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MEN Mikro

MEN Mikro XM2

ESMexpress® with Intel® Core™ 2 Duo up to 2.26 GHz

Up To 4 GB DDR3 SDRAM, 0°C to +60°C Screened, Conductive Cooling
 
MEN Mikro XM2
  
  • RSE, Rugged System-On-Module Express (ANSI-VITA 59 in process)
  • Intel® Core™ 2 Duo up to 2.26 GHz
  • Up to 4 GB DDR3 SDRAM
  • 1 x16 PCI Express® Graphics link
  • 4 x1 PCI Express® links
  • 2 x Gb Ethernet
  • 3 SATA ports
  • 8 USB 2.0
  • Up to 2 SDVO ports
  • Intel® HD Audio
  • 0°C to +60°C screened
  • Conductive cooling



Datasheet/Manual:

MEN Mikro XM2 datasheet in PDF format MEN Mikro XM2 Datasheet - PDF
Manual available on request Manual available on request

 

Introduction

The XM2 is a Computer-On-Module of the ESMexpress® family in accordance with a proposed ANSI standard currently under development (ANSI-VITA 59, RSE Rugged System-On-Module Express) and supports the whole range of functions offered by this standard. Together with an application-specific carrier board it forms a semi-custom solution for industrial, harsh, mobile and mission-critical environments.

The XM2 is controlled by a Intel® Core™ 2 Duo processor with a clock frequency of up to 2.26 GHz and a total power consumption of up to 40W.

The XM2 can accommodate 4 GB of DDR3 DRAM memory and supports other memory like USB Flash on the carrier board.

The GS45 graphics controller supports x16 PCI Express® Graphics or up to two SDVO interfaces or DisplayPort (3 ports) or 2 HDMI ports.

In addition, four x1 or one x4 PCI Express® links are supported by the XM2. Other modern serial interfaces are 2 Gigabit Ethernet channels, 8 USB ports, 3 SATA ports, and one HD audio port. These interfaces are all routed from the XM2 for availability on any ESMexpress® carrier board.

The XM2 is completed by a board management controller for temperature and power supervision. It comes with an InsydeH2O™ EFI BIOS configurable for the final application.

The XM2 is screened for operation in a 0°C to +60°C conduction or convection cooled environment. As all ESMexpress® modules it is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling. Air cooling is also possible by applying a heat sink on top of the cover. With a low power processor the module may even be operated in an extended temperature range. ESMexpress® modules are firmly screwed to a carrier board and come with rugged industry-proven connectors supporting high frequency and differential signals. Only soldered components are used to withstand shock and vibration, and the design is optimized for conformal coating. All ESMexpress® modules support a single 95x125mm form factor.

For evaluation and development purposes an ATX carrier board is available. The ESMexpress® module can be evaluated on a COM Express™ carrier board via an adapter from ESMexpress® to COM Express™.
 
 

Specification

CPU:

Intel® Core™ 2 Duo SP9300
• Up to 2.26GHz processor core frequency
• 800/1066MHz system bus frequency

Chipset
• Northbridge: Intel® GS45
• Southbridge: Intel® ICH9M-E

Memory:

Up to 6MB L2 cache integrated in Core 2 Duo

Up to 4GB DDR3 SDRAM system memory
• Soldered
• 800/1067MHz memory bus frequency locked to the FSB frequency

Serial ATA (SATA):

Three ports via ESMexpress® connector
Transfer rates up to 3Gbits/s (SATA 3.0)

Graphics:

Integrated in Intel® GS45 chipset
Maximum resolution: 2048 × 1536 pixels (QXGA)
One x16 link (PCI Express® graphics) or
Up to two SDVO ports or
Three DisplayPorts or
Two HDMI ports
One LVDS port
Available via ESMexpress® connector

USB:

Eight USB 2.0 host ports
UHCI implementation
Data rates up to 480Mbits/s
Available via ESMexpress® connector

Ethernet:

Two 10/100/1000Base-T Ethernet channels
Ethernet controllers connected by two x1 PCIe® links
Two LED signals per channel for LAN link, activity status and connection speed
Available via ESMexpress® connector

PCI Express®:

Two x1 links to connect local 1000Base-T Ethernet controllers
Four x1 links or one x4 link via ESMexpress® connector (switchable on the carrier)
Data rate 250MB/s in each direction (2.5 Gbits/s per lane)

GPIO:

1 line from PIC via ESMexpress® connector
Usable for LED

HD audio:

Via ESMexpress® connector

Board Management Controller:

Input voltage supervision
Power sequencing
Board monitoring
Watchdog
Accessible via SMBus

Miscellaneous:

Real-time clock (with GoldCap or battery backup on the carrier board)
SMBus interface

ESMexpress®:

In accordance with proposed standard ANSI-VITA 59 RSE Rugged System on Module Express

Electrical:

Supply voltage/power consumption:
• +12V (-25%/+33%), power consumption up to 40W
• +5V standby voltage

Mechanical:

Dimensions: 95mm x 125mm
ESMexpress® PCB mounted between a frame and a cover
Weight: 230g (incl. cover and frame)

Environmental:

Temperature range (operation):
• 0..+60°C Tcase (screened)
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms (EN 60068-2-27)
Bump: 10g/16ms (EN 60068-2-29)
Vibration (sinusoidal): 1g/10..150Hz (EN 60068-2-6)
Conformal coating on request

MTBF:

tbd @ 40°C according to IEC/TR 62380 (RDF 2000)

Safety:

PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers

EMC:

Conforming to EN 55022 (radio disturbance), EN55024 EN 61000-4-2 (ESD) and EN55024; EN 61000-4-4 (burst)

BIOS:

InsydeH2O™ UEFI Framework

Software Support:

Windows®
Linux (in preparation)
VxWorks®
QNX® (on request)

ROHS Status:

This product is lead free/ROHS compliant

Ordering Details:

Board:

15XM02-00 Intel® Core™ 2 Duo SP9300 2.26 GHz, 2GB DDR3, 0..+45°C
15XM02-01 Intel® Celeron® M M722 1.2GHz, 2GB DDR3, 0..+60°C

Please refer to datasheet for further information.

Accessories:

08AE12-00 ESMexpress® module to COM Express™ carrier adapter, 0..+60°C

08XC01-00 Evaluation and development board for all ESMexpress® modules (coming with top cover and frame), incl. faceplate, 4GB USB Flash Disk and USB cable type A to A

Further Information:

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