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Diamond Point International

MEN Mikro F22P - 3U cPCI® PlusIO Intel Core i7 Board

Up to 16 GB ECC DDR3 SDRAM, -40 to +85°C Operation

MEN Mikro F22P - 3U cPCI® PlusIO Intel Core i7 Board
Key Features
3U, Intel® Core™ i7, 3rd generation
CompactPCI® 2.0 or CompactPCI® PlusIO 2.30
Up to quad-core 64-bit processor
32-bit 4HP system master (or stand-alone)
Up to 16 GB DDR3 DRAM soldered, ECC
microSD™ card and mSATA slots
Up to -40 to +85°C operation, screened


The F22P versatile 4HP/3U single-board computer is a continuation of MEN's proven range of Intel® CPU boards. It is equipped with the high-performance third generation Intel® Core™ i7 processor running at up to 3.3 GHz maximum turbo frequency and offering the latest quad core processor architecture from Intel® with full 64-bit support. The CPU card delivers an excellent graphics performance and is designed especially for embedded systems which require high computing performance with low power consumption.

The F22P offers a 32-bit/33-MHz CompactPCI® bus interface and can also be used without a bus system. 4 USB 2.0 ports, 4 PCI Express® x1 links, 2 SATA 3 Gb/s and 2 SATA 6 Gb/s interfaces as well as one Gigabit Ethernet are led to the J2 rear I/O connector which is compatible with the PICMG 2.30 CompactPCI® PlusIO specification.

The F22P is equipped with a state-of-the-art fast DDR3 DRAM which is soldered to the F22P to guarantee optimum shock and vibration resistance. An mSATA disk and a microSD™ card device which are connected via a USB interface and a SATA channel offer nearly unlimited space for user applications.

The standard I/O available at the front panel of F22P includes graphics on a VGA connector, two PCIe®-driven Gigabit Ethernet as well as two USB 2.0 ports.

The F22P can be extended by different side cards. Additional functions include a digital video interface for flat panel connection via DVI (multimedia), a variety of different UARTs or another four USBs, SATA for hard disk connection and HD audio.

Thermal supervision of the processor and a watchdog for the operating system complete the functionality of the F22P. A TPM (Trusted Platform Module) chip is also assembled.

The F22P operates in Windows® and Linux environments as well as under real-time operating systems that support Intel®'s multi-core architecture. The InsydeH2O™ EFI BIOS was specially designed for embedded system applications.

Equipped with Intel® components exclusively from the Intel® Embedded Line, the F22P has a guaranteed minimum standard availability of 7 years.

The F22P is suited for a wide range of industrial applications, e.g. for monitoring, vision and control systems as well as test and measurement. Main target markets comprise industrial automation, multimedia, traffic and transportation, aerospace, shipbuilding, medical engineering and robotics.

The F22P comes with a tailored passive heat sink within 4 HP height. The robust design of the F22P makes the board especially suited for use in rugged environments with regard to shock and vibration according to applicable DIN, EN or IEC industry standards. The F22P is also ready for coating so that it can be used in humid and dusty environments.



CPU SpecIntel® Core™ i7-3615QE
• Up to 2.3 GHz processor core frequency
• 3.3 GHz maximum turbo frequency
• 6 MB last level cache integrated
• Four cores, eight threads
• 45 W TDP

Celeron® 1047UE
• 1.4 GHz processor core frequency
• 2 MB last level cache integrated
• Two cores, two threads
• 17 W TDP
ChipsetIntel® QM77 Platform Controller Hub (PCH)
MemoryUp to 16 GB SDRAM system memory
• Soldered
• DDR3 with ECC support
• 1066/1333/1600 MHz memory bus frequency
64 