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Kontron ETXexpress®-MC

Most Robust and Power-Efficient COM Express™ Module

Speeds to 2.2GHz (Dual Core), Up To 4GB DDR2 CPU Memory

		Intel® Core™ 2 Duo or Intel® Core™ Solo DDR2-SDRAM up to 4GByte Integrated GEN4 graphics, 24 bit LVDS support Lower power consumption 5x PCI Express Lanes 8x USB 2.0 and 3x Serial ATA Wide input supply support - 8.4V-18V 10/100/1000Base-T Ethernet Evaluation/adapter board available Datasheet/Manual: ETXexpress-MC Datasheet - PDF ETXexpress-MC Manual - PDF COM Express Concept Whitepaper - PDF COM Express Design -PDF

Introduction

Built around the Intel® Core™ 2 Duo processor (4MB L2, 800FSB) and Intel® GM965 chipset, the Kontron ETXexpress®-MC - a COM Express™ solution - is the most robust and power-efficient computer-on-module currently available. The Kontron ETXexpress®-MC offers support for GEN4 graphics to meet the requirements of embedded applications that require advanced video capabilities.

The Kontron ETXexpress®-MC is one of the first COM Express™ pin-out type 2 compliant modules supporting dual-channel memory up to 4GB via two DDR2 SO-DIMM sockets positioned on the top side of the module. This module has 5x PCI Express x1 lanes, 3x SerialATA ports, and 8x USB 2.0 ports along with Gigabit Ethernet to round out the list of standard features.

The inclusion of onboard TPM 1.2 ensures that the Kontron ETXexpress®-MC is a perfect fit for power and thermal sensitive designs which also require security features.

This next Generation COM takes you .... always a Jump ahead!

Heatspreader Concept

ETX heatspreader The heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the ETXexpress module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.

Kontron have two different heatspreaders for this ETXexpress module. One with threaded post and one with through hole posts. Kontron also have two heatspreader/heatsink assemblies (again one threaded, one through hole). The heatsink is 17 mm tall (in addition to the heat spreader thickness which is 2mm). For the active cooled version, the fan is recessed into the heatsink. Drawings of all four assemblies are available on request.

Specification

Compliance:

Fully COM Express™ Type 2 compliant

CPU:

Intel® Core™ Duo processors up to 2.2GHz
Intel® Core™ Solo (Celeron) processors up to 2.13 GHz
Refer to the ETXexpress Product Line Performance document for benchmark figures

Chipset:

Mobile Intel® 965GM Express chipset

DRAM:

Up to 2 x 2048 MB DDR2 SO-DIMM (2 x 200-pin)

Cache:

See CPU

Drives:

3 x Serial ATA, 1 x Parallel ATA

Ethernet:

Gigabit Ethernet (Intel® 82566MM)

I/O Ports:

8x USB 2.0 Ports for external peripherals

Graphics:

Integrated in Intel® 965GM chipset with
Intel® GMA X3100 graphics technology plus PCI Express Graphics 1 x16 lanes / Dual SDVO
LCD Panel Support: Single and Dual Channel LVDS
Resolution CRT: CRT up to 2048 x 1536
Resolution LVDS:LVDS up to UXGA (1600 x 1200), (JILI/ EDID support)
TV out: TV output. Component, S-Video or composite
HDTV Resolution: HDTV Support (480i / 480p / 720p / 1080i / 1080p)

Other:

Intel® High Definition Audio
AMI BIOS
LPC, JIDA Support, IrDA enhanced, WakeOnLAN, I²C Bus, E²PROM
BIOS Setup, JRC support, Suspend states (S0/S3/S4/S5/S1)
Power Management ACPI 2.0 (Advanced Configuration and Power Interface)
Watchdog

Expansion:

5 PCI Express x1 (1 PCIe x 4 possible), 1 PEG x16
PCI 2.1, 32 bit / 33MHz
See ETXexpress information page for more info

Size:

95 x 125mm
COM Express™ (by PICMG) “Basic” Form Factor Pin-out Type 2

Operating Systems:

Compatible Operating Systems
Windows 7 (32 bit and 64 bit)
Windows Vista (32 bit and 64 bit)
Windows® XP Embedded
Windows® XP (32 bit and 64 bit)
Linux
Contact us for others

Power:

