About the Kontron microETXexpress format

Introduction

Kontron, the leading embedded computer technology company and the inventor of the ETX Computer-On-Module (COM) form factor, announced full support for the newly released microETXexpress module size, which is based on the ETXexpress/COM Express™ standard (by PICMG).

• PCI-Express – the upcoming primary datapath
• Gigabit Ethernet – for high connectivity
• USB 2.0 – for fast peripherals
• Serial ATA – for highspeed drivers
• ACPI – optimised power management

Minimize board size, maximize application potential

PCI-Express-based COMs for all kinds of applications, large and small footprint, has led Kontron to initiate a second round of COM Express™ standardization with the introduction of Compact COM Express. The goal is to build PCI-Express-based COMs on the smallest possible form factor and being achieved by the new Compact COM Express, based on the PICMG COM Express standard. A pure PCI version will be first available. The inclusion of PCI in the standard is particularly important to the developers of current systems because ETX, which was defined in 2000, offers PCI but does not support the latest processors & Bus speeds and there is a demand for a combination of these particular features, under the brands microETXexpress™ (for PCI-Express & PCI based or PCI based only).

The physical design of the new 95x95 mm form factor differs from the COM Express standard only in its size and the addition of one extra mounting hole in the top right corner, for mounting the smaller board. ETXexpress (Basic COM Express) measures 118.75 cm² (100%), and microETXexpress (Compact COM Express) measures 90.25 cm² (76%). The even larger Extended ETXexpress (Extended COM Express) standard, whose specification was adopted along with ETXexpress, measures 170.5 cm² (143.58%). Of course, any feature that could not fit within the physical limits of the new, smaller COMs has been eliminated.

The other interfaces for peripherals, network, and storage – such as PCI, IDE, 10/100LAN, and USB 2.0 – are mapped identically, so that, when changing from PCI to PCI Express or to a combination, as little as possible needs to be changed in the baseboard layout. Thus, users with an eye on future expansion can design PCI Express and SATA into their baseboards and make use of these features just when needed, simply by exchanging modules. Support for PCI and/or PCI Express is provided by the used chipset. microETXexpress with SATA and PCI Express is already planned for 2006.

The embedded formats ( microETXexpress and ETXexpress (COM Express)) can be supported by a single baseboard, that way the system is completely scalable in terms of processors, and from IDE to SATA, PCI to PCI Express, and 10/100 to GigaBit LAN. The layout of baseboards with PCI Express is facilitated because there are fewer conducting paths per bus segment; this is a real and cost saving advantage for developers.

Three module sizes for ETXexpress:

Two COM Express / ETXexpress Form Factors specified by PICMG

• 95.0 x 125.0 - COM Express / ETXexpress Basic
• 110.0 x 155.0 - COM Express / ETXexpress Extended

A smaller COM Express / ETXexpress Form Factor

• 95.0 x 95.0 mm - COM Express / ETXexpress Compact

The major advantages of microETXexpress™

• microETXexpress – based on ETXexpress/COM Express
• PCI Express - the elemental data highway
• PCI-Express Graphic - for high speed x16 graphic
• Gigabit Ethernet - for fastest connectivity
• Serial ATA - for performing drives & data storage
• ExpressCard - for hot-pluggable I/O cards
• ETXexpress connectors - for highest proven transfer rates
• USB 2.0 - for fast third party standard periphery
• Available with PCI Express bus or PCI bus based module
• Smoothest entrance into future technologies
• For future proof designs

Application Fields

• Gaming Entertainment
• Medical Equipment
• Storage Communications
• Industrial Automation
• Test and Measurement
• Retail and Advertising
• POS / POI
• Consumer Applications
• Government
• Transport

microETXexpress Downloads

The microETXexpress specification, design guide and related documents will be added when available.