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Kontron Embedded Modules

Kontron ETXexpress®-SC

High Performance COM Express™ with Intel® Core™ i7/i5

Speeds to 2.5GHz (Dual/Quad Core), Up To 16GB DDR3 Memory, SATA RAID
 
Kontron ETXexpress-SC
  
  • Intel® Core™ i7 2715QE (4x 2.1GHz, 6M L2) 32nm
  • Intel® Core™ i5 2515E (2x 2.5GHz, 3M L2) 32nm
  • DDR3-SDRAM up to 16GB
  • 6 PCI-Express gen2 x1 lanes
  • 1 PCI Express Graphic gen2 x16 lanes
  • PCI 2.3, 32bit, 66MHz
  • Windows Vista/7/XP/XPe Support
  • Onboard video with LCD support
  • 8x USB 2.0 & Intel® high definition audio
  • 2x SerialATA 600, 2x SerialATA 300
  • 10/100/1000Base-T Ethernet
  • Evaluation/adapter board available



Datasheet/Manual:

Kontron ETXexpress-SC datasheet in PDF format ETXexpress-SC Datasheet - PDF
COM Express Concept Whitepaper in PDF format COM Express Concept Whitepaper - PDF
COM Express Concept Whitepaper in PDF format COM Express Design -PDF

 

Introduction

The Kontron ETXexpress®-SC Computer-on-Modules integrate the new monolithic Intel® microarchitecture with a CPU, graphics and ECC memory controller as well as a PCI Express controller all on an energy-efficient 32 nm die. First benchmarks show a performance gain of 205 percent for the CPU (Dhrystone Alu MIPS) and a 170 percent graphics performance improvement (3DMark06) as compared to platforms with the previous Intel® Core™ i7 processor and comparable core speed. Additionally users benefit from a 20 percent performance/watt ratio improvement on average compared to designs with the previous Intel® Core™ processor architecture. This enables new Computer-On-Module based applications, with an unmatched level of performance, to fit within a tight thermal envelope. Furthermore, with the new Intel® iGFX® Gen6 graphics, 2D and 3D graphics performance, now on par with dedicated graphics cards, is readily available. Applications that are built around the Kontron ETXexpress®-SC will be able to simultaneously utilize two high-quality HD video streams, enabling economic multi-display solutions with one platform supporting several displays. Technologies, like the latest 3D BluRay for infotainment solutions, will also be supported. With PCI Express 2.0, the data transfer rates to external components are doubled as compared to previous solutions. The Kontron ETXexpress®-SC features up to seven PCI Express lanes and the PCI Express graphics port (PEG) can be split variably into dedicated lanes (x8, x4, x1) to link extra peripheral components resulting in even more flexibility for the overall solution. This makes the new Computer-on-Module an ideal fit for feature-rich, graphics-oriented applications such as Digital-Signage servers running several displays, gaming systems and high-performance medical appliances.

The Kontron ETXexpress®-SC is available with:

  • Intel® Core™ i7-2715QE (4x 2.1 GHz)
  • Intel® Core™ i5-2515E (2x 2.5 GHz)

This next Generation COM takes you .... always a Jump ahead!

Heatspreader Concept

ETX heatspreaderThe heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the ETXexpress module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.

Kontron have two different heatspreaders for this ETXexpress module. One with threaded post and one with through hole posts. Kontron also have two heatspreader/heatsink assemblies (again one threaded, one through hole). For the active cooled version, the fan is recessed into the heatsink. Drawings of all four assemblies are available on request.
 

