Diamond Systems Magellan

Introduction

Magellan is a high performance, highly integrated board-level embedded-ready subsystem (ERS) that matches the footprint of the popular COM Express computer-on-module (COM) standard.

Magellan's CPU core consists of a COM Express CPU module and heatspreader mounted on its bottom side, resulting in optimal thermal management and increased space for I/O functions and connectors. This innovative design makes it possible for Magellan to integrate dual gigabit Ethernet LAN ports, a 7-30V DC/DC power supply, a full set of peripheral interface header connectors, stackable PCI-104 or SUMIT expansion, and a FeaturePak socket, in addition to a complete embedded-PC core -- all within the 95mm x 125mm COM Express footprint.

Magellan is offered in a range of models that vary according to the choice of COM Express CPU module and SDRAM capacity (socketed or soldered-on). It can be used either as a highly integrated embedded component, or as a platform for application development and reference designs.

The Magellan baseboard layer includes connectors and interfaces for USB, serial, gigabit Ethernet, audio, and SATA mass storage devices. It supports the connection of a wide variety of displays, including CRTs, LVDS-interfaced flat panels, and televisions. Power is supplied by means of a robust six-pin terminal block.

What is an 'Embedded-Ready Subsystem (ERS)'?

An Embedded-Ready Subsystem (ERS) combines the high-performance processing and leading-edge system I/O capabilities of computer-on-modules (COMs) with the modular expansion flexibility of stackable single board computers, all within a single compact, rugged, reliable, pre-integrated module. Additionally, the modules' large thermally-conductive baseplate provides both an efficient cooling solution and a standardized mounting-hole pattern that ensures interchangeability for alternate features or performance upgrades.

An ERS consists of three layers, as illustrated below. The central core of the ERS is its COM layer. Below the COM layer is the thermally-conductive baseplate layer. Above the COM layer is the application layer, which provides I/O interface connectors, expansion module sockets, and in many cases additional functionality

Magellan Cable Kit

The Magellan cable kit includes cables for Magellan input and output.

Software Support

Magellan runs Linux, Windows XP, Windows Embedded Standard, and Windows Embedded CE. All OS drivers are shipped with the product.

Development Systems

Complete Development Kits are available for Magellan with all the components you need to get started on your embedded design project. Each kit contains a Magellan ERS, cable kit, and software CD.