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MEN Mikro

MEN Mikro F50P

3U compactPCI PlusIO MPC8548 PowerPC® SBC

PowerPC® CPU 800MHz to 1.5GHz, Up To 2GB Soldered DDR2 Memory
 
MEN F50P 3U PlusIO MPC8548 SBC
  
  • 32-bit CompactPCI® and PICMG 2.30 PlusIO
  • 8 HP or 12 HP with front I/O
  • MPC8548 (or MPC8543), up to 1.5 GHz
  • Up to 2 GB (ECC) DDR2 SDRAM
  • Up to 128 KB FRAM, 2 MB SRAM
  • Up to 16 GB SSD Flash
  • Standard front I/O: 2 Gb Ethernet, 2 USB
  • Standard rear I/O: 1 Gb Ethernet, 4 USB, 2
    SATA
  • FPGA for user-defined I/O functions (option)
  • MENMON™ BIOS for PowerPC® cards



Datasheet/Manual:

MEN F50P datasheet in PDF format MEN Mikro F50P Datasheet - PDF
Manual available on request Manual available on request

 

Introduction

The F50P is a versatile, rugged PowerPC® based single board computer for embedded applications. It is controlled by an MPC8548, or optionally an MPC8543 PowerPC® processor (alternatively with encryption unit) with clock frequencies between 800 MHz and 1.5 GHz. The SBC is equipped with ECC-controlled, soldered-on DDR2 RAM for data storage, with up to 16 GB of solid-state Flash disk for program storage as well as industrial FRAM and SRAM.

The board provides up to three Gigabit Ethernet channels, six USB ports, up to two SATA interfaces and up to 62 user-definable I/O lines controlled by an optional onboard FPGA. These interfaces can be combined in many variations and are available at the front or at the rear using the board's J2 connector. Two USB and two RJ45 Ethernet connectors are already provided at the front panel, and space is left for an optional VGA connector.

The large FPGA on the F50P allows to add additional user-defined functions such as graphics, touch, serial interfaces, fieldbus controllers, binary I/O etc. for the needs of the individual application in an extremely flexible way. Before boot-up of the system, the FPGA is loaded from boot Flash. Updates of the FPGA contents can be made inside the boot Flash during operation. If the FPGA is assembled, the card needs an extra 4 HP in front panel space.

Equipped with a PCI-bridge chip, the F50P offers a full CompactPCI® interface (system slot functionality) for reliable system expansion. Apart from that, the F50P can also be used as a busless, stand-alone board, with power supply from the backplane.

Being designed for operation in a conduction or convection cooled environment, the F50P provides flexibility also in its cooling concept. Its firmly plugged-on CPU module is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling for the F50C model, which is also available by standard. For air cooling, the F50P version comes with a tailor-made heat sink on top of the cover, requiring an 8-HP front panel, for an extended temperature range of -40 to +70°C. The soldered components on the F50P withstand shock and vibration, and the board design is optimized for conformal coating.

The F50P comes with MENMON™ support. This firmware/BIOS can be used for bootstrapping operating systems (from disk, Flash or network), for hardware testing, or for debugging applications without running any operating system.
 
 

Specification

CPU:

PowerPC® PowerQUICC™ III MPC8548, MPC8548E, MPC8543 or MPC8543E

  • 800MHz up to 1.5GHz
  • Please see Configuration & Options for available standard versions.
  • e500 PowerPC® core with MMU and double-precision embedded scalar and vector floating-point APU
  • Integrated Northbridge and Southbridge

Memory:

2x32KB L1 data and instruction cache, 512KB/256KB L2 cache integrated in MPC8548/MPC8543
Up to 2GB SDRAM system memory

  • Soldered
  • DDR2 with or without ECC
  • Up to 300 MHz memory bus frequency, depending on CPU

Up to 16GB soldered Flash disk (SSD solid state disk)
Up to 32MB additional DDR2 SDRAM, FPGA-controlled, e.g. for video data
16MB boot Flash
2MB non-volatile SRAM with GoldCap backup
128KB non-volatile FRAM
Serial EEPROM 4kbits for factory settings

Mass Storage:

Parallel IDE (PATA)

