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MEN Mikro

MEN Mikro F19P

3U compactPCI PlusIO Intel® Core™ 2 Duo SBC

Intel® Core™ 2 Duo SP9300 CPU, Up To 4GB/8GB Soldered DDR2 Memory
 
MEN F19P 3U PlusIO Intel Core 2 Duo
 
  • Intel® Core™ 2 Duo SP9300, 2.26 GHz
  • Dual-core 64-bit processor
  • 4 HP system master or stand-alone
  • 32-bit CompactPCI® and PICMG 2.30 PlusIO
  • Up to 4 (8) GB DDR3 DRAM soldered
  • CompactFlash® and microSD card slots
  • Standard front I/O: VGA, 2 Gb Ethernet, 2 USB
  • Standard rear I/O: 4 PCIe®, 4 USB, 4 SATA, 1 Gb Ethernet
  • Other I/O (onboard, side card): SATA, SDVO, HD audio, USB, UART etc.
  • Board controller



Datasheet/Manual:

MEN F19P datasheet in PDF format Datasheet in PDF format
Manual available on request Manual available on request

 

Introduction

The F19P versatile 4HP/3U single-board computer is both a continuation of MEN's proven range of Intel® CPU boards and the first Intel® based SBC in accordance with CompactPCI® PlusIO, paving the way towards CompactPCI® Plus.

It is equipped with the Intel® high-performance Core 2 Duo processor SP9300 running at 2.26 GHz and offering the latest multi-core processor architecture from Intel® with full 64-bit support. The board delivers an excellent graphics performance and is designed especially for embedded systems which require high computing performance with low power consumption. The F19P offers a 32-bit/33-MHz CompactPCI® bus interface and can also be used without a bus system. It is compliant to the new PICMG 2.30 CompactPCI® PlusIO standard (in preparation). This means that it offers 4 USB 2.0 and 4 fast (3Gb/s) SATA interfaces as well as 4 PCI Express® x1 links and one Gigabit Ethernet on the J2 rear I/O connector.

A total of seven PCI Express® lanes for high-speed communication (such as Gigabit Ethernet) are supported on the F19P. 3 x1 PCIe® links are used for the three onboard Ethernet interfaces. 4 x1 or 1 x4 PCIe® links are available via rear I/O or on a specific side card. The F19P is equipped with a new fast DDR3 DRAM which is soldered to the F19P to guarantee optimum shock and vibration resistance. A robust CompactFlash® and microSD card device which are connected via 2 USB interfaces offer nearly unlimited space for user applications.

The standard I/O available at the front panel of F19P includes graphics on a VGA connector, two PCIe®-driven Gigabit Ethernet as well as two USB 2.0 ports. The F19P can be extended by different side cards. Additional functions include two digital video inputs for flat panel connection via DVI (multimedia), a variety of different UARTs or another four USBs, SATA for hard disk connection and HD audio.

Thermal supervision of the processor and a watchdog for the operating system complete the functionality of the F19P.

The F19P operates in Windows® and Linux environments as well as under real-time operating systems that support Intel®'s multi-core architecture. The Insyde H2O EFI BIOS was specially designed for embedded system applications.

Equipped with Intel® components exclusively from the Intel® Embedded Line, the F19P has a guaranteed minimum standard availability of 7 years.

The F19P is suited for a wide range of industrial applications, e.g. for monitoring, vision and control systems as well as test and measurement. Main target markets comprise industrial automation, multimedia, traffic and transportation, aerospace, shipbuilding, medical engineering and robotics.

The F19P comes with a tailored passive heat sink within 4 HP height. Regardless, forced air cooling is always required inside the system. The robust design of the F19P make the board especially suited for use in rugged environments with regard to shock and vibration according to applicable DIN, EN or IEC industry standards. The F19P is also ready for coating so that it can be used in humid and dusty environments.
 
 

Specification

CPU:

Up to Intel® Core™ 2 Duo SP9300
Dual-core 64-bit processor
Up to 2.26GHz processor core frequency
800/1066MHz system bus frequency

Chipset:

Northbridge: Intel® GS45
Southbridge: Intel® ICH9M-E

Memory:

Up to 6MB L2 cache integrated in Core 2 Duo
Up to 4GB DDR3 SDRAM system memory (8GB when components available)

  • Soldered
  • 800/1067MHz memory bus frequency locked to the FSB frequency

16Mbits boot Flash
Serial EEPROM 2kbits for factory settings
CompactFlash® card interface

  • Via USB
  • Type I
  • True IDE
  • DMA support

MicroSD card interface via USB

Mass Storage:

CompactFlash®

  • Via one USB port

MicroSD card

  • Via one USB port

Serial ATA (SATA)

