Diamond Point International
 
Themis Computer

Themis TPA-XMC PrPMC/PrXMC

Powerful Dual Core 64-bit Processing & Flexible High Speed I/O

All In A Small Form Factor

 
Themis TPA-XMC
 
  • PA Semi PA6T-1682M Dual Core 2.0GHz CPU
  • 1 or 2GB soldered DDR2-400 ECC Memory
  • 128MB of OS Kernel NAND Flash Memory
  • Dual Port 2MByte Shared L2 Cache
  • DDR2 Memory Controller
  • 64-bit 133MHz PCI-X
  • Linux® and VxWorks® support



Datasheet/Manual:

Themis TPA-XMC datasheet in PDF format Datasheet in PDF format
Manual available on request Manual available on request

 

Introduction

Themis' new TPA-XMC™ is the first in a new family of PrPMC/PrXMC modules based on P.A. Semi's PA6T-1682M™ Power Architecture processor. The TPA-XMC provides powerful dual-core 64-bit processing, flexible high-speed I/O, and low power consumption in a small form factor.

The P.A. Semi PWRficient-1682M processor, based on the industry standard 64-bit implementation of the Power Architecture, redefines power, cost, and throughput efficiency in high-performance computing. The unique dual core, system-on-chip architecture, underpinned by 50 patents (filed and pending), delivers high performance at very low power consumption. The PWRficient-1682M includes the ENVOI™ I/O subsystem enabling a configurable mix of Gigabit Ethernet, 10 Gigabit Ethernet and PCI-express.

Themis' new TPA-XMC™ is the first in a new family of PrPMC/PrXMC modules based on P.A. Semi's PA6T-1682M™ Power Architecture processor. The TPA-XMC provides powerful dual-core 64-bit processing, flexible high-speed I/O, and low power consumption in a small form factor. The P.A. Semi PWRficient-1682M processor, based on the industry standard 64-bit implementation of the Power Architecture, redefines power, cost, and throughput efficiency in high-performance computing. The unique dual core, system-on-chip architecture, underpinned by 50 patents (filed and pending), delivers high performance at very low power consumption. The PWRficient-1682M includes the ENVOI™ I/O subsystem enabling a configurable mix of Gigabit Ethernet, 10 Gigabit Ethernet and PCI-express. The TPA-XMC features the PWRficient-1682M on a PrPMC/PrXMC form-factor. It delivers higher 32-bit integer and floating point performance than existing PowerPC-based PMC modules, while consuming 30 percent less power. The TPA-XMC also provides the best 64-bit performance/power ratio in the industry. As energy costs continue to climb, Themis' energy efficient TPA-XMC is a practical upgrade for performance hungry, power constrained applications

Themis' TPA-XMC is designed for a wide range of networking, wireless infrastructure, storage and military/aerospace systems that run PowerPC® applications. Eighteen user-configurable SERDES lanes are available on the TPA-XMC to serve a wide range of high-speed requirements. Serdes I/O options include Gigabit and 10 Gigabit Ethernet and PCI-Express. Since the PWRficient-1682M achieves dramatically better performance per watt than competing multi gigahertz microprocessors, equipment manufacturers can use the TPA-XMC as the basis for products that run cool and efficiently, yet provide high performance.

The TPA-XMC provides support for many new or existing 32 or 64-bit PowerPC applications and Operating Support for Linux® and VxWorks®.

 
 

Specification

CPU:

P.A. Semi PA6T-1682M Dual Core 2.0GHz Processor

Memory:

Dual Port 2MByte Shared L2 Cache
DDR2 Memory Controller
1 or 2GBytes of DDR2-400 ECC SDRAM Memory (soldered)
128Mbytes of OS Kernel NAND Flash Memory

Features:

Built-In Computation and Transformation Offload Engines for:

  • Bulk Encryption
  • Cyclic Redundancy Checking (CRC)
  • Streaming XOR Generation

Two 10GB and Four SGMII Protocol Engines Provide:

  • Packet Processing, including Line-Rate Packet Filtering
  • VLAN Flow Control
  • TCP/IP Acceleration

Auto detects Monarch or non-Monarch mode
Configurable SERDES lanes (18) on XMC connectors

Power:

Est. Maximum Power: 25 Watts, Est. Typical Power: 15 Watts

RTC:

Real Time Clock with 256 Bytes NVRAM

Bus:

64-bit / 133MHz PCI-X
PCIExpress (18 lanes)

User I/O

Gigabit Ethernet x2 (via front panel)
Serial Port x1 (via front panel)
SERDES Lanes x9 (via XMC Primary Connector)
SERDES Lanes x9 (via XMC Secondary Connector)
PCI-X (via PMC I/O Connector)

Shock:

Shock 30G @ 40mS

Vibration:

0.90G (rms), operating
2.97G (rms), non-operating

Temperature:

Operating: -0 - 50°C (convection),-40°C - 85 °C (conduction)
Non operating: -40°C - 95 °C

Humidity:

10 – 95% non-condensing

ROHS Status:

TBC


Ordering Details:
Board:

Please contact us for further details.

Accessories:

Please contact us for further details.

Further Information:

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