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Men Mikro

Men Mikro D7

6U compactPCI Multi-Core Xeon Blade Server

Two Intel® Dual Core Xeon 1.66 GHz CPUs, Up To 4 GB DDR2 ECC SDRAM

 
MEN D7 6U cPCI Multi-Core Xeon Blade Server
  
  • 2 Intel® dual core Xeon 1.66 GHz
  • 4HP CompactPCI® system slot
  • (8HP for extended temperature range)
  • PCI 64-bit/66-MHz
  • Hot-swap, PICMG 2.16 support
  • Up to 4 GB DDR2 ECC SDRAM
  • Non-volatile SRAM, FRAM
  • Hard disk slot
  • 2 SATA, 2 PATA interfaces
  • Graphics up to 1280 x 1024 (optional)
  • 4 Gigabit Ethernet (PCIe)
  • 3 USB 2.0, 2 COM
  • Individual I/O in FPGA
  • 2 XMC/PMC slots (PCIe)
  • Board Management Control



Datasheet/Manual:

MEN D7 datasheet in PDF format Datasheet in PDF format
Manual available on request Manual available on request

 

Introduction

The D7 is equipped with two high-performance Intel® multi-core Xeon processors, which consist of four CPU cores running at 1.66 GHz. The versatile 4 or 8HP/6U (single or double-slot, double-size Eurocard) CompactPCI® single-board computer is designed especially for embedded systems which require high computing performance. It comes with a tailored passive heat sink - forced air cooling is required inside the CompactPCI® system.

The D7 offers a 64-bit/66-MHz PCI up to PCI-X interface to the CompactPCI® bus. PCI Express® for high-speed communication is supported on board to connect the two Gigabit Ethernet controllers as well as one or two XMC modules.

A wide range of different memory is available on the D7, such as a maximum of 4GB DDR2 SDRAM with ECC as main memory. The non-volatile memory comprises up to 8MB buffered SRAM and 16KB FRAM. All memory components are soldered to guarantee reliable shock and vibration resistance. A hard disk slot is also implemented. Aside from parallel ATA support, two serial ATA lines are available in addition.

The standard I/O available at the front panel of the D7 includes two XMC or PMC modules, two Gigabit Ethernet and one USB 2.0. If only one XMC module is used, one VGA and one COM are available at the front panel.

Graphics is provided in the FPGA which can also be used to implement further application-specific I/O functions. An additional 32MB SDRAM is connected to the FPGA, e.g. for use as graphics memory.

The D7 is also prepared for rear I/O where for example two USB ports, two COMs, IDE, audio AC'97 or the rear I/O signals from the PMC modules can be connected. A board management controller is implemented to supervise the CPUs, all voltages, processor and board temperature, and reset. The controller is completely independent of the CPUs and monitors all states of the CPUs.

The D7 operates in Windows® and Linux environments as well as under real-time operating systems which are able to support multi-core architecture. The Award BIOS was especially designed for embedded system applications

Equipped with Intel® components that come exclusively from the Intel® Embedded Line, the D7 has a guaranteed minimum standard availability of 5 years.

The D7 is suited for a wide range of industrial communication applications, for example networked appliances (base stations, gateways, routers etc.), instrumentation and test or railway signaling equipment. Main target markets comprise telecoms, medical engineering and transportation.
 
 

Specification
CPU:

Two Dual-Core Intel® Xeon® ULV processors
o 1.66GHz processor core frequency
o 667MHz front-side bus frequency
Passive heat sink
Chipset:

Northbridge: Intel® MCH E7520 server chip set
o Southbridge: Intel® ICH 6300ESB
o High-end memory controller
Memory:

2MB L2 cache integrated in Xeon®
Up to 4GB SDRAM system memory
o Soldered
o DDR2 with ECC support
o 400MHz memory bus frequency
o Dual-channel, 2x64 bits

Up to 32MB additional SDRAM, FPGA-controlled, e.g. for video data
Up to 8MB boot Flash
Up to 8MB non-volatile SRAM(Backed by GoldCap or external battery)
Up to 16KB non-volatile serial FRAM
Serial EEPROM 3x2kbit for factory settings
CompactFlash® card interface, optional, instead of XMC/PMC 0
Mass Storage:

Parallel IDE (PATA)

  • One port for local hard-disk/CD-ROM, or:
  • One port for local CompactFlash®
  • One port for rear I/O

Serial ATA (SATA)

  • One port via on-board connector
  • One port for rear I/O
  • Transfer rates up to 150MB/s
Graphics:

FPGA-controlled
o 2D graphics, frame-buffered
o VGA up to SXGA
o Maximum resolution: 1280 x 1024 pixels
o Supports BIOS for set-up and control
o Operating system support by means of dedicated drivers
VGA/COM Adapter (see Accessories), instead of XMC/PMC
Standard VGA graphics with integrated operating system support can be added as needed through an XMC/PMC
USB:

