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Kontron ETXexpress®-PCCOM Express™ with Energy Saving 45nm Intel® Core™2 Duo CPUSpeeds to 2.26GHz (Dual Core), Up To 8GB DDR3 Memory, SATA RAID |
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Datasheet/Manual:
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IntroductionThe ETXexpress®-PC module unifies the latest 45 nm generations of Intel® Core™ 2 Duo processors with the new SSE4 instruction set and the latest chipset Intel® GS45. This combination really sets new standards in many terms: more performance than ever on COM Express™ form factor, outstanding performance to -power ratio, fast DDR3 SO-DIMM memory up to 8 GB and L2 cache up to 6 MB, the module really opens up new application fields. ETXexpress®-PC is assembled with Intel® small form factor package: for instance, the ICH9M was shrunk from 961 mm² to 256 mm². Thus, valuable space for further features is gained: among others two stacked SO-DIMM sockets for dual channel memory. On top of that, Intel® small form factor package processors allow operations in ultra low voltage for best energy efficiency. Especially, its 4 SerialATA ports and the native RAID support establishes the ETXexpress®-PC perfectly for heavy data sensitive applications. On top of all that, DirectX® 10 supports Windows Vista® perfectly. Like all Kontron ETXexpress® modules, it is strictly compliant to the COM Express™ standard. Therefore, upgrading existing carrier boards gets so easy and minimizes redesign efforts. This next Generation COM takes you .... always a Jump ahead! Heatspreader Concept
Kontron have two different heatspreaders for this ETXexpress module. One with threaded post and one with through hole posts. Kontron also have eight heatspreader/heatsink assemblies. Drawings of all assemblies are available on request. |
Specification |
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Compliance: |
Fully COM Express™ Type 2 compliant |
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CPU: |
Intel® Core™ 2 Duo up to 2,26 GHz, 45 nm, 6 MB L2 Cache |
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Chipset: |
Intel® GS45, Intel® ICH9M SFF |
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DRAM: |
Up to 8 GB DDR3 SO-DIMM 800/1066 dual channel |
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Cache: |
See CPU |
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Drives: |
4x SerialATA 300 (AHCI; RAID 0,1,10,5), 1x PATA |
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Ethernet: |
10/100/1000 MBit |
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I/O Ports: |
USB 8x USB 2.0 Ports for external peripherals |
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Graphics: |
Intel® GMA X4500 integrated in Intel® GS45 (DirectX® 10, PS 4.0, DVMT 4.0)
1 PEG x16 |
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Other: |
Intel® High Definition Audio |
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Expansion: |
5 PCI Express x1 (1 PCI Express x4 possible), 1 PEG x16 |
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Size: |
95 x 125mm |
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Operating Systems: |
Compatible Operating Systems |
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Power: |
Voltage: 12V DC +/- 5% or wide range power input from 8.5V to 18V
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Environment: |
Temperature operation: 0° to 60°C, storage: -10° to
85°C |
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ROHS Status: |
This product is lead free/ROHS compliant. |
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| Ordering Details: | |
Board: |
38008-0000-23-2 ETXexpress®-PC SP9300 Intel® Core™2 Duo SP9300, 2,26 GHz, 6 MB L2 Cache 38008-0000-19-2EXT ETXexpress®-PC SL9400 Intel® Core™2 Duo SL9400 Low Voltage, 1,86 GHz, 6 MB L2 Cache, E1 (-25°C to +75°C) 38009-0000-25-2 ETXexpress®-PC PP with Intel® Core™2 Duo T9400, 2.53 GHz, 6 MB L2 Cache, Intel® GM45 Please note that boards are supplied with no cables, software or
manuals. |
Accessories: |
38008-0000-99-0 ETXexpress®-PC heatspreader, threaded stand off 38008-0000-99-0C01 1.1 ETXexpress®-PC Active cooling solution (standard), threaded Kontron DDR2 SODIMM DRAM: 38110-0000-00-0 ETXexpress socket- 6 pair, 5mm standard stacking height 38100-0000-00-0 ETXexpress Eval BTX Evaluation Baseboard for ETXexpress modules (for 10/100 Ethernet) |
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ORDER ONLINE - these products are available to order on our online webshop. |
Further Information: |
Want further information or pricing on this product? Either fill out our feedback form or contact us for further information. |
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The
heat-spreader is a 2mm thick aluminium plate. It provides a thermal
interface surface for heat removal from the ETXexpress module. The heat-spreader
is thermally coupled to the CPU die or package surface, and it may
also be coupled to other heat generating devices on the module (e.g.
chipset, vga chip). The heat spreader is not intended as a heat
sink, although it may be suitable for this purpose on low power
modules operating under benign conditions. Higher power modules
or higher temperature conditions will probably require heat removal
devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.)
to be attached to the heatspreader, or it may need to be thermally
coupled to a chassis.