Kontron microETXexpress-PM

Introduction

ETXexpress is the Module concept of the new open standard ETXexpress/ COM Express (by PICMG). The new microETXexpress-PM module is based on the Intel® Pentium® M and Intel® Celeron® M processors as well as the Intel 855GME chipset. The Intel® Pentium®M processors feature the unique Enhanced Speed Step™ technology. Supporting up to 1Gbyte of DDR-SDRAM technology the memory bandwidth is no longer the performance bottleneck. The integrated Intel Extreme Graphics 2 video controller offers resolutions up to 2048x1536 pixel with 2D and 3D acceleration. The JILI display interface technology ensures automatic setting of the video controller parameters for the attached LCD panel.

The 6 USB channels support USB 2.0 with full bandwidth for the coming generations of I/O devices. The microETXexpress- PM is fully featured with PCI 2.1 bus, audio, ethernet and IDE interfaces. The modules are like components, plugging into an application specific baseboard. The modules supply the core CPU and memory subsystems together with sound, QXGA, Ethernet and standard PC I/O. They connect to the rest of the embedded system through high density, low profile ETXexpress connectors - for highest proven transfer rates, which carry PCI bus signals as well as dedicated interfaces. microETXexpress and ETXexpress modules are scaleable and interchangeable, and they make possible the rapid development of semi-custom solutions for embedded applications.

This next Generation COM takes you .... always a Jump ahead!

Heatspreader Concept

The heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the ETX module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip). The heat spreader is not intended as a heat sink, although it may be suitable for this purpose on low power modules operating under benign conditions. Higher power modules or higher temperature conditions will probably require heat removal devices (e.g. heat sink with fan, heat pipe, larger heatsink etc.) to be attached to the heatspreader, or it may need to be thermally coupled to a chassis.

Supported Flat Panels

The list of supported panels is now too large to show in a single webpage, they are now shown in the 'flat panel selector'. To run the flat panel selector, click here and choose the microETXexpress-PM as the model to see what panels are supported.