Fusion-io ioDrive

Specification

Capacity:

800GB

160GB

320GB

320GB

640GB

NAND Type:

Single Level Cell (SLC)

Single Level Cell (SLC)

Single Level Cell (SLC)

Multi Level Cell (MLC)

Multi Level Cell (MLC)

Read Bandwidth:

760 MB/s
(64k packet size)

770 MB/s
(64k packet size)

770 MB/s
(64k packet size)

735 MB/s
(64k packet size)

750 MB/s
(64k packet size)

Write Bandwidth:

540 MB/s
(64k packet size)

750 MB/s
(64k packet size)

790 MB/s
(64k packet size)

510 MB/s
(64k packet size)

550 MB/s
(64k packet size)

Read IOPS:

140,000 (512 byte)

140,000 (512 byte)

140,000 (512 byte)

100,000 (512 byte)

93,000 (512 byte)

Write IOPS:

135,000 (512 byte)

135,000 (512 byte)

135,000 (512 byte)

141,000 (512 byte)

145,000 (512 byte)

Mixed IOPS

123,000 (75/25 r/w)

123,000 (75/25 r/w)

119,000 (75/25 r/w)

67,000 (75/25 r/w)

74,000 (75/25 r/w)

Access Latency:

26 μs Read
2 μs Write

26 μs Read
2 μs Write

26 μs Read
2 μs Write

29 μs Read
2 μs Write

30 μs Read
2 μs Write

Bus Interface:

PCI-Express x4

Weight:

Less than 2 ounces

Operating Systems:

Linux:

CentOS4, CentOS4
Chaos 4.3
Debian Lenny, Debian Squeeze
Fedora Core 11, 12 & 13
OpenSuSe 11.0
Oracle Enterprise Linux 5
Red Hat Enterprise Linux 4, 5, 6
SuSe Linux Enterprise Server 10, 11
Ubuntu 8.04, 9.04, 9.1, 10.4
Binaries and source code available from Fusion-io support site

Windows:

Microsoft Windows XP Professional 64-Bit (with SP2 or higher)
Microsoft Windows 2003 Server 64-Bit (with SP2 or higher)
Microsoft Windows 2008 Server 64-Bit, all versions (with SP1 or higher)
Microsoft Windows Vista, all 64-bit versions
Microsoft Windows 7, all 64-bit versions
Binaries available from Fusion-io support site

Solaris:

Solaris 10 support coming soon (currently in beta Q1 2011)

VMware:

ESX 4.0. 4.1

All:

ioDrive is not bootable
32-Bit operating systems are not supported

Endurance:

24yrs

24yrs

24yrs

16yrs

16yrs

Wear Leveling and Sophisticated ECC (@ 5-TB write-erase / day)

Multi-bit error detection and correction
Patent-pending Flashback protection, offering chip-level N+1 redundancy and on-board self-healing so that no servicing is required

Form Factor:

Low profile PCI Express x4 slot (spec 1.1), 1/2 length

Connectivity:

PCI Express x4 (electromechanical spec 1.1)

Power:

PCI Express x4 (power spec 1.1)

Temperature:

Operating: 0° to 55°C
Non-operating: -40° to 70°C.
Temperature derated 1° C per 1000 ft elevation above sea level

Humidity:

Operating (not condensing):5% to 95%
Non-operating (not condensing): 5% to 95%

Air Flow (LFM):

300

Altitude:

Operating: 10,000 feet
Non-operating: 30,000 feet

Safety:

US / Canada: UL60950, CSA C22.2 No.60950-1-03
Europe: TUV EN60950-1:2001; 3N50825-1:

Agency:

US / Canada: FCC Part 15, ICES-003, Class A
Europe: 2004/108/EC EMC Directive CE Mark;
Japan: VCCI, Class A
Taiwan: BSMI, Class A
New Zealand /Australia: AS/NZS 3548 Class A

Manufactured:

100% Assembled in the U.S.A.

Warranty:

5 years

ROHS Status:

This product is lead free/ROHS compliant.