Kontron microETXexpress-PC

Introduction

The microETXexpress®-PC brings latest 45 nm performance generations of Intel® Core™2 Duo processors with the new SSE4 instruction set and the latest chipset Intel® GS45 to a compact 95 x 95 mm module. Its performance is comparable to Kontron’s ETXexpress®-PC – a COM Express™ basic module.

microETXexpress®-PC sets new standards in many terms: more performance than ever on COM Express™ Pin-out Type 2 compatible 95 x 95 mm, outstanding performance-powerratio, fast DDR3 SO-DIMM memory up to 4 GB and L2 cache up to 6 MB. This new module opens up performance scalability to the top within Kontron’s microETXexpress® family.

microETXexpress®-PC is assembled with Intel® small form factor package: for instance, the ICH9M was shrunk from 961 mm² to 256 mm². This allows the assembly of a full featured high-end performance module on the small microETXexpress® form factor. On top of that, Intel® small form factor package processors allow operations in ultra low voltage for best energy-efficiency.

Especially, its 3 Serial ATA and 1 PATA ports establishes the microETXexpress®-PC for heavy data sensitive applications. With full DirectX® 10 capability, Windows® Vista is also supported.

Like all Kontron microETXexpress® modules, it is fully compatible to the COM Express™ Pin-out Type 2. Therefore, upgrading existing carrier boards originally designed for COM Express™ basic gets easy and minimizes redesign efforts.

This next Generation COM takes you .... always a Jump ahead!

Heatspreader Concept

The heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the ETX module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.