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Kontron Embedded Modules

Kontron ETXexpress®-MC

Most Robust and Power-Efficient COM Express™ Module

Speeds to 2.2GHz (Dual Core), Up To 4GB DDR2 CPU Memory
 
Kontron ETXexpress-MC
  
  • Intel® Core™ 2 Duo or Intel® Core™ Solo
  • DDR2-SDRAM up to 4GByte
  • Integrated GEN4 graphics, 24 bit LVDS support
  • Lower power consumption
  • 5x PCI Express Lanes
  • 8x USB 2.0 and 3x Serial ATA
  • Wide input supply support - 8.4V-18V
  • 10/100/1000Base-T Ethernet
  • Evaluation/adapter board available



Datasheet/Manual:

Kontron ETXexpress-MC datasheet in PDF format Datasheet in PDF format
Kontron ETXexpress-MC manual in PDF format Manual in PDF format

 

Introduction

Built around the Intel® Core™ 2 Duo processor (4MB L2, 800FSB) and Intel® GM965 chipset, the Kontron ETXexpress®-MC - a COM Express™ solution - is the most robust and power-efficient computer-on-module currently available. The Kontron ETXexpress®-MC offers support for GEN4 graphics to meet the requirements of embedded applications that require advanced video capabilities.

The Kontron ETXexpress®-MC is one of the first COM Express™ pin-out type 2 compliant modules supporting dual-channel memory up to 4GB via two DDR2 SO-DIMM sockets positioned on the top side of the module. This module has 5x PCI Express x1 lanes, 3x SerialATA ports, and 8x USB 2.0 ports along with Gigabit Ethernet to round out the list of standard features.

The inclusion of onboard TPM 1.2 ensures that the Kontron ETXexpress®-MC is a perfect fit for power and thermal sensitive designs which also require security features.

This next Generation COM takes you .... always a Jump ahead!

Heatspreader Concept

ETX heatspreaderThe heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the ETXexpress module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.
 

Specification

Compliance:

Fully COM Express™ Type 2 compliant

CPU:

Intel® Core™ Duo processors up to 2.2GHz
Intel® Core™ Solo (Celeron) processors up to 2.13 GHz
Refer to the ETXexpress Product Line Performance document for benchmark figures

Chipset:

Mobile Intel® 965GM Express chipset

DRAM:

Up to 2 x 2048 MB DDR2 SO-DIMM (2 x 200-pin)

Cache:

See CPU

Drives:

3 x Serial ATA, 1 x Parallel ATA

Ethernet:

Gigabit Ethernet (Intel® 82566MM)

I/O Ports:

8x USB 2.0 Ports for external peripherals

Graphics:

Integrated in Intel® 965GM chipset with
Intel® GMA X3100 graphics technology plus PCI Express Graphics 1 x16 lanes / Dual SDVO
LCD Panel Support: Single and Dual Channel LVDS
Resolution CRT: CRT up to 2048 x 1536
Resolution LVDS:LVDS up to UXGA (1600 x 1200), (JILI/ EDID support)
TV out: TV output. Component, S-Video or composite
HDTV Resolution: HDTV Support (480i / 480p / 720p / 1080i / 1080p)

Other:

Intel® High Definition Audio
AMI BIOS
LPC, JIDA Support, IrDA enhanced, WakeOnLAN, I²C Bus, E²PROM
BIOS Setup, JRC support, Suspend states (S0/S3/S4/S5/S1)
Power Management ACPI 2.0 (Advanced Configuration and Power Interface)
Watchdog

Expansion:

5 PCI Express x1 (1 PCIe x 4 possible), 1 PEG x16
PCI 2.1, 32 bit / 33MHz
See ETXexpress information page for more info

Size:

95 x 125mm
COM Express™ (by PICMG) “Basic” Form Factor Pin-out Type 2

Operating Systems:

Compatible Operating Systems
Windows® XP Embedded
Windows® XP
Windows® NT Embedded
Windows® CE (free toolkit available - supports .NET)
Windows® 2000
Linux
DOS
Contact us for others

Power:

Voltage: Wide range power input from 8.5V to 18V
Intel® Core™ 2 Duo T7500 2.2 GHz - 59.17W WinXP full load
Intel® Core™ 2 Duo L7500 1.6 GHz - 32.90W WinXP full load
Intel® Celeron® M 550 2.0 GHz - TBDW WinXP full load
Refer to the ETXexpress Product Line Power Consumption doc for further details (inc idle/standby/suspend/speedstep)

Environment:

Temperature operation: 0° to 60°C, storage: -10° to 85°C
Humidity operation: 10% to 90%, storage: 5% to 95% (non condensing)

ROHS Status:

This product is lead free/ROHS compliant.

