Kontron ETXexpress-CN8

Introduction

ETXexpress is the Module concept of the new open Standard COM Express (by PICMG). The new ETXexpress-CN8 module is based on the VIA C7 or Eden 7 processor as well as the VIA CN800 and VIA VT8251 chipset. PCI-Express is the primary data path for upcoming x86 based systems. Non PCIExpress components such as PCI plug-in cards can still be supported with the PCI 2.1 32 Bit Interface as ETXexpress COMs will continue supporting the PCI bus for legacy applications. The ETXexpress- CN8 will support 2 PCI Express x1 Lanes. Gigabit Ethernet for high connectivity and 8x USB 2.0 provides fast and sufficient interfaces for external peripherals.

ETXexpress COMs modules also will provide the following interfaces that are always located in the same physical position on each board, thus guaranteeing scalability between modules: PCIexpress, PCI32, USB, SerialATA, ParallelATA, LVDS Multi Media ports as well as an ACPI (Advanced Configuration and Power Interface) for optimised power management. Six mounting holes on the board provide secure mounting to allow the module increased shock and vibration resistance.

This next Generation COM takes you .... always a Jump ahead!

Heatspreader Concept

The heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the ETXexpress module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.