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Kontron ETX-P3TAll-In-One PC module with Intel ® CeleronT processor400MHz, 733MHz or 1GHz CPU Processor Versions |
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Datasheet/Manual:
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IntroductionThe ETX-P3T component SBC module is using the Intel i815E chipset and powerful Intel® Celeron® Processors. Reduced CPU voltage and SpeedStep® support ensure the highest performance achievable on ETX at reasonable power consumption. Improved power management is achieved using both ACPI/APM 1.2 allowing for fanless-cooling and extended battery life. In addition to standard ETX features, the ETX-P3T supports four USB 2.0 ports, DVO option instead of LVDS, up to 512MByte SDRAM, 10/ 100 Base-T Ethernet, keyboard/ mouse controllers, real-time clock, and watchdog timer. ETX modules are like components, plugging on to an application-specific baseboard supplying the core CPU and memory subsystems together with sound, SVGA, Ethernet and standard PC I/O. They connect to the rest of the embedded system through high-density, low profile, surface-mount connectors, which carry both ISA and PCI bus signals as well as dedicated I/O interfaces. The mechanics of the interconnection is such that an ETX/baseboard combination is virtually the same as height a one-board solution. ETX modules are scalable and interchangeable, and they make possible the rapid development of semi-custom solutions for embedded applications. With Kontron You stay...always a Jump ahead! Heatspreader Concept
Supported Flat PanelsThe list of supported panels is now too large to show in a single webpage, they are now shown in the 'flat panel selector'. To run the flat panel selector, click here and choose the ETX-P3T as the model to see what panels are supported. |
Specification |
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| CPU: | ETX-P3T 4000 Celeron® 400 MHz |
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| DRAM: | 1 144pin SODIMM socket, max. 512MByte SDRAM |
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| Drives: | Two enhanced IDE ports, DMA-33 capable |
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| Ethernet: | 10/100Base-T, Intel 82551ER |
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| Sound: | VIA, AC97 based audio |
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| I/O Ports: | Serial interfaces - 2 x TTL. |
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| Graphics: | Intel 82815 with integrated Graphics Core (BGA544) |
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| Other: | E²PROM BIOS Setup, JRC support, RTC, Watchdog, JIDA Support,
IrDA enhanced |
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| Expansion: | |||||||||||||||||
| Size: | 95 x 114mm (3.7x4.5“) |
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| Operating Systems: | Windows® XP Embedded |
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| Power: | 5V only
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| Environment: | Temperature: operation: 0° to 60°C,storage: -25° to
85°C |
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| ROHS Status: | This product is lead free/ROHS compliant. | ||||||||||||||||
| Ordering Details: | |
| Board: |
18020-0000-40-1 ETX-P3T 4000
with INTEL® Celeron® III 400 MHz ULV IMPORTANT: The ETX-P3T has now reached EOL LAST TIME BUY: 31st December 2007 Existing customer's are recommended to consider either the ETX-LX or ETX-PM. The ETX-P3T modules do not come with a heatspreader Please note that boards are supplied with no cables, software or
manuals. |
| Accessories: | 97005-6400-00-3 SDRAM-SODIMM-64M (64MB
SDRAM SODIMM memory) 18010-0000-00-S ETX Starter Kit Starter kit contains ETXeval board,CD-ROM, no memory, FDD, docs & PSU (add ETX module, DRAM & heatspreader to suit) 18020-0000-99-0 HSP-P3T Heatspreader threaded
stand off heatspreader 18010-0000-00-0 ETXeval - ATX ETX Evaluation Board 18011-0000-00-0 ETX SAMPLE SMT receptacle connector
for ETX (2.5mm tall, 4 pcs) 18017-0000-00-0 ETX MOUNTING KIT (For one board,
2.5mm height) |
| Further Information: | Want further information or pricing on this product? Either fill out our feedback form or contact us for further information. |
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The
heat-spreader is a 2mm thick aluminium plate. It provides a thermal
interface surface for heat removal from the ETX module. The heat-spreader
is thermally coupled to the CPU die or package surface, and it may
also be coupled to other heat generating devices on the module (e.g.
chipset, vga chip). The heat spreader is not intended as a heat
sink, although it may be suitable for this purpose on low power
modules operating under benign conditions. Higher power modules
or higher temperature conditions will probably require heat removal
devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.)
to be attached to the heatspreader, or it may need to be thermally
coupled to a chassis.