Ordering Details:

Board:

38006-0000-22-2 ETXexpress®-MC T7500 Core™ 2 Duo T7500 (2 x 2.2 GHz BGA ,800 MHz FSB, 4 MB Cache 65 nm)
38006-0000-16-2 ETXexpress®-MC L7500 Core™ 2 Duo L7500 (2 x 1.6 GHz BGA, 800 MHz FSB, 4 MB Cache 65 nm)
38006-0000-21-1 ETXexpress®-MC 550 Celeron® M 550 (2.0 GHz BGA, 533 MHz FSB, 1 MB Cache, 65 nm)

Please note that boards are supplied with no cables, software or manuals.
Software/manuals are available electronically.

Accessories:

Kontron DDR2 SODIMM DRAM:
97011-2560-00-0 DDR2 SDRAM-256MB SODIMM MODULE 0° to 60°C
97011-5120-00-0 DDR2 SDRAM-512MB SODIMM MODULE 0° to 60°C
97011-1024-00-0 DDR2 SDRAM-1GB SODIMM MODULE 0° to 60°C
97011-2048-00-0 DDR2 SDRAM-2GB SODIMM MODULE 0° to 60°C

Swissbit DDR2 SODIMM DRAM:
601234 SEN06464D1B41MT-30R DDR2 SODIMM 512MB 667/CL5 COB STD TEMP 0° to 70°C
602489 SEN06464S2CG1MT-30R DDR2 SODIMM 512MB 667/CL5 SMT STD TEMP 0° to 70°C
601468 SEN12864D1B51MT-30R DDR2 SODIMM 1GB 667/CL5 SMT STD TEMP 0° to 70°C
602042 SEN01G64D1BG1MT-30R DDR2 SODIMM 1GB 667/CL5 SMT STD TEMP 0° to 70°C
402638 SEN12864S1BE1MT-37R DDR2 SODIMM 1GB 533/CL5 COB STD TEMP 0° to 70°C
601630 SEN12864S1BE1MT-30IR DDR2 SODIMM 1GB 667/CL5 COB EXT TEMP -25° to 85°C
402648 SEN25664S1BE2MT-30R DDR2 SODIMM 1GB 667/CL5 COB STD TEMP 0° to 70°C
602253 SEN02G64C4BG2MT-30R DDR2 SODIMM 2GB 667/CL5 SMT STD TEMP 0° to 70°C
601617 SEN25664C4B52MT-30R DDR2 SODIMM 2GB 667/CL5 SMT STD TEMP 0° to 70°C

38006-0000-99-0 ETXexpress®-MC heatspreader, threaded stand off
38006-0000-99-1 ETXexpress®-MC heatspreader, through hole stand off
38006-0000-99-0C02 ETXexpress®-MC heatsink/heatspreader assembly, no fan, threaded stand off, 25mm height
38006-0000-99-0C01 ETXexpress®-MC heatsink/heatspreader assembly, fan, threaded stand off, 25mm height

38110-0000-00-0 ETXexpress socket- 6 pair, 5mm standard stacking height
Sample package with 6 pair for 6 ETXexpress baseboards.

38100-0000-00-0 ETXexpress Eval BTX Evaluation Baseboard for ETXexpress modules (for 10/100 Ethernet)
38100-0000-00-1 ETXexpress Eval BTX Evaluation Baseboard for ETXexpress modules (for 10/100/1000 Ethernet)

Further Information:

Want further information or pricing on this product? Either fill out our feedback form or contact us for further information.
 
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