Diamond Systems CME-Atom

Introduction

Diamond’s CME-Atom computer-on-modules (COMs) are compact, low-power, and powerful embedded computing cores suitable for powering a wide range of embedded applications. To support real-world applications subject to temperature extremes, the modules are rated for operation over an enhanced temperature range.

Reduced Development Costs

By plugging these powerful, plug-and-play COMs into standard or custom application baseboards, OEMs can reduce development costs, minimize design risks, and shorten time-to-revenue while benefiting from the latest embedded technologies. The CME-Atom also comes pre-integrated in our Magellan Embedded-Ready Subsystem.

Highly Integrated

Each CME-Atom COM integrates a complete set of PC-compatible functions, including a low-power, high-performance Intel Atom Z510PT or Z530P processor and 1GB or 2GB of soldered-on system memory.

In addition, the module provides interface controllers for high-resolution VGA-, LVDS-, or SDVO-interfaced displays, 10/100/1000Mbps Ethernet, and SATA storage devices, as well as multiple USB 2.0, parallel, digital I/O, and audio ports.

Maximum Application Flexibility

For maximum application flexibility, the CME-Atom can be interfaced to application-specific circuitry via a choice of PCI Express, PCI, and LPC expansion buses.

COM Express Development Systems

In addition to the CME-Atom COMs themselves, Diamond offers pre-integrated development kits based on generic or application-oriented COM Express baseboards. This increases project efficiency and reduces risks by providing a known good environment for rapid application development.

To simplify the development process, these kits’ COM Express baseboards each provide I/O connectors for quick and easy access to nearly all system interfaces. They also come with SO-DIMM memory, an extensive set of interface cables, and full documentation and software.

In addition to these features, the COM Express form-factor baseboard adds four serial ports, RS-232/422/485 buffering, an AC’97 audio CODEC, digital I/O, a second gigabit Ethernet LAN interface, and flexible via stackable PCI-104 or SUMIT expansion and an on-board FeaturePak module socket.