  • Four channels via rear I/O, one channel via side-card connector (switchable)
  • Transfer rates up to 300MB/s
  • RAID level 0/1/5/10 support

Graphics:

Integrated in GS45 chipset

  • Up to 533 MHz graphics core
  • Maximum resolution: 2048 x 1536 pixels

VGA connector at front panel
Two SDVO ports available via side-card connector

  • Two additional DVI connectors at front panel optional via side card
  • Simultaneous connection of two monitors

USB:

Two USB 2.0 ports via Series A connectors at front panel
Four USB 2.0 ports via side-card connector
Four USB 2.0 ports via rear I/O
Two USB for connection of CompactFlash®/MicroSD or USB NAND Flash
UHCI implementation
Data rates up to 480Mbits/s

Ethernet:

Two 10/100/1000Base-T Ethernet channels at the front
RJ45 connectors at front panel
Ethernet controllers are connected by two x1 PCIe® links from ICH9-M
Onboard LEDs to signal activity status and connection speed
One 10/100/1000Base-T Ethernet channel via rear I/O
Ethernet controller is connected by one x1 PCIe® link from GS45

Audio:

High Definition (HD) audio via side-card connector

Front Connections:

VGA
Two USB 2.0 (Series A)
Two Ethernet (RJ45)

Miscellaneous:

Board controller
Real-time clock, buffered by a GoldCap or alternatively a battery (5 years life cycle)
Watchdog timer
Temperature measurement
One user LED
Reset button

PCI Express®:

Three x1 links to connect local 1000Base-T Ethernet controllers

  • Data rate 250MB/s in each direction (2.5 Gbits/s per lane)

One x4 or four x1 links for extension through side-card connector or rear I/O

  • Data rate up to 1GB/s in each direction (2.5 Gbits/s per lane)

Miscellaneous:

Board controller
Real-time clock, buffered by a GoldCap or alternatively a battery
Watchdog timer
Temperature measurement
One user LED
Reset button

PCI Express®:

Two x1 links to connect local 1000Base-T Ethernet controllers
One x1 link for extension through mezzanine-card connector
Two x1 links to connect XMC (or one x1 link for connection of PMC via PCI Express® to PCI bridge)
Data rate up to 250MB/s in each direction (2.5 Gbits/s per lane)

CompactPCI® Bus:

Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
In accordance with proposed standard PICMG 2.30 CompactPCI® PlusIO
System slot
32-bit/33-MHz CompactPCI® bus
V(I/O): +3.3V (+5V tolerant)

Busless Operation:

Board can be supplied with +5V only, all other voltages are generated on the board
Backplane connectors used only for power supply

Power:

Supply voltage/power consumption:

  • +5V (-3%/+5%), tbd, if the F19P is operated with 5V only, the 3.3V voltage can be used to supply other CompactPCI® boards in the system, maximum load: 15W
  • +3.3V (-3%/+5%), tbd
  • +12V (-10%/+10%), tbd

Mechanical:

Dimensions: conforming to CompactPCI® specification for 3U boards
Front panel: 4HP with ejector
Weight: tbd

Environmental:

Temperature range (operation):

  • 0 to +60°C
  • Conditions: airflow 1.5m/s, typical power dissipation tbd

Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 2,000m
Shock: 15g/11ms (EN 60068-2-27)
Bump: 10g/16ms (EN 60068-2-29)
Vibration (sinusoidal): 1g/ 10..150Hz (EN 60068-2-6)
Conformal coating on request

Safety:

PCB manufactured with a flammability rating of 94V-0 by
UL recognized manufacturers

EMC:

Tested according to EN 55022 Class A (radio disturbance), EN 61000-4-2 (ESD), EN 61000-4-4 (burst) and EN 61000-4-5 (surge) with regard to CE conformity

BIOS:

Insyde H2O EFI BIOS

Software Support:

Windows® (including Vista)
Linux
VxWorks® (on request)
QNX® (on request)
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems

MTBF:

tbd @ 40°C according to IEC/TR 62380 (RDF2000)

ROHS Status:

This product is lead free/ROHS compliant.

Ordering Details:
Board:

02F019P00 F19P, 3U CompactPCI, Intel Celeron M 722, 1.2 GHz, 2 GB DDR3 DRAM, -40..+85°C
02F019P01 F19P, 3U CompactPCI, Intel Core 2 Duo SP9300, 2.26 GHz, 4 GB DDR3 DRAM, 0..+60°C
Accessories:

08CT12-00 CompactPCI PlusIO rear transition module 3U/80mm, 2 Ethernet, 4 USB, 4 SATA, 4 PCIe x1, -40°C to +85°C qualified
Further Information:

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