Diamond Point International
 
Themis Computer

Themis TGA3D+

Sun XVR-500 Graphics

For Themis USPIIIe Single Board Computer

 
Themis TGA3D+
 
  • Onboard 3D geometry accelerator
  • Onboard rasterization engine
  • 32 MB frame buffer memory
  • 16 MB texture memory
  • Upto 8.5 million triangles per sec
  • Onboard 64bit/33MHz PMC slot
  • Resolutions: 640x480 - 1920x1080
  • Solaris 8 & 9 support



Datasheet/Manual:

Themis TGA3D+ datasheet in PDF format Datasheet in PDF format
Manual available on request Manual available on request

 

Introduction

Themis’ new TGA3D+ is a high performance graphics accelerator for the USPIIIi single-board computer. The TGA3D+ features onboard 3-D geometry acceleration, hardware based texture mapping, and high resolution 24-bit 2-D support. Ideal for applications that require a high performance 3-D solution with hardware-based texture mapping, the TGA3D+ provides graphics capabilities well beyond the reach of PMC form factor graphics adapters.

XVR-500 Compatibility For High Performance For High End 3-D Applications

Themis’ TGA3D+ adapter is a high performance COTS solution for use in command and control systems, geotechnical, high-end MCAD, visualization and simulation applications. Themis’ TGA3D+ is based on Sun Microsystems™ XVR-500 graphics controller, insuring software compatibility with applications running on Sun™ workstations and servers. Themis’ TGA3D+ is a graphics processing companion board for Themis’ VMEbus processor. All graphics components, including the geometry processor, raster engine, PCI bridge and host interconnect are included on the single slot board. The TGA3D+ board also includes a PMC slot, to host a PMC based graphics board, such as Peritek’s Eclipse3, thus achieving dual head graphics capability in a single VMEbus slot (2 slots including the USPIIe baseboard).

TGA3D+ Features

  • Onboard 3D geometry accelerator
  • Onboard rasterization engine
  • 32 MB frame buffer memory
  • 16 MB texture memory
  • Up to 8.5 million triangles per second
  • Up to 160 million textured pixels per second tri-linear fill rate
  • Stereoscopic graphics support up to 960x680, 1152x900, 1280x800
  • True colour, double and Z-buffering up to 1920x1080
  • 32 bit Z-buffering at all resolutions
  • Support for up to two TGA3D+ boards
  • Onboard 64bit/33MHz PMC slot
  • Operating resolutions: 640x480 to 1920x1080
  • Solaris 8 & 9 support
  • Sun OpenGL for Solaris 1.2.1 and later

TGA3D+ Benefits

  • Themis Computer TGA3D+ benefits include:
  • Easily configured into systems already configured with the USPIIe Single Board Computers
  • Allows for two graphics heads in a single 6U slot for space constrained environments
  • Compatibility with Sun workstation 24-bit 2-D and 3-D XVR-500 environments
  • Designed to operate reliably in extreme environments
    • up to 40 G’s shock
    • -5°C to- 55°C operational temperature range
  • Provides the industry’s highest 3-D graphics performance in a single slot VMEbus configuration
Available with many baseboard connector options, the TGA3D+ must be ordered with a baseboard.
 
 

Specification

Board: 6U VME Form Factor
Graphics Memory: 3D Frame Buffer Memory: 32MB
3D Texture Memory: 16MB
PCI Interface: 64-bit/33MHz or 64bit/66MHz
Video Connection: VGA video connector on front panel
Stereo Goggles: support via Sun standard 8-pin mini-din connector
Operating resolutions: 640x480 to 1920x1080
O/S: Solaris 8 and 9 Operating Environment Support
Sun OpenGL for Solaris 1.2.1 and later
Shock: (Operating) up to 40 G @ 20 ms
Vibration: (Operating): 0.5g from 4 – 50Hz
(Non-Operating) 1.0g from 4 – 50Hz
Temperature: Operating: -5 - 55°C
Non-Operating: -40 - 85 °C
Humidity: 10 – 95% non-condensing
Power: +5V (± 5%) @ 5.4 Amps maximum
Power Consumption : 24 Watts (base)
29Watts (with PMC card)
Dimensions (HxD): 6U 6.299” (160mm) x 9.173” (233mm)
Weight: approx. 1.2 lbs. (Baseboard only, weights vary by board configuration)
ROHS Status: This product is not lead free/ROHS compliant

Ordering Details:
Board:

Please contact us for further details.

Accessories: Please contact us for further details.
Further Information:

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