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Diamond Point International

MEN Mikro CB70C - Rugged COM Express® (VITA 59 RCE) with Intel® Core™ i7

2.1GHz Quad Core CPU, Up To 16GB DDR3 Memory, SATA RAID


The CB70C is a member of a new family of Rugged COM Express® modules which is controlled by a third generation Intel® Core™ i7 processor running at up to 3.1 GHz maximum turbo frequency bringing state-ofthe-art PC technology onto a small form factor. This means a scalable performance with 1 up to 4 cores, integrated graphics, as well as support of Intel® AMT or Open CL 1.1.

The board can be controlled using a Board Management Controller and an adaptable BIOS which ensures flexibility in tailoring the complete system for the final application. Intel® AMT support is actively integrated in the BIOS adaptation.

The modules are 100% compatible to COM Express® modules of Pin-out Type 6. They conform to the new VITA-59 standard which specifies the mechanics to make COM Express® modules suitable for operation in harsh environments.

The modules are embedded in a covered frame ensuring EMC protection and allowing efficient conductive cooling. Air cooling is also possible by applying a heat sink on top of the cover. The CB70C accommodates up to 16 GB of directly soldered main memory and supports other memory like USB Flash on the carrier board.

The interfaces include a combination of PCI Express® links, LVDS, DDI, VGA, high-definition audio, SATA, Ethernet and USB. The CB70C is screened for operation from -40°C to +85°C (Tcase). Only oldered components are used to withstand shock and vibration, and
the design is optimized for conformal coating. For evaluation and development purposes a microATX carrier board, the XC15, is available.



CPU SpecIntel® Core™ i7-3615QE, Quad Core, 2.3 GHz, 6 MB Cache, 45 W
Intel® Core™ i7-3612QE, Quad Core, 2.1 GHz, 6 MB Cache, 35 W
Intel® Core™ i7-3555LE, Dual Core, 2.5 GHz, 4 MB Cache, 25 W
Intel® Core™ i7-3517UE, Dual Core, 1.7 GHz, 4 MB Cache, 17 W
Intel® Core™ i5-3610ME, Dual Core, 2.7 GHz, 3 MB Cache, 35 W
Intel® Core™ i3-3120ME, Dual Core, 2.4 GHz, 3 MB Cache, 35 W
Intel® Core™ i3-3217UE, Dual Core, 1.6 GHz, 3 MB Cache, 17 W
Intel® Celeron® 1020E, Dual Core, 2.2 GHz, 2 MB Cache, 35 W
Intel® Celeron® 1047UE, Dual Core, 1.4 GHz, 2 MB Cache, 17 W
Intel® Celeron® 927UE, Single Core, 1.5 GHz, 1 MB Cache, 17 W
Intel® Celeron® 827E, Single Core, 1.4 GHz, 1.5 MB Cache, 17 W
ChipsetQM77 Platform Controller Hub (PCH)
Memory2 GB, 4 GB, 8 GB or 16 GB SDRAM system memory
DDR3 with ECC support
Up to 1066 MHz memory bus frequency
GraphicsIntegrated in processor and chipset
Maximum resolution: 2560 x 1600 pixels
One x16 link (PCI Express® graphics)
Three DDI ports, for DP, HDMI, DVI, SDVO
One LVDS dual channel, up to 48-bit RGB
NetworkOne 10/100/1000Base-T Ethernet channel
Three LED signals for LAN link, activity status and connection speed
StorageFour ports via COM Express® connector
Two ports with SATA Revision 2.x support, transfer rates up to 300 MB/s (3 Gbit/s)
Two ports with SATA Revision 3.x support, transfer rates up to 600 MB/s (6 Gbit/s)
RAID level 0/1/5/10 support
ExpansionSeven x1 links
PCIe® 2.x support
Data rate up to 500 MB/s in each direction (5 Gbit/s per lane)
USBFour USB 3.0 host ports, xHCI implementation, data rate up to 5 Gbit/s
Four USB 2.0 host ports, EHCI implementation, data rates up to 480 Mbit/s
Other8 GPIO lines
Input voltage supervision
Power sequencing
Board monitoring
Real-time clock (with supercapacitor or battery backup on the carrier board)
SMBus interface
BIOSInsydeH2O™ UEFI Framework


ExpansionIn accordance with proposed standard VITA 59 RCE: Rugged COM Express® in process
With conduction cooling cover and frame
Rugged COM Express® Basic, Module Pin-out Type 6
ElectricalSupply voltage/power consumption:
+12V (9 to 16 V), 48 W typ./ 70 W max.
+5V (-5%/+5%) standby voltage, 1.1 W in standby operation
Mechanical135 mm x 105 mm x 18 mm (height) (conforming to VITA 59 RCE Basic format)
Rugged COM Express® PCB mounted between a cover and a frame
SoftwareStandardWindows®, WES7 BSP available, Linux
TemperatureOperation (standard): -40° to 85°C Tcase (Rugged COM Express® cover/frame) (screened)
Storage:(extended): -40° to 85°C
HumidityOperation: max. 95% non-condensing
Storage: max. 95% non-condensing
Weight460 g (incl. cover and frame)
90 g (without cover and frame)
VibrationVibration (function): 1 m/s², 5 Hz - 150 Hz (EN 61373)
Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz (EN 61373)
Shock50 m/s², 30 ms (EN 61373)
MTBF415,714 h @ 40°C according to IEC/TR 62380 (RDF 2000)
Safety/CertificationPCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMCEMC behavior depends on the system and housing surrounding the COM Express® module. The Rugged COM Express® module in its cover and frame supports the system to meet the requirements of:
EN 55022 (radio disturbance)
IEC 61000-4-2 (ESD)
IEC 61000-4-3 (electromagnetic field immunity)
IEC 61000-4-4 (burst)
IEC 61000-4-5 (surge)
IEC 61000-4-6 (conducted disturbances)
Warranty2 Years

Ordering Details

Board15CB70-00 COM Express® "Basic", type 6, Intel® i7-3612QE, 2.1 GHz, 8 GB RAM, -40..+85°C Tcase screened; without VITA-59 conduction cooling frame
15CB70C00 Rugged COM Express® "Basic", type 6, Intel® i7-3612QE, 2.1 GHz, 8 GB RAM, -40..+85°C Tcase screened; with VITA-59 conduction cooling frame
15CB70C01 Rugged COM Express® "Basic", type 6, Intel® Celeron® 827E, 1.4. GHz, 2 GB RAM, -40..+85°C Tcase screened; with VITA-59 conduction cooling

The CB70C modules come without a heatspreader (see accessories)

Please note that boards are supplied with no cables, software or manuals.
Software/manuals are available electronically.
Accessories05CB00-00 Cooling-kit for COM Express® Basic and COM Express® Compact: heat sink with fan; to be used with module specific heat spreader
05CB70-00 Heat spreader for COM Express® CB70
08XC15-00 XC15, evaluation and development board for COM Express® and Rugged COM Express® (VITA-59) modules

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