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Diamond Point International

MEN Mikro PX3 - Mini PCI Express® MVB Interface Card

MVB Interface EMD/ESD+ According to IEC 61375 (TCN Standard)

MEN Mikro PX3 - Mini PCI Express® MVB Interface Card
Key Features
Mini PCI Express® MVB Interface Card
32-bit RISC Processor
MVB Interface EMD/ESD+
MVB Bus Administrator
4096 Process Data ports
Message Data stack
Driver support for XP, Win7 and Linux
-40 to +85°C with qualified components

Introduction

The PX3 is a MVB (Multifunction Vehicle Bus) to Mini PCI Express® interface and consists of a MVB controller, a local CPU and a Mini PCI Express® slave interface. It supports the wire based physical layers EMD (Electrical Middle Distance) or ESD+ (Electrical Short Distance), with galvanic isolation. As part of the TCN (Train Communication Network) railway standard IEC 61375, the PX3 is designed to operate under harsh environmental conditions of -40 to +85°C, as is in accordance with EN 50155.

All features of the MVB architecture are supported and the PX3 is available in the configurations 'MDFULL', the passive MVB interface for Process Data (PD) communication, or 'SERVER', the active MVB interface for both Process Data and Message Data (MD) communication. A full range MVB bus administrator is available for all configurations.

The PX3 is equipped with a cable connector fieldbus to connect the MVB assembly interface, which features the two D-Sub connectors that can be mounted on a front panel and are used for the MVB connection.

The PX3 supports the operating systems Windows® XP, Windows® 7 and Linux. VxWorks® and QNX® are also available on request.

The PX3 is designed for use in railway applications and is fully compliant to the EN50155/EN50121 standards.

Specification

Function

InterfaceData rate: 1.5 Mbit/s

Data frame size: 16 - 256 bits

Cyclic transmission of process data (PD) (broadcast)
• Control and status information
• Periodic broadcast communication: 16-512 ms, 1 ms possible (real-time)
• Up to 4096 telegrams (ports), at max. 32 bytes each

Event driven message data transfer (MD) (point-to-point)
• For online diagnostics, passenger information in normal operation
• For firmware download and collecting debugging data in field service
• On demand communication
• Destination addressed
• Response time: > 0,5 sec

Bus Administrator communication manager (BA)
• Synchronous, time-multiplexed communication
• Transmission data sequence organization (master_frame - slave_frame)

Full redundancy support

Physical layers
• ESD + (Electrical Short Distance) or EMD (Electrical Middle Distance)
• 200 m (ESD+ and EMD), 32 nodes
• Galvanic isolation
• Compliant to TCN standard IEC 61375
OtherMemory
256 KB SRAM
• Traffic Memory for MVB interface
256 - 1280 KB SRAM
• General purpose memory
1 MB Flash

Software Structure Configurations
MDFULL
• Passive interface
• Communication capabilities: PD and BA
SERVER
• Active interface
• Communication capabilities: PD, MD and BA

Miscellaneous
Diagnostic by LED
• 4 diagnostic LEDs
• Used for self test purposes
• Displays the test number
• Indicates reason for failure
Reset Mechanism
• Onboard under-voltage supervision circuitry
Power Up (PLD Loading)
• Automatically loads the PLD chips after power-on
Connector(s)MVB Connectors
• Two 9-pin D-Sub interfaces via cable connected to the PCIe® Mini Card
• Both male (MVB 1) and female (MVB 2) D-Sub connectors
• M3 metric inner threading

General

ExpansionMini PCI Express® Interface
• One PCIe® 2.0 Gen1 compliant lane (2.5 Gbps), x1
• For data communication path between PX3 and host
ElectricalAs per miniPCIe specifications
MechanicalDimensions (L x W x H): 51 mm x 30.2 ±0.1 mm x 12.5 mm
SoftwareWindows® XP
Windows® 7
Linux (tested with Ubuntu 14.04 LTS)
VxWorks® (on request)
QNX® (on request)
TemperatureTemperature range (operation): -40..+85°C
Temperature range (storage): -40..+85°C
HumidityRelative humidity range (operation): max. 95% non-condensing
Relative humidity range (storage): max. 95% non-condensing
WeightWeight Mini PCI Express® card: 18 g
Weight MVB assembly: 14 g
AltitudeMax 1800 m
Vibration2 mm for 5 - 25 Hz
50 m/s² for 25 - 150 Hz
Shock50 m/s² (duration 50 ms)
EMCRFI susceptibility from 0,15 to 2000 MHz: 20 V/m (class FS2 in EN50155)
EN 50121-3-2:2006: Electromagnetic compatibility
IEC 61375-1:2007: MVB physical layer isolation
EN 50155:2007 12.2.9: Isolation measurement test/voltage resistance test
EN 50155:2007 4.1.3: Shock and vibration
IEC 61375-1:2007: MVB (Clause 3, Multifunction Vehicle Bus)
EN 60068-2-30:2006: Humidity
Warranty2 Years
RoHSCompliant

Ordering Details

Board15PX03A00
MVB ESD+ Device, Process Data, -40..+85°C with qualified components, conformal coating

15PX03A01
MVB ESD+ Device, Process and Message Data , -40..+85°C with qualified components, conformal coating

15PX03A02
MVB ESD+ Bus Administrator, Process Data, -40..+85°C with qualified components, conformal coating

15PX03A03
MVB ESD+ Bus Administrator, Process and Message Data , -40..+85°C with qualified components, conformal coating

15PX03B00
MVB EMD Device, Process Data, -40..+85°C with qualified components, conformal coating

15PX03B01
MVB EMD Device, Process and Message Data , -40..+85°C with qualified components, conformal coating

15PX03B02
MVB EMD Bus Administrator, Process Data, -40..+85°C with qualified components, conformal coating

15PX03A00
MVB EMD, Bus Administrator, Process and Message Data , -40..+85°C with qualified components, conformal coating

This board can only be ordered together with a MEN Mikro box or panel PC
AccessoriesN/A