Specification

Compliance:

Fully COM Express™ Type 2 or Type 6 compliant

CPU:

Intel® Core™ i7-2715QE (4x 2.1 GHz, 6MB L2 cache)
Intel® Core™ i5-2515E (2x 2.5 GHz, 3MB L2 cache)
Further CPU Core™ i7, i5, i3 and Celeron® variants will follow later
Refer to the ETXexpress Product Line Performance document for benchmark figures
To compare the processor range, refer to the Intel website

Chipset:

Intel® Mobile QM67

DRAM:

Up to 16 GB DDR3 SO-DIMM, Dual Channel with ECC support
800/1066/1333 MHz

Cache:

See CPU

Drives:

Type 2: 2x SATA with 6 Gb/s, 2x SATA with 3 Gb/s, 1x PATA
Type 6: 2x SATA with 6 Gb/s, 2x SATA with 3 Gb/s

Ethernet:

10/100/1000 MBit Ethernet, Intel® 82579

I/O Ports:

Type 2: 8x USB 2.0 (UHCI/EHCI)
Type 6: 2x USB 3.0 (xHCI) and 6x USB 2.0 (UHCI/EHCI) or alternatively 8x USB 2.0 (UHCI/EHCI)

Graphics:

Intel® iGFX HD3000 (Gen6) integrated: DirectX® 10.1, PS 4.0, OpenGL 3.0, De-/Encoder for MPEG2, VC-1, Blu-ray support (3D), HDCP 1.4, Dual Independent Display Support
Type 2:

  • 1x DisplayPort/embedded DP/SDVO/HDMI/DVI multiplexed with PEG,
  • 1x CRT up to QXGA (2048x1536),
  • 1x Dual Channel LVDS 18/24 bit up to UXGA (1600x1200)

Type 6:

  • 1x DDI: SDVO/DisplayPort/HDMI/DVI,
  • 1x DDI: DisplayPort/embedded DP/HDMI/DVI,
  • 1x DDI: DisplayPort/HDMI/DVI,
  • 1x CRT up to QXGA (2048x1536),
  • 1x Dual Channel LVDS 18/24 bit up to UXGA (1600x1200)

Other:

Intel® High Definition Audio
Infineon TPM 1.2 SLB9635TT, Intel® TXT support
Suspend Modes (S1, S3, S4, S5)
POSCAP capacitors, ACPI 3.0, SPI, LPC, K-station and JIDA driver support, Staged Watchdog, RTC, S5 Eco, Fast I²C

Expansion:

Type 2 module:

  • 5x PCI Express gen2 x1, 1x PEG gen2 x16
  • PCI 2.3, 32 bit / 33 MHz PCI bus

Type 6 module:

  • 7x PCI Express gen2 x1, 1x PEG gen2 x16
  • No PCI

See ETXexpress information page for more info

Size:

95 x 125mm

Operating Systems:

Compatible Operating Systems
Windows 7 (32bit and 64bit)
Windows Vista (32bit and 64bit)
Windows® XP
Windows® XP Embedded
Windows® XP
VxWORKS
Linux
Contact us for others

Power:

Voltage: Wide range power input from 8 V - 18 V
Power Consumption: tbd

Environment:

Temperature operation: 0° to 60°C, storage: -10° to 85°C
Humidity operation: 10% to 90%, storage: 5% to 95% (non condensing)

ROHS Status:

This product is lead free/ROHS compliant.

Ordering Details:

Board:

ETXexpress®-SC COM Express® Pin-out Type 2
38013-0000-21-4 ETXexpress®-SC i7-2715QE (4x 2.1 GHz) (Turbo 2.0, Hyperthreading), 6 MB L2 Cache, Intel® QM67
38013-0000-22-2 ETXexpress®-SC i7-2655LE (2x 2.2 GHz LV) (Turbo 2.0, Hyperthreading), 4 MB L2 Cache, Intel® QM67
38013-0000-15-2 ETXexpress®-SC i7-2610UE (2x 1.5 GHz) (Turbo 2.0, Hyperthreading), 4 MB L2 Cache, Intel® QM67
38013-0000-25-2 ETXexpress®-SC Intel® i5-2515E (2x 2.5 GHz) (Turbo 2.0, Hyperthreading), 3 MB L2 Cache, Intel® QM67
38013-0000-21-2 ETXexpress®-SC i3-2310E (2x 2.1 GHz) (Hyperthreading), 3 MB L2 Cache, Intel® QM67
38013-0000-13-2 ETXexpress®-SC i3-2340UE (2x 1.3 GHz) (Hyperthreading), 3 MB L2 Cache, Intel® QM67
38013-0000-16-1 ETXexpress®-SC Celeron® B810E (2x 1.6 GHz), 2 MB L2 Cache, Intel® HM65
38013-0000-11-1 ETXexpress®-SC Celeron 847E (2x 1.1 GHz), 2 MB L2 Cache, Intel® HM65
38013-0000-14-0 ETXexpress®-SC Celeron 827E (1x 1.4 GHz), 2 MB L2 Cache, Intel® HM65

