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Kontron microETXexpress-DCmicroETXexpress Module With Intel® Atom™ N270 1.6GHz45 nm with Hyperthreading, Up To 2GB DDR2 Memory |
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Datasheet/Manual:
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IntroductionmicroETXexpress®-DC - the small economic Intel® Atom™ solution. The microETXexpress®-DC brings latest 45 nm performance generations of Intel® Atom™ N270 processor with 1.6 GHz and the Intel® 945GSE and ICH7M chipset to a compact 95 x 95 mm module. Kontron’s new high-efficient power-off state S5 Eco enables ACPI features and lowest power-consumption in soft-off state – less than 1 mA. Compared to the regular S5 state this means a reduction by at least factor 200! Battery uptime therefore goes up dramatically. Like all Kontron microETXexpress® modules, it is fully compatible to the COM Express™ Pin-out Type 2. Therefore, upgrading existing carrier boards originally designed for COM Express™ basic gets easy and minimizes redesign efforts. Heatspreader Concept
Kontron have two different heatspreaders for this module. One with threaded post and one with through hole posts. Kontron also have three heatspreader/heatsink assemblies -one active cooled (threaded only) and two passive cooled (threaded and through hole versions). For the active cooled version, the fan is recessed into the heatsink. Drawings of all four assemblies are available on request. |
Specification |
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Compliance: |
Fully COM Express™ Pin-out Type 2 compatible |
CPU: |
Intel® Atom™ N270 with 1.6 GHz |
Chipset: |
Intel® 945GSE, Intel® ICH7M |
DRAM: |
Up to 2 GB DDR2 (533) SO-DIMM |
Buses: |
PCI 2.3, 32 bit / 33 MHz |
Drives: |
2x SerialATA (AHCI) |
Ethernet: |
10/100/1000 MBit Ethernet, Intel® 82574L |
I/O Ports: |
8x USB 2.0 |
Graphics: |
Integrated with Intel® Graphics Media Accelerator (GMA950, DirectX® 9, PS 2.0) |
Resolutions: |
Up to 1600x1200 LCD |
Other: |
Evaluation baseboard will be available |
Expansion: |
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Size: |
95 x 95mm |
Operating Systems: |
Windows ® 7 (32 bit) |
Power: |
max. 12W estimated, Economic Power-Off State |
Environment: |
Temperature: operation: 0° to 60°C,storage: -10° to
85°C |
Shock and Vibration: |
IEC 60068-2-27 and IEC 60068-2-6 |
ROHS Status: |
This product is lead free/ROHS compliant. |
| Ordering Details: | |
Board: |
36005-0000-16-2 microETXexpress®-DC Intel® Atom™ N270 with 1.6 GHz, 512 kB L2 Cache The microETXexpress-DC modules come without a heatspreader Please note that boards are supplied with no cables, software or
manuals. |
Accessories: |
Kontron DDR2 SODIMM DRAM: Swissbit DDR2 SODIMM DRAM: 36005-0000-99-0 Heatspreader for microETXexpress®-DC, threaded stand off 38100-0000-00-0 ETXexpress Eval BTX Evaluation Baseboard for ETXexpress modules (for 10/100 Ethernet) 38110-0000-00-0 ETXexpress socket- 6 pair, 5mm standard stacking height |
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ORDER ONLINE - these products are available to order on our online webshop. |
Further Information: |
Want further information or pricing on this product? Either fill out our feedback form or contact us for further information. |
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The
heat-spreader is a 2mm thick aluminium plate. It provides a thermal
interface surface for heat removal from the ETX module. The heat-spreader
is thermally coupled to the CPU die or package surface, and it may
also be coupled to other heat generating devices on the module (e.g.
chipset, vga chip). The heat spreader is not intended as a heat
sink, although it may be suitable for this purpose on low power
modules operating under benign conditions. Higher power modules
or higher temperature conditions will probably require heat removal
devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.)
to be attached to the heatspreader, or it may need to be thermally
coupled to a chassis.