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Diamond Point International

Aitech CM870 - 3U VPX PMC/XMC Carrier Board

PMC/XMC I/O Routed to VPX P2, No need for Software Drivers


As the processing power of SBCs continues to increase, expanding system functionality by means of PCI Mezzanine Cards (PMCs) and Switched Mezzanine Cards (XMCs) is frequently the method of choice for maximizing performance while minimizing system size, power consumption, and cost.

To facilitate expandability beyond the PMC/XMC sites on 3U VPX SBCs, Aitech has developed the CM870 PMC/XMC Carrier. The CM870 provides an additional active interface between the 3U VPX backplane and a PMC/XMC, for each available 3U VPX backplane slot. Four PCIe x4 (four lane) links are routed to the VPX backplane connector to enable fast connection with the processor board over the switch fabric in OpenVPX systems.

In addition, CM870 can operate as a 4 port VPX switch supporting up to 4 VPX PCIe agents (slots). Designed for harsh environment applications, the CM870 is available in commercial and rugged air-cooled or conduction-cooled configurations.

With its low power consumption, the CM870 expands capabilities while consuming minimum resources.



FeaturesRugged/mil 3U VPX Carrier Board
VPX Backplane Fabric Interface with Support for up to Four (4) PCIe x4 Ports per VITA 46.3 and 46.4
PCI Express Revision 2.0 with Backward Compliance to PCIe 1.1
Configurable for Switch Operation Supporting up to Four (4) PCIe Ports per VITA 46.20 Profile SLT3-SWH-4F-14.4.4
PMC Site Supports 64-bit 66/133 Mhz PCI-X and 33/66 Mhz PCI
XMC Site Supports PCIe x8
PMC/XMC I/O Routed to VPX P2
64 PMC I/O Signals
35 Single Ended and 20 Differential XMC I/O Signals
No Need for Software Drivers
OpenVPX Compliant
Conduction- and Air-cooled Versions
Vibration and Shock Resistant


ExpansionOpenVPX Compliant
ElectricalThe CM870 takes its power, +5.0 V, from the VPX backplane as defined in the OpenVPX specification. The other power supplies are routed from the backplane to the PMC/XMC site.

Power consumption of the CM870 (not including the PMC/XMC module’s consumption) is as follows:
+5.0 V (± 5%) 1.1A
MechanicalAir-cooled per ANSI/VITA 46.0
Conduction-cooled per ANSI/VITA 46.0
Conduction-cooled REDI: per VITA 48.2
All mechanical formats are single slot 3U modules.
Conformal CoatingConformal coating on request
SoftwareTransparent to operating system
TemperatureSeries-100 Commercial
• Temperature range (operation): 0 to +55C
• Temperature range (storage): -40 to +85C

Series-200 Rugged
• Temperature range (operation): -40 to +71C
• Temperature range (storage): -50 to +100C

Series-400 Military
• Temperature range (operation): -55 to +85C
• Temperature range (storage): -62 to +125C

Ruggedization level is determined in the part numbering scheme - refer to datasheet for further details
HumiditySeries-100 Commercial: 0-90%
Series-200 Rugged, Series-400 Military: 0-95% or 0 to 100% with coating
WeightAir-cooled: < 300 g (0.66 lbs)
Conduction-cooled: < 330 g (0.73 lbs)
Conduction-cooled REDI: < 355g (0.79lbs)
AltitudeSeries-100 Commercial: 15,000ft
Series-200 Rugged, Series-400 Military: 70,000ft
VibrationSeries-100 Commercial
• Random (g2/Hz): 20-2000Hz/0.02 g2/Hz
• Sine (g PEAK): 10-100Hz/2g

Series-200 Rugged
• Conduction-cooled: Random (g2/Hz): 20-2000Hz/0.1 g2/Hz
• Conduction-cooled: Sine (g PEAK): 50-500Hz/10g
• Air-Cooled: Random (g2/Hz): 20-2000Hz/0.04 g2/Hz
• Air-Cooled: Sine (g PEAK): 10-100Hz/2g

Series-400 Military
• Conduction-cooled: Random (g2/Hz): 20-2000Hz/0.1 g2/Hz
• Conduction-cooled: Sine (g PEAK): 50-500Hz/10g
• Air-Cooled: Random (g2/Hz): 20-2000Hz/0.04 g2/Hz
• Air-Cooled: Sine (g PEAK): 50-500Hz/5.5g
ShockSeries-100 Commercial: 20g/6mS
Series-200 Rugged: Conduction-cooled: 40g/11ms, 100g/6ms
Series-200 Rugged: Air-Cooled: 30g/11ms, 75g/6ms
Series-400 Military: Conduction-cooled: 40g/11ms, 100g/6ms
Series-400 Military: Air-Cooled: 30g/11ms, 75g/6mS
Warranty1 Year

Ordering Details

BoardRefer to datasheet for ordering part number scheme