Kontron ETXexpress-PM

Introduction

ETXexpress is the Module concept of the new open Standard COM Express (by PICMG). The new ETXexpress- PM module is based on the Intel® Pentium® M and Intel® Celeron® M processors as well as the Intel 915GM chipset. PCI-Express is the primary data path for upcoming x86 based systems. Non PCI-Express components such as PCI plug-in cards can still be supported with the PCI 2.1 32 Bit Interface as ETXexpress COMs will continue supporting the PCI bus for legacy applications.

The ETXexpress-PM will support 4 PCI Express x1 Lanes and PCI Express cards as well as established hardware solutions based on current busses such as 32 bit PCI. For applications that require advanced real-time video capabilities, the ETXexpress- PM has both Intel® Extreme Graphics 2 and PCI Express graphics 1x16. Fast communications are possible courtesy of the 10/100Fast-T Ethernet port that will be upgraded to be Gigabit ready in future ETXexpress COMs. 8x USB 2.0 provides fast and sufficient interfaces for external peripherals. ETXexpress COMs modules also will provide the following interfaces that are always located in the same physical position on each board, thus guaranteeing scalability between modules: PCI- express, PCI32, USB, serial ATA, parallel ATA, LVDS Multi Media ports as well as an ACPI (Advanced Configuration and Power Interface) for optimised power management. Six mounting holes on the board provide secure mounting to allow the module increased shock and vibration resistance.

This next Generation COM takes you .... always a Jump ahead!

Heatspreader Concept

The heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the ETXexpress module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.