Diamond Systems CME-965

Introduction

The CME-965 computer-on-module (COM) is a compact, high-performance, embedded computing core suitable for powering a wide range of embedded applications. To support real-world applications subject to temperature extremes, the module is rated for operation over a -40°C to +85° enhanced temperature range.

Reduced Development Costs

By plugging these powerful, plug-and-play COMs into standard or custom application baseboards, OEMs can reduce development costs, minimize design risks, and shorten time-to-revenue while benefiting from the latest embedded technologies. The CME-Atom also comes pre-integrated in our Magellan Embedded-Ready Subsystem.

Highly Integrated

Each CME-965 module integrates a complete set of PC-compatible functions, including a high-performance, low-power Intel Core 2 Duo LV processor and up to 4GB of high-speed system memory.

In addition, the module provides interface controllers for high-resolution VGA- and LVDS-interfaced displays, 10/100/1000Mbps Ethernet, and both SATA and IDE storage devices, as well as USB 2.0, digital I/O, and audio ports.

Maximum Application Flexibility

For maximum application flexibility, the CME-Atom can be interfaced to application-specific circuitry via a choice of PCI Express, PCI, and LPC expansion buses.

COM Express Development Systems

In addition to the CME-965 COMs themselves, Diamond offers pre-integrated development kits based on generic or application-oriented COM Express baseboards. This increases project efficiency and reduces risks by providing a known good environment for rapid application development.

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In addition to these features, the COM Express form-factor baseboard adds four serial ports, RS-232/422/485 buffering, an AC’97 audio CODEC, digital I/O, a second gigabit Ethernet LAN interface, and flexible via stackable PCI-104 or SUMIT expansion and an on-board FeaturePak module socket.