One USB 2.0 port at front via Series A connector
Two USB 2.0 ports via rear I/O
UHCI implementation
Data rates up to 480Mbits/s
Ethernet:

Two 10/100/1000Base-T Ethernet channels at front panel
Two 10/100/1000Base-T Ethernet channels at rear (2.16)
RJ45 connectors at front panel
Ethernet controllers are connected by four x4 PCIe® links
Two on-board LEDs per channel (front) to signal LAN Link, Activity status and connection speed
Other I/O:

Two UARTs (COM1, COM2)
o Via on-board adapter or rear I/O
o COM1: Physical RS232 interface at front panel using adapter PCB, or: via rear I/O
o COM2: Via rear I/O, or: Physical interface at front panel using SA-Adapter™ via 10-pin ribbon cable on I/O connector, optional, instead of XMC/PMC 0, RS232..RS485, isolated or not
o Data rates up to 115.2kbits/s
o 16-byte transmit/receive buffer
o Handshake lines: full support (rear I/O); CTS, DCD, DSR, DTR, RTS (COM1 at front); CTS, DTR, RTS (COM2 at front)

25 GPIO lines
o Via rear I/O

Further I/O depending on FPGA configuration
Front Connections:

One USB 2.0 (Series A)
Two Ethernet (RJ45)
COM1/VGA (optional, instead of XMC/PMC 0)
COM2 (D-Sub, optional, instead of XMC/PMC 0 and COM1/VGA)
XMC/PMC 0 and 1
CompactFlash® (optional, instead of XMC/PMC 0 and COM1/VGA)
Rear I/O

IDE (PATA), one port
IDE (SATA), one port
USB 2.0, two ports
Ethernet 1000Base-T according to PICMG 2.16, two ports
COM1/COM2
25 GPIO lines
Mezzanine rear I/O: Two PMC
FPGA:

Standard factory FPGA configuration:
o 16Z052_GIRQ - Interrupt controller
o 16Z024_SRAM - SRAM controller
o 16Z043_SDRAM - Additional SDRAM controller (up to 32MB)
o 16Z044_DISP - Display controller (60Hz/75Hz, 6-bit RGB)
o 16Z034_GPIO - GPIO controller (25 lines)
The FPGA offers the possibility to add customized I/O functionality. See FPGA.
Board Management:

Board Management Controller (BMC)
CPU alarm and status monitoring
Voltage and current supervision
Reset control
CPU and board temperature monitoring
Prepared for BIOS update via BMC
Mezzanine Slots:

Two slots usable for PMC or XMC
2 XMC slots
o Compliant with XMC standard VITA 42.3-200x
o PCI Express® links: one x4 or two x4 or one x8
2 PMC slots
o Compliant with PMC standard IEEE 1386.1
o 32-bit/33-MHz, 3.3V V(I/O)
o PMC I/O module (PIM) support
Miscellaneous:

Real-time clock with GoldCap backup
Reset button
Four status LEDs, one hot-swap LED (blue)
PCI Express®:

Four x4 links to connect local 1000Base-T Ethernet controllers (1GB/s in each direction)
Two x4 links or one x8 link for XMC extension (1GB/s or 2GB/s in each direction)
CompactPCI® Bus:

Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
System slot
Up to 64-bit/66-MHz PCI-to-PCI bridge / PCI-X
V(I/O): +3.3V
CompactPCI® hot-swap support compliant with CompactPCI®
Hot Swap Specification PICMG 2.1 R2.0
Compliance with CompactPCI® Packet Switching Backplane PICMG 2.16 R1.0
Prepared for compliance with CompactPCI® System Management PICMG 2.9 R1.0
Electrical:

Supply voltage/power consumption:
o +5V (-3%/+5%), 10A typ. (2 processors 1.66GHz)
o +3.3V (-3%/+5%), 3A typ.
o ±12V (-5%/+5%), only used for XMCs/PMCs and hard-disk connector
MTBF: 114,626h @ 40°C according to IEC/TR 62380 (RDF 2000)
Mechanical:

Dimensions: conforming to CompactPCI® specification for 6U boards
Front panel: 4HP with ejector and heat sink
Weight: 410g (without XMCs or PMCs)
Environmental:

Temperature range (operation):
o 0 to+45°C (4HP)
o 0 to+60°C (8HP with larger heat sink)
Airflow: min. 10m³/h
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms
Bump: 10g/16ms
Vibration (sinusoidal): 2g/10..150Hz
Conformal coating on request
Safety:

PCB manufactured with a flammability rating of 94V-0 by
UL recognized manufacturers
EMC:

Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst) with regard to CE conformity
BIOS:

Award BIOS
Software Support:

Windows®
Linux
VxWorks® (on request)
ROHS Status: This product is lead free/ROHS compliant.

Ordering Details:
Board:

02D007-00 D7, CPCI 6U, 2x2 Xeon LV 1.66GHZ, 2GB DDR2, 32MB SRAM, 0 to +45°C

Accessories:

N/A
Further Information:

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