Diamond Point International

Sitemap - Print Page - Email Link - RSS News Feed RSS

 
MEN Micro

MEN Micro D9

6U compactPCI Core Duo/Core 2 Duo SBC

Intel® Core™ 2 Duo T7400 or L7400 CPU, Up To 4GB Soldered DDR2 Memory
 
MEN D9 6U cPCI Core Duo/Core 2 Duo SBC
  
  • Intel® Core™ 2 Duo T7400 or L7400
  • Core Duo T2500, U2500 or L2400
  • PCI Express® five x1 links
  • 4 HP system master or stand-alone
  • 32-bit CompactPCI®
  • PICMG 2.16 via mezzanine card
  • Up to 4 GB DDR2 DRAM soldered
  • 2 SATA, 1 PATA interface
  • Video via VGA & 2 SDVO, HD audio via mezzanine
  • Up to 4 Gigabit Ethernet
  • Up to 6 USB and 4 UARTs via mezzanine
  • 1 XMC or PMC, 1 mezzanine card slot
  • Board controller



Datasheet/Manual:

MEN D9 datasheet in PDF format Datasheet in PDF format
Manual available on request Manual available on request

 

Introduction

The D9 6U single-slot SBC supports a variety of Intel® Core™ Duo and Core 2 Duo processors from the high-end 2.16 GHz T7400 to the low-voltage dual-core versions down to a selection of Celeron® M types. It is designed especially for embedded systems which require high computing and graphics performance and low power consumption.

The D9 offers a 32-bit/33-MHz system slot CompactPCI® bus interface or can be used without a bus system. A total of five PCI Express® lanes for high-speed communication (such as GB Ethernet or graphics) are supported on the D9. 2 x1 PCIe links are used for the two on-board Ethernet interfaces, another 2 x1 links support the XMC slot and 1 x1 link is available on a specific mezzanine card.

Further serial interfaces include two SATA ports for connection of an on-board hard disk (instead of the PMC or XMC) and a second one on the transition module at the rear. Alternatively, one of the two SATA ports is available via the mezzanine card. One PATA interface supports the on-board CompactFlash® slot. A total of six USB 2.0 are supported at the front, on the rear I/O transition module and on board the mezzanine card. Four of the on-board USBs can be used to realize two UARTs on a mezzanine card and another two UARTs on the rear I/O transition module. The standard I/O available at the front panel of the D9 includes graphics on a VGA connector, two Gigabit Ethernet and two USB 2.0 interfaces.

The D9 can be extended by different mezzanine cards. Additional functions may include PICMG 2.16, digital video inputs for flat panel connection via DVI,
different UARTs, USB 2.0 ports, SATA for hard disk or RAID connection and HD audio.

The D9 is also prepared for rear I/O via the CT7 transition module with two USB 2.0, 2 UARTs, 2 Gigabit Ethernet, 1 SATA and 1 PIM module.

Supervision of the processor and board temperature as well as a watchdog for monitoring the operating system complete the functionality of the D9.

The D9 operates in Windows® and Linux environments and under RTOS systems that support multi-core architecture.

Equipped with Intel® components exclusively from the Intel® Embedded Line, the D9 has a guaranteed minimum standard availability of 5 years.

The D9 is suited for a wide range of industrial applications, e.g. monitoring, vision and control systems as well as test and measurement. Main target
markets comprise industrial automation, multimedia, traffic and transportation, aerospace, shipbuilding, medical engineering and robotics.

For use in harsh environments the D9 is equipped with soldered DDR2 DRAM (up to 4GB) to guarantee optimum shock and vibration resistance. It comes with a tailored passive heat sink within 4 HP height. However, forced air cooling is always required inside the system. Its robust design make the D9 especially suited for rugged environments with regard to extended operation temperature, shock and vibration according to applicable DIN, EN or IEC industry standards. It is also ready for coating for use in humid and dusty environments.
 
 

Specification
CPU:

Up to Intel® Core™ 2 Duo T7400
Dual-core 64-bit processor
Up to 2.16GHz processor core frequency
Up to 667MHz front-side bus frequency
Chipset:

Northbridge: Intel® 945GME Express
Southbridge: Intel® ICH7-M DH
Memory:

4MB L2 cache integrated in Core 2 Duo
Up to 4GB SDRAM system memory

  • Soldered
  • DDR2
  • 667MHz memory bus frequency
  • Dual-channel, 2x64 bits

8Mbits boot Flash
Serial EEPROM 2kbits for factory settings
CompactFlash® card interface

  • Via on-board IDE
  • Type I
  • True IDE
  • DMA support
Mass Storage:

Parallel IDE (PATA)

