Kontron nanoETXexpress-SP

Introduction

This credit card sized module is compatible to COM Express™ pin-out Type 1. On 55 mm x 84 mm footprint nanoETXexpress-SP is a perfect fit for the next generation of low power, ultra-mobile applications that require energy saving x86 processor performance, high-end graphics, PCI Express and Serial ATA combined with longer battery life. These include handheld devices for medical or multi-media applications, small mobile data systems and a host of new applications that have not previously been possible due to size or power consumption limitations.

This new COM form factor is 100 percent compatible with the COM.0 Type 1 with respect to connector location and pin definition. Thus guaranteeing scalability between modules.

The Kontron nanoETXexpress-SP COM is based on the highly-efficient Intel® Atom™ 5XX processor series and Intel® System Controller Hub single chip that combines the memory controller, graphic engine and I/O in a single, space saving chipset design. With only one tenth of the Thermal Design Power and one seventh the size of ULV processors at an identical performance, the nanoETXexpress-SP COM offers an unprecedented power consumption/performance ratio for x86-based ultra-mobile designs.

The nanoETXexpress-SP with Flash and memory on-board support 1 PCI express x1 Lane (opt. 2 x1 if no onboard LAN), Serial ATA, LVDS, and High definition Audio. 10/100/1000 Gigabit Ethernet is designed in onboard for high connectivity and 8x USB 2.0 provides fast and sufficient interfaces for external peripherals.

All above mentioned requirements are supported by nanoETXexpress - small power - low size - high performance.

With Kontron You stay...always a Jump ahead!

Reduced Form Factor

The nanoETXexpress (55 mm x 84 mm) is just like a credit card and not even the half size of microETXexpress (95 mm x 95 mm).

The idea behind the nanoETXexpress is to have a readyto- use module on a really small footprint – a powerful replacement for legacy form factors like DIMM-PC®. Like the DIMM-PC module, the memory and the flash drive are directly soldered up on board. One side effect would be less flexibility but many customers prefer this due to far improved shock and vibration characteristics making the module ideal for rough environments.

Heatspreader Concept / Heatsink

The heat-spreader is a 2mm thick aluminium plate. It provides a thermal interface surface for heat removal from the nanoETXexpress module. The heat-spreader is thermally coupled to the CPU die or package surface, and it may also be coupled to other heat generating devices on the module (e.g. chipset, vga chip).

Additionally, a heatsink assembly (which consists of the heatspreader with an additional heatsink bonded to it) is also available.

To the right is an assembly consisting of:

• nanoETXexpress-SP module with Intel® Atom CPU
• 34001-0000-99-0C01 nanoETXexpress-SP Heatsink assembly
• 34100-0000-00-0 nanoETXexpress-HMI Baseboard

Starter Kit & Baseboard

A evaluation baseboard and starterkit (which contains the same baseboard) are available.