe Railway Computer
Key Features
2x Intel® Atom™ E6xx, 512 MB DDR2 RAM
1x Intel® Atom™ E6xx, 1 GB DDR2 for I/O
Independent supervisors for each block
Fail-safe and fail-silent board architecture
Clustering of two F75P to raise availability
SIL 4 certification packages available
-40 to +85°C qualified, full EN 50155 compliance


The F75P is a COTS safe computer with onboard functional safety that unites three CPUs on one 3U CompactPCI® PlusIO card. It makes Intel® Atom™ E6xx ("E600") performance with dual redundancy extremely compact, mainly targeting railway applications. Two independent Control Processors (CP) with independent DDR2 RAM and Flash and a supervision structure provide safety: with redundant software running on F75P, and, e.g., with the software instances on the two CPs comparing their output, the board becomes a fail-silent subsystem, i.e. it can shut down in case of a fatal fault.

Its I/O Processor (IOP) is built up like a classic CompactPCI® CPU board, including DDR2 RAM, front and rear I/O. The front connectors include VGA, two USB 2.0, and two 100-Mbit (Fast) Ethernet channels. At the rear, the board provides another four USB 2.0, two Fast Ethernet ports, one 3-Gbit SATA and one PCI Express® x1 link. These interfaces comply with the standardized pinout of CompactPCI® PlusIO (PICMG 2.30). An onboard mSATA slot makes for scalable, robust mass storage. The intelligent board management controller of the IOP logs events such as reset, overvoltage or undervoltage in a non-volatile FRAM.

The Control (CP) and I/O Processors (IOP) communicate via internal links provided by an FPGA. The CPs are designed to run a deterministic real-time operating system such as the QNX® Neutrino RTOS Safe Kernel or PikeOS. It is also possible to implement diversitary software on both kernels. All three CPUs support Linux and QNX®.

The F75P can replace multiprocessing systems with CPU redundancy and I/O by a small-footprint, low-power solution that is flexible for different types of application scenarios. It uses a single +5V supply voltage to allow operation with external power supplies that do not generate +3.3 V.

A clustering option is considered as well, to increase system availability: two F75P boards can operate next to each other, and can provide hot or cold stand-by.

F75P-based systems are generally certifiable up to SIL 4. Since the card has no voter of its own, the customer has to add the software that implements and controls functional safety behavior. The safety features such as the CP supervisors are designed to SIL 4 according to EN 50129. A railway certification package including the "safety case" document and a certificate from TÜV SÜD is available.

Its rugged set-up also make the F75P truly rail-ready: with assets like conformal coating and an operating temperature of -40 to +85°C with qualified components, it is fully EN 50155 compliant. A 4-HP version is available with RJ45 Ethernet connectors and a reduced temperature range for system design, while another standard card with 8 HP width provides the necessary space for M12 front connectors and a larger heat sink for -40 to +85°C.



CPU SpecThree onboard processors
• Two Control Processors (CP)
• One I/O Processor (IOP)
• Inter-communication between all three processors via onboard Ethernet or Shared RAM

Three identical processor types
• Intel® Atom™ E6xx Series
• 0.6 GHz to 1.6 GHz processor core frequency
• Please see Standard Configurations and Options below for options and available standard versions.

Main function of CPs
• Provide a "Safe Domain" on the board, including processors, memory, supervisors and power control
• Provide flexible implementation options for functional safety requirements
• Provide support for advanced, certified operating systems up to SIL 4

Main function of IOP
• Provide common I/O and memory facilities
• Provide a user-friendly software interface and GUI
ChipsetIntel® EG20T Platform Controller Hub (PCH)
MemoryMemory (connected to CPs)
512 KB L2 cache integrated in E6xx for each processor
Up to 1 GB SDRAM system memory to each of the Control Processors (CP)
• Soldered
• DDR2
• 800 MHz memory bus frequency (800 MT/s data rate)
2 MB BIOS Flash

Memory (connected to IOP)
512 KB L2 cache integrated in E6xx
Up to 2 GB SDRAM system memory
• Soldered
• DDR2
• 800 MHz memory bus frequency (800 MT/s data rate)
2 MB BIOS Flash
8 KB non-volatile FRAM for event logging
mSATA disk slot
• Connected via one SATA channel
GraphicsGraphics (connected to IOP):
• Integrated in E6xx processor
• 320 or 400 MHz graphics base frequency, depending on processor type
• Maximum resolution: 1280 x 1024 pixels
• VGA connector at front panel
NetworkEthernet (controlled by IOP)
• Four 10/100Base-T Ethernet channels, via Inter-Communication FPGA
• Two channels via RJ45 or M12 connectors at front panel, with status LEDs
• Two channels via rear I/O on CompactPCI® J2
StorageMass Storage (connected to IOP)
Serial ATA (SATA)
• One port for mSATA onboard devices
• One port for rear I/O
• SATA Revision 2.x support
• Transfer rates up to 300 MB/s (3 Gbit/s)
ExpansionPCI Express® (controlled by IOP)
• One PCI Express® x1 link via rear I/O on CompactPCI® J2
• PCIe® 1.0a support
• Data rate up to 250 MB/s in each direction (2.5 Gbit/s per lane)

Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
System slot
32-bit/33-MHz PCI-to-PCI bridge
V(I/O): +3.3 V (+5 V tolerant)
Hot insertion and removal without damage
USBUSB (controlled by IOP)
• Six USB 2.0 host ports
• Two Series A connectors at front panel
• Four ports via rear I/O on CompactPCI® J2
• OHCI and EHCI implementation
• Data rates up to 480 Mbit/s
Front I/OVGA
Two USB 2.0 (Series A)
Two 10/100Base-T Ethernet (RJ45 or M12)
Rear I/OOne SATA (3 Gb)
Four USB 2.0
Two 10/100Base-T Ethernet
One PCI Express® x1 link
Compatible with PICMG 2.30 CompactPCI® PlusIO
• 1PCI33/1PCIE2.5/1SATA3/4USB2/2ETH100
• Some pins are used for signals differing from the PICMG 2.30 specification, e.g., for clustering. However, these signals do not destroy or cause any malfunction of a connected I/O board based on this standard.
OtherEvent Logging
• Event history logged in non-volatile FRAM, e.g., reset, overvoltage, undervoltage, excess temperature
• 256 entries possible
• Events are generated by board hardware or user application

Cluster Link
• Two F75P boards can be connected to form a cluster
• Cluster link interface based on RS422
• Accessible on CompactPCI® J2 rear I/O connector
• Bidirectional, full-duplex, differential interface

Busless Operation
• Board can be supplied with +5 V only, all other voltages are generated on the board
• Backplane connectors used only for power supply
CommonReal-time clock with supercapacitor backup connected to I/O Processor
• Data retention of supercapacitor: 56 hours when fully loaded, after 3 years runtime @ 40°C, 24h operation

Three independent supervisors for Control Processors and Inter-Communication FPGA
• Check for overvoltage, undervoltage, excess temperature, internal errors of FPGA and CPUs, CPU and FPGA clock
• Watchdog

Board Management Controller for I/O Processor
Status LED at front panel
Reset button at front panel


ElectricalSupply voltage/power consumption:
• +5 V (-3%/+5%), 4.5 A typ., 5 A max.
MechanicalDimensions: conforming to CompactPCI® specification for 3U boards
Front panel: 4 HP or 8 HP with ejector
Conformal CoatingAs standard
SoftwareI/O Processor
• Linux (in preparation)
• QNX® (in preparation)
• VxWorks® (on request)

Control Processors
• QNX® (with or without Safe Kernel) (in preparation)
• PikeOS
• Linux (in preparation)
• VxWorks® (on request)
• VxWorks®/Cert (on request)
TemperatureTemperature range (operation):
• -40..+50°C in 4 HP version (qualified components)
• -40..+85°C in 8 HP version (qualified components), compliant with EN 50155, class Tx
• Conditions: airflow 1.5 m/s, typical power dissipation: 22.5 W
Temperature range (storage): -40..+85°C
HumidityRelative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Weight4 HP, RJ45 connectors: 402 g (incl. heat sink)
8 HP, M12 connectors: 626 g (incl. heat sink)
VibrationVibration (function): 1 m/s², 5 Hz - 150 Hz (EN 50155 (12.2.11) / EN 61373)
Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz (EN 50155 (12.2.11) / EN 61373)
ShockShock: 50 m/s², 30 ms (EN 50155 (12.2.11) / EN 61373)
MTBF277 975 h @ 40°C according to IEC/TR 62380 (RDF 2000)
Safety/CertificationFunctional Safety
• Certifiable up to SIL 4 according to EN 50129 ("safety case" document and certificate from TÜV SÜD available)
• Hazard rate for safety functions <= 1E-9 / h
• Control Processors configured for deterministic behavior, e.g., Hyper-Threading disabled, speed-step disabled, BIOS interrupts disabled
• Board maintains safe state after a failure (factory configuration)
EMCWhen integrated into an EMC protected rack
EN 50121-3-2 (tables 5 and 6) / EN 55011 (radio disturbance)
EN 50121-3-2 (table 9) / IEC 61000-4-6 (ESD)
EN 50121-3-2 (table 9) / IEC 61000-4-3 (electromagnetic field immunity)
EN 50121-3-2 (table 8) / IEC 61000-4-4 (burst)
EN 50121-3-2 (table 8) / IEC 61000-4-6 (conducted disturbances)
Warranty2 Years

Ordering Details

3x Intel® Atom™ E680T (1.6 GHz), 2x 512 MB, 1x 1 GB DDR2 DRAM, RJ45 ETH connectors, 4 HP, -40..+50°C with qualified components, conformal coating

3x Intel® Atom™ E680T (1.6 GHz), 2x 512 MB, 1x 1 GB DDR2 DRAM, 8 HP, Ethernet on the right by 2x M12, -40..+85°C with qualified components, conformal coating
CompactPCI® PlusIO rear transition module 3U/80mm, 2 Ethernet, 4 USB, 4 SATA, 4 PCIe® x1, -40°C..+85°C qualified

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