  • One IDE port for local CompactFlash®

Serial ATA (SATA)

  • One channel for on-board hard disk
  • One channel via mezzanine card connector or rear I/O connector
  • Transfer rates up to 150MB/s
  • RAID level 0/1 support
Graphics:

Integrated in 945GME Express chipset
200/250MHz 256-bit graphics core
VGA connector at front panel
Two SDVO ports available via mezzanine-card connector
One additional DVI connector at front panel optional via mezzanine card
USB:

Two USB 2.0 ports via Series A connectors at front panel
Four USB 2.0 ports via mezzanine-card connector (if a transition module is used two of these are converted to UARTs)
Two USB 2.0 ports via rear I/O (if these are used only two USB are available on the mezzanine card connector)
UHCI implementation
Data rates up to 480Mbits/s
Ethernet:

Two 10/100/1000Base-T Ethernet channels at front panel
RJ45 connectors at front panel
Ethernet controllers are connected by two x1 PCIe® links
On-board LEDs to signal activity status and connection speed
Two 10/100/1000Base-T Ethernet channels via mezzanine card on backplane (PICMG 2.16 or on transition module)
Via one x1 PCIe® link and without LEDs
Audio:

High Definition (HD) audio via accessible via mezzanine-card connector
Front Connections:

VGA
Two USB 2.0 (Series A)
Two Ethernet (RJ45)
Rear I/O

USB 2.0, two ports
Ethernet 1000Base-T via mezzanine card, two ports optional
UART - Two ports instead of two USB on mezzanine card connector
Mezzanine Slot

One slot usable for PMC or XMC
XMC slot

  • Compliant with XMC standard VITA 42.3-200x
  • Two x1 PCI Express® links

PMC slot

  • Compliant with PMC standard IEEE 1386.1
  • PCI / PCI-X 32/64 bit, 33/66/133MHz, 3.3V V(I/O)
  • One x1 PCI Express® link via PCI Express® to PCI bridge
  • PMC I/O module (PIM) support via J14
Miscellaneous:

Board controller
Real-time clock, buffered by a GoldCap or alternatively a battery
Watchdog timer
Temperature measurement
One user LED
Reset button
PCI Express®:

Two x1 links to connect local 1000Base-T Ethernet controllers
One x1 link for extension through mezzanine-card connector
Two x1 links to connect XMC (or one x1 link for connection of PMC via PCI Express® to PCI bridge)
Data rate up to 250MB/s in each direction (2.5 Gbits/s per lane)
CompactPCI® Bus:

Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
System slot
32-bit/33-MHz CompactPCI® bus
V(I/O): +3.3V (+5V tolerant)
Compliance with CompactPCI® Packet Switching Backplane PICMG 2.16 R1.0
Busless Operation:

Board can be supplied with +5V only, all other voltages are generated on the board
Backplane connectors used only for power supply
Power:

Supply voltage/power consumption:
o +5V (-3%/+5%), approx. tbd
o +3.3V (-3%/+5%), approx. tbd
o +12V (-10%/+10%), approx. 10mA (without PMC or XMC module)
If the board is supplied with 5V only (typically without a bus connection), the 3.3V are generated on the board and fed to the backplane (3A max.)
MTBF: tbd @ 40°C according to IEC/TR 62380 (RDF2000)
Mechanical:

Dimensions: conforming to CompactPCI® specification for 6U boards
Front panel: 4HP with ejector
Weight: 400g (without XMC/PMC and mezzanine board)
Environmental:

Temperature range (operation):
0..+45°C
0..+60°C (version with Celeron® M processor)
Airflow: min. 15m³/h (1.5m/s)
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 2,000m
Shock: 15g/11ms (EN 60068-2-27)
Bump: 10g/16ms (EN 60068-2-29)
Vibration (sinusoidal): 1g/ 10..150Hz (EN 60068-2-6)
Conformal coating on request
Safety:

PCB manufactured with a flammability rating of 94V-0 by
UL recognized manufacturers
EMC:

Tested according to EN 55022 Class A (radio disturbance), EN 61000-4-2 (ESD), EN 61000-4-4 (burst) and EN 61000-4-5 (surge) with regard to CE conformity
BIOS:

Award BIOS
Software Support:

Windows®
Linux
VxWorks® (on request)
QNX® (on request)
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems
ROHS Status:

This product is lead free/ROHS compliant.

Ordering Details:
Board:

02D009-00 1 D9,CPCI 6U, Core2Duo T7400 2.16GHz, 2GB DDR, 0 to +45°C

Accessories:

N/A
Further Information:

Want further information or pricing on this product? Either fill out our feedback form or contact us for further information.
 
© 2008 Diamond Point International. All rights reserved.