  • Up to 16GB soldered ATA Flash disk (SSD solid state disk)

Serial ATA (SATA)

  • Up to two ports via rear I/O J2
  • Transfer rates up to150MB/s (1.5 Gbits/s)
  • Via PCI-to-SATA bridge

Graphics:

FPGA-controlled (optional)
VGA connector prepared at front panel

I/O:

USB (host)

  • Five USB 2.0 host ports
  • One series A connector at front panel
  • Four ports via rear I/O J2
  • OHCI and EHCI implementation
  • Data rates up to 480Mbits/s

USB (client)

  • One USB client port on series A connector at front panel
  • Via UART-to-USB converter
  • Data rates up to 115.2kbits/s
  • 16-byte transmit/receive buffer
  • Handshake lines: none

Ethernet

  • Up to three 10/100/1000Base-T Ethernet channels with MPC8548/E (two channels with MPC8543/E)
  • Two RJ45 connectors at front panel
  • Two front-panel LEDs for channels for LAN link, activity status and connection speed
  • All three possible also via rear I/O J2 (Note: requires additional Ethernet transformers on rear I/O board or backplane.)

User-defined I/O

  • FPGA-controlled (optional)
  • Up to 62 I/O lines
  • Connection via rear I/O J2

Front Connections (Standard):

One USB 2.0 host (Series A)
One USB client (Series A)
Two Ethernet (RJ45)

Rear I/O:

Four USB 2.0
Up to three 1000Base-T Ethernet
Up to two SATA
Up to 62 I/O lines with optional FPGA (reduces Ethernet/SATA interfaces)

FPGA:

Standard: FPGA not assembled
The FPGA offers the possibility to add customized I/O functionality

Miscellaneous:

Real-time clock with GoldCap backup
Temperature sensor, power supervision and watchdog
Status LED at the front
Reset button

CompactPCI® Bus:

Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
System slot
32-bit/32-MHz PCIe®-to-PCI bridge
V(I/O): +3.3V (+5V tolerant)

Busless Operation:

Board can be supplied with +5V, +3.3V and ±12V from backplane, all other voltages are generated on the board
Backplane J1 connector used only for power supply

Electrical:

Supply voltage/power consumption:
+5V (-3%/+5%), tbd.
+3.3V (-3%/+5%), tbd.
±12V (-5%/+5%), tbd.

Mechanical:

Dimensions: conforming to CompactPCI® specification for 3U boards
Front panel: 8HP without FPGA, 12HP with FPGA
Weight: tbd.

Environmental:

Temperature range (operation):

  • -40..+70°C (screened)
  • Airflow: min. 1.0m/s

Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms (EN 60068-2-27)
Bump: 10g/16ms (EN 60068-2-29)
Vibration (sinusoidal): 1g/ 10..150Hz
Conformal coating on request

Safety:

PCB manufactured with a flammability rating of 94V-0 by
UL recognized manufacturers

EMC:

Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)

BIOS:

MENMON™

Software Support:

Linux
VxWorks® (on request)
QNX® (on request; support of the FPU is currently not provided by QNX®)
INTEGRITY® (Green Hills® Software) (in preparation)
OS-9® (on request)

MTBF:

tbd @ 40°C according to IEC/TR 62380 (RDF2000)

ROHS Status:

This product is lead free/ROHS compliant.

Ordering Details:
Board:

02F050P00 MPC8548, 1.33 GHz, 2 GB SSD Flash, 512 MB DDR2 RAM, 2 MB SRAM, 128 KB FRAM, front I/O (2 GbE, 2 USB), 8 HP, no FPGA, -40..+70°C screened
02F050C00 MPC8548, 1.33 GHz, 2 GB SSD Flash, 512 MB DDR2 RAM, 2 MB SRAM, 128 KB FRAM, FPGA, rear I/O (2 GbE, 4 USB, 42 GPIO), 5HP, -40..+85°C screened (tbc.) - within CCA frame
Accessories:

08CT12-00 CompactPCI PlusIO rear transition module 3U/80mm, 2 Ethernet, 4 USB, 4 SATA, 4 PCIe x1, -40°C to +85°C qualified
Further Information:

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