Voltage: Wide range power input from 8.5V to 18V

	100% CPU load all cores, WinXP	50% CPU load on one core, WinXP	Working (S0/G0) WinXP Idle	Standby (STR, S3)	Soft Off (S5/G2)
Intel® Core™ 2 Duo T7500, 2.2 GH	60.40W	23.29W	10.67W	1655mW	1275mW
Intel® Core™ 2 Duo L7500, 1.6 GHz	32.44W	15.09W	9.77W	1625mW	1295mW
Intel® Celeron® M 550, 2.0 GHz	31.31W	18.83W	11.55W	1655mW	1295mW

Environment:

Temperature operation: 0° to 60°C, storage: -10° to 85°C
Humidity operation: 10% to 90%, storage: 5% to 95% (non condensing)

ROHS Status:

This product is lead free/ROHS compliant.

Ordering Details:
Board:	38006-0000-22-2 ETXexpress®-MC T7500 Core™ 2 Duo T7500 (2 x 2.2 GHz BGA ,800 MHz FSB, 4 MB Cache 65 nm) 38006-0000-16-2 ETXexpress®-MC L7500 Core™ 2 Duo L7500 (2 x 1.6 GHz BGA, 800 MHz FSB, 4 MB Cache 65 nm) 38006-0000-21-1 ETXexpress®-MC 550 Celeron® M 550 (2.0 GHz BGA, 533 MHz FSB, 1 MB Cache, 65 nm) Please note that boards are supplied with no cables, software or manuals. Software/manuals are available electronically.
Accessories:	38006-0000-99-0 ETXexpress®-MC heatspreader, threaded stand off 38006-0000-99-1 ETXexpress®-MC heatspreader, through hole stand off 38006-0000-99-0C02 ETXexpress®-MC heatsink/heatspreader assembly, no fan, threaded stand off, 25mm height 38006-0000-99-0C01 ETXexpress®-MC heatsink/heatspreader assembly, fan, threaded stand off, 25mm height Kontron DDR2 SODIMM DRAM: 97011-2560-00-0 DDR2 SDRAM-256MB SODIMM MODULE 0° to 60°C 97011-5120-00-0 DDR2 SDRAM-512MB SODIMM MODULE 0° to 60°C 97011-1024-00-0 DDR2 SDRAM-1GB SODIMM MODULE 0° to 60°C 97011-2048-00-0 DDR2 SDRAM-2GB SODIMM MODULE 0° to 60°C Swissbit DDR2 SODIMM DRAM: 601234 SEN06464D1B41MT-30R DDR2 SODIMM 512MB 667/CL5 COB STD TEMP 0° to 70°C 602489 SEN06464S2CG1MT-30R DDR2 SODIMM 512MB 667/CL5 SMT STD TEMP 0° to 70°C 601468 SEN12864D1B51MT-30R DDR2 SODIMM 1GB 667/CL5 SMT STD TEMP 0° to 70°C 602042 SEN01G64D1BG1MT-30R DDR2 SODIMM 1GB 667/CL5 SMT STD TEMP 0° to 70°C 402638 SEN12864S1BE1MT-37R DDR2 SODIMM 1GB 533/CL5 COB STD TEMP 0° to 70°C 601630 SEN12864S1BE1MT-30IR DDR2 SODIMM 1GB 667/CL5 COB EXT TEMP -25° to 85°C 402648 SEN25664S1BE2MT-30R DDR2 SODIMM 1GB 667/CL5 COB STD TEMP 0° to 70°C 602253 SEN02G64C4BG2MT-30R DDR2 SODIMM 2GB 667/CL5 SMT STD TEMP 0° to 70°C 601617 SEN25664C4B52MT-30R DDR2 SODIMM 2GB 667/CL5 SMT STD TEMP 0° to 70°C 38110-0000-00-0 ETXexpress socket- 6 pair, 5mm standard stacking height Sample package with 6 pair for 6 ETXexpress baseboards. 38100-0000-00-0 ETXexpress Eval BTX Evaluation Baseboard for ETXexpress modules (for 10/100 Ethernet) 38100-0000-00-1 ETXexpress Eval BTX Evaluation Baseboard for ETXexpress modules (for 10/100/1000 Ethernet) 96007-0000-00-1 ADA-LVDS-DVI adaptor to connect from LVDS (JILI) to DVI, inc flatfoil cable 96007-0000-00-2 ADA-LVDS-DVI adaptor to connect from LVDS (JILI, 18 bit only) to DVI, inc flatfoil cable
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