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Men Mikro

Men Mikro D6

6U CompactPCI® Pentium® M Blade Server, Up To 2GHz CPU

Up To 1GB ECC DDR2 Memory, Quad Gigabit LAN, 2 XMC/PMC Slots
 
Men Mikro D6 6U Pentium M cPCI SBC
  
  • Pentium® M up to 2 GHz
  • ULV Celeron® M 1 GHz
  • PCI Express® 4 x4 links, plus 2 x4 (or 1 x8)
  • 4 HP CompactPCI® system slot, 64-bit/66-MHz
  • Hot-swap, PICMG 2.16 support
  • Up to 1 GB DDR2 ECC SDRAM
  • Non-volatile SRAM, FRAM
  • Up to 1 GB Flash-on-disk (NAND), hard disk
  • 2 SATA, 2 PATA interfaces
  • 4 Gigabit Ethernet (PCIe)
  • 3 USB 2.0, 2 COM
  • Individual I/O in FPGA
  • 2 XMC/PMC slots (PCIe)
  • Board Management Control



Datasheet/Manual:

MEN D6 datasheet in PDF format Datasheet in PDF format
Manual available on request Manual available on request

 

Introduction

Equipped with the high-performance Intel® 2-GHz Pentium® M down to the 1-GHz ultra-low voltage Celeron® M processor, the D6 single-board computer is a versatile 4HP/6U (single-slot, double-size Eurocard) CompactPCI® Single-Board Computer, designed especially for embedded systems which require high computing performance. The SBC comes with a tailored passive heat sink within 4HP height - forced air cooling is required inside the CompactPCI® system. The D6 is suited for a wide range of industrial applications, for example networked appliances (base stations, gateways, routers etc.), instrumentation and test or railway signalling equipment. Main target markets comprise telecoms, medical engineering and transportation.

The D6 offers a 64-bit/66-MHz up to PCI-X interface to the CompactPCI® bus. PCI Express® for high-speed communication is supported on board to connect the two Gigabit Ethernet controllers (four x4 links) as well as two XMC modules (2 x4 links or 1 x8 link). A wide range of different memory is available on the D6, such as a maximum of 1 GB DDR2 SDRAM with ECC as main memory (2 GB when components available). The nonvolatile memory comprises up to 8 MB buffered SRAM, 16 KB FRAM and 1 GB NAND Flash as mass storage for program memory. All memory components are soldered to guarantee reliable shock and vibration resistance. A hard disk slot is also implemented within 4HP height. Aside from parallel ATA support, two serial ATA lines are available in addition.

The standard I/O available at the front panel of the D6 includes two XMC or PMC modules, two Gigabit Ethernet and one USB 2.0. If only one XMC module is used, one VGA and one COM are available at the front panel. A frame-buffer interface is provided in the FPGA which can also be used to implement further application-specific I/O functions. An additional 32 MB SDRAM is connected to the FPGA, e.g. for use as graphics memory.

The D6 is also prepared for rear I/O where for example two USB ports, two COMs, IDE, audio AC'97 or the rear I/O signals from the PMC modules can be connected.

A board management controller is implemented to supervise the CPU, all voltages, processor and board temperature, and reset. The controller is completely independent of the CPU and monitors all states of the CPU.

The D6 operates in Windows® and Linux environments as well as under major real-time operating systems such as VxWorks® or QNX®. The Award BIOS was especially designed for embedded system applications. Equipped with Intel® components that come exclusively from the Intel® Embedded Line, the D6 has a guaranteed minimum standard availability of 5 years.
 
 

Specification
CPU:

Celeron® M ULV 373 up to Pentium® M 760
o 1.0 GHz or 1.4 GHz or 2.0 GHz processor core frequency
o 400MHz or 533MHz front-side bus frequency
Chipset
o Northbridge: Intel® MCH E7520 server chip set
o Southbridge: Intel® ICH 6300ESB
o High-end memory controller
Passive heat sink
Memory:

512KB L2 cache integrated in Celeron® M or 2MB L2 cache integrated in Pentium® M
Up to 1GB SDRAM system memory (2GB when components available)
o Soldered
o DDR2 with ECC support
o 400MHz memory bus frequency
o Dual-channel, 2x64 bits
Up to 1GB soldered NAND Flash (and more), FPGA-controlled
Up to 32MB additional SDRAM, FPGA-controlled, e.g. for video data and NAND Flash firmware
Up to 8MB boot Flash
Up to 8MB non-volatile SRAM
o Backed by GoldCap or external battery
Up to 16KB non-volatile serial FRAM
Serial EEPROM 3x2kbit for factory settings
CompactFlash® card interface, optional, instead of XMC/PMC 0
Mass Storage:

Parallel IDE (PATA)
o One port for local hard-disk/CD-ROM, or: one port for local CompactFlash®
o One port for rear I/O
Serial IDE (SATA)
o One port via on-board connector
o One port for rear I/O
o Transfer rates up to 150MB/s
Up to 1GB soldered ATA NAND Flash (and more), FPGA-controlled
Graphics:

FPGA-controlled
o 2D graphics, frame-buffered
o Resolution: VGA up to SXGA (max. 1280 x 1024 pixels)
o Supports BIOS for set-up and control
o Operating system support by means of dedicated drivers
VGA connector at front panel, instead of XMC/PMC 0
Standard VGA graphics with integrated operating system support can be added as needed through an XMC/PMC
I/O:

