Diamond Systems SMT-GPIO96

Introduction

SMT-GPIO96 is a SUMIT-ISM Type 1 general purpose digital I/O module integrating Diamond's using a high-capacity PCI Express FPGA for maximum density and flexibility. This product integrates Diamond's FP-GPIO96 programmable digital I/O module and a SUMIT-ISM adapter board.

SMT-GPIO96 is a programmable SUMIT-ISM DIO module using a high-capacity (700K gate equivalent) PCI Express FPGA for maximum density and flexibility. The base hardware configuration features 96 digital I/O lines grouped into 12 8-bit ports. All ports have I/O buffers to protect the FPGA and feature 5V logic drive levels. The ports are organized into a combination of byte-wide, nibble-wide, and bit-wide direction control for maximum flexibility and application compatibility.

The built-in FPGA personality provides multiple configuration options. All 96 I/O lines may be used in common I/O mode; Six of these ports can be reconfigured to enable an array of additional features, including 8 32-bit up/down counter/timers with programmable input source and gate, 4 24-bit PWM circuits with 0-100% duty cycle capability and interrupt/latched mode operation.

The flash-based design enables easy field upgrades using a Diamond-provided software utility (no cable or third-party software required!) as well as custom code development. Universal Driver software support (described below) is included for Linux, Windows XP, Windows Embedded CE/Standard.

Block Diagrams

Software

The industry-leading Universal Driver software is available free with all Diamond Systems I/O boards. Universal Driver provides programming support for the most popular embedded operating systems, including Linux, Windows 95/98/NT/2000/XP/XP embedded, Windows CE.NET, QNX, VxWorks, and DOS. Example programs are provided for each function and each operating system to help you get started with your application development quickly.

Featurepak

The FeaturePak™ Trade Association, originated by Diamond Systems, was launched at the Embedded World tradeshow in March, 2010. The FeaturePak Specification defines a highly-compact, low-profile, and inexpensive way to add configurable I/O functions to embedded systems. The tiny FeaturePak modules -- measuring just 1.70 x 2.55 inches -- can be used for providing snap-in options or upgrades for off-the-shelf single board computers (SBCs) and computer-on-module (COM) baseboards, or as building blocks to simplify the development of fully-custom embedded electronics. Additionally, FeaturePak modules provide "zero height expansion," in that they fit within the normal component envelope of an SBC or COM baseboard and add no height to PC/104-style I/O expansion stacks.