The F50P is a versatile, rugged PowerPC® based single-board computer for embedded applications. It is controlled by an MPC8548, or optionally an MPC8543 PowerPC® processor (alternatively with encryption unit) with clock frequencies between 800 MHz and 1.5 GHz. The SBC is equipped with ECC-controlled, soldered-on DDR2 RAM for data storage, with up to 16 GB of solid-state Flash disk for program storage as well as industrial FRAM and SRAM.
The CPU card provides up to three Gigabit Ethernet channels, six USB ports, up to two SATA interfaces and up to 64 user-definable I/O lines controlled by an optional onboard FPGA. These interfaces can be combined in many variations and are available at the front or at the rear using the board's J2 connector. The J2 pin assignment and connector type are in compliance with the PICMG 2.30 CompactPCI® PlusIO standard - the migration path towards CompactPCI® Serial. Two USB and two RJ45 Ethernet connectors are already provided at the front panel, and space is left for an optional VGA connector.
The large FPGA on the F50P allows to add additional user-defined functions such as graphics, touch, serial interfaces, fieldbus controllers, binary I/O etc. for the needs of the individual application in an extremely flexible way. Before boot-up of the system, the FPGA is loaded from boot Flash. Updates of the FPGA contents can be made inside the boot Flash during operation. If the FPGA is assembled, the card needs an extra 4 HP in front panel space.
Equipped with a PCI-bridge chip, the F50P offers a full CompactPCI® interface (system slot functionality) for reliable system expansion. Apart from that, the F50P can also be used as a busless, stand-alone board, with power supply from the backplane.
Being designed for operation in a conduction or convection cooled environment, the F50P provides flexibility also in its cooling concept. Its firmly plugged-on CPU module is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling for the F50C model, which is also available by standard. For air cooling, the F50P version comes with a tailor-made heat sink on top of the cover, requiring an 8-HP front panel, for an extended temperature range of -40 to +70°C. The soldered components on the F50P withstand shock and vibration, and the board design is optimized for conformal coating.
The F50P comes with MENMON support. This firmware/BIOS can be used for bootstrapping operating systems (from disk, Flash or network), for hardware testing, or for debugging applications without running any operating system.