USB
o One USB 2.0 port at front via Series A connector
o Two USB 2.0 ports via rear I/O
o UHCI implementation
o Data rates up to 480Mbits/s

Ethernet
o Two 10/100/1000Base-T Ethernet channels at front panel
o Two 10/100/1000Base-T Ethernet channels at rear (2.16)
o RJ45 connectors at front panel
o Ethernet controllers are connected by four x4 PCIe® links
o Two on-board LEDs per channel (front) to signal LAN Link, Activity status and connection speed

Two UARTs (COM1..COM2)
o Via on-board adapter or rear I/O
o COM1: Physical RS232 interface at front panel using adapter PCB, instead of XMC/PMC 0, or: via rear I/O
o COM2: Via rear I/O, or: Physical interface at front panel using SA-Adapter™ via 10-pin ribbon cable on I/O connector, optional, instead of XMC/PMC 0, RS232..RS485, isolated or not
o Data rates up to 115.2kbits/s
o 16-byte transmit/receive buffer
o Handshake lines: full support (rear I/O); CTS, DCD, DSR, DTR, RTS (COM1 at front); CTS, DTR, RTS (COM2 at front)

25 GPIO lines
o Via rear I/O

Further I/O depending on FPGA configuration
Front Connections:

One USB 2.0 (Series A)
Two Ethernet (RJ45)
COM1/VGA (instead of XMC/PMC 0)
COM2 (D-Sub, optional, instead of XMC/PMC 0 and COM1/VGA)
XMC/PMC 0 and 1
CompactFlash® (optional, instead of XMC/PMC 0)
Rear I/O:

Standard factory FPGA configuration:
o 16Z052_GIRQ - Interrupt controller
o 16Z070_IDEDISK - IDE controller for NAND Flash
o 16Z024_SRAM - SRAM controller
o 16Z043_SDRAM - Additional SDRAM controller (up to 32MB)
o 16Z044_DISP - Display controller (60Hz/75Hz, 6-bit RGB)
o 16Z034_GPIO - GPIO controller (25 lines)
The FPGA offers the possibility to add customized I/O functionality.
Board Management:

Board Management Controller (BMC)
CPU alarm and status monitoring
Voltage and current supervision
Reset control
CPU and board temperature monitoring
Prepared for BIOS update via BMC
Mezzanine Slots:

Two slots usable for PMC or XMC
Two XMC slots
o Compliant with XMC standard VITA 42.3-200x
o PCI Express® links: one x4 or two x4 or one x8
Two PMC slots
o Compliant with PMC standard IEEE 1386.1
o 32-bit/33-MHz, 3.3V V(I/O)
o PMC I/O module (PIM) support
Miscellaneous:

Real-time clock with GoldCap backup
Reset button
Four status LEDs, one hot-swap LED (blue)
PCI Express®:

Four x4 links to connect local 1000Base-T Ethernet controllers (1GB/s in each direction)
Two x4 links or one x8 link for XMC extension (1GB/s or 2GB/s in each direction)
CompactPCI® Bus:

Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
System slot
Up to 64-bit/66-MHz PCI-to-PCI bridge / PCI-X
V(I/O): +3.3V
CompactPCI® hot-swap support compliant with CompactPCI® Hot Swap Specification PICMG 2.1 R2.0
Compliance with CompactPCI® Packet Switching Backplane PICMG 2.16 R1.0
Prepared for compliance with CompactPCI® System Management PICMG 2.9 R1.0
Electrical Specifications:

Supply voltage/power consumption:
o +5V (-3%/+5%), 6A typ. (Pentium® M 1.4GHz, 1GB memory)
o +3.3V (-3%/+5%), 3A typ. (Pentium® M 1.4GHz, 1GB memory)
o ±12V (-5%/+5%), only used for XMCs/PMCs and hard-disk connector
MTBF: 119,041h @ 40°C according to IEC/TR 62380 (RDF 2000)
Software Support:

MENMON™
Linux
VxWorks®
QNX®
OS-9®
Mechanical:

Dimensions: conforming to CompactPCI® specification for 6U boards
Weight: 596g
Environmental:

Temperature range (operation):
o 0..+40°C (Pentium® M 2GHz, with P601 mezzanines)
o 0..+45°C (Pentium® M 2GHz, w/o mezzanines)
o 0..+60°C (Celeron® M 1GHz, with P601 mezzanines)
o Airflow: min. 10m³/h (Celeron® M 373); min. 15m³/h (all other processors)
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms
Bump: 10g/16ms
Vibration (sinusoidal): 2g/10..150Hz
Conformal coating on request
Safety:

PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC:

Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)
BIOS:

Award BIOS
Software Support:

Windows®
Linux
VxWorks®
ROHS Status:

This product is lead free/ROHS compliant.

Ordering Details:
Board:

02D006-00 D6 Pentium® M 760 2GHz, 1GB DDR2 ECC, 32 MB add SDRAM, 8MB SRAM, 16kB FRAM, 128MB NAND flash, 2MB boot flash, 2 XMC/PMC, 0 to +45°C

Please refer to datasheet for further information.
Accessories:

N/A
Further Information:

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