ETXexpress®-SC COM Express® Pin-out Type 6
38014-0000-21-4 ETXexpress®-SC i7-2715QE (4x 2.1 GHz) (Turbo 2.0, Hyperthreading), 6 MB L2 Cache, Intel® QM67
38014-0000-22-2 ETXexpress®-SC i7-2655LE (2x 2.2 GHz LV) (Turbo 2.0, Hyperthreading), 4 MB L2 Cache, Intel® QM67
38014-0000-15-2 ETXexpress®-SC i7-2610UE (2x 1.5 GHz) (Turbo 2.0, Hyperthreading), 4 MB L2 Cache, Intel® QM67
38014-0000-25-2 ETXexpress®-SC i5-2515E (2x 2.5 GHz) (Turbo 2.0, Hyperthreading), 3 MB L2 Cache, Intel® QM67
38014-0000-21-2 ETXexpress®-SC i3-2310E (2x 2.1 GHz) (Hyperthreading), 3 MB L2 Cache, Intel® QM67
38014-0000-13-2 ETXexpress®-SC i3-2340UE (2x 1.3 GHz LV) (Hyperthreading), 3 MB L2 Cache, Intel® QM67
38014-0000-11-1 ETXexpress®-SC Celeron® 847E (2x 1.1 GHz), 2 MB L2 Cache, Intel® HM65
38014-0000-16-1 ETXexpress®-SC Celeron® B810E (2x 1.6 GHz), 2 MB L2 Cache, Intel® HM65

Please note that boards are supplied with no cables, software or manuals.
Software/manuals are available electronically.

Accessories:

Kontron DDR3 SODIMM DRAM (non ECC):
97015-1024-10-0 DDR3-SODIMM-1GB - DDR3 SDRAM SODIMM memory module with 1GB 0° to 60°C
97015-2048-10-0 DDR3-SODIMM-2GB - DDR3 SDRAM SODIMM memory module with 2GB 0° to 60°C
97015-4096-10-0 DDR3-SODIMM-4GB - DDR3 SDRAM SODIMM memory module with 4GB 0° to 60°C

Kontron DDR3 SODIMM DRAM (ECC):
97016-1024-13-0 DDR3-SODIMM-1GB - DDR3 SDRAM SODIMM ECC memory module with 1GB 0° to 60°C
97016-2048-13-0 DDR3-SODIMM-2GB - DDR3 SDRAM SODIMM ECC memory module with 2GB 0° to 60°C
97016-4096-13-0 DDR3-SODIMM-4GB - DDR3 SDRAM SODIMM ECC memory module with 4GB 0° to 60°C

38013-0000-99-0C05 Active Heatsink for ETXexpress®-SC, threaded, with fan and setscrew
38013-0000-99-0 Heatspreader for ETXexpress®-SC, threaded, use for Dual Core modules only

38110-0000-00-0 ETXexpress socket- 6 pair, 5mm standard stacking height
Sample package with 6 pair for 6 ETXexpress baseboards.

38100-0000-00-0 ETXexpress Eval BTX Evaluation Baseboard for ETXexpress modules (for 10/100 Ethernet)
38100-0000-00-1 ETXexpress Eval BTX Evaluation Baseboard for ETXexpress modules (for 10/100/1000 Ethernet)

Further Information:

Want further information or pricing on this product? Either fill out our feedback form or contact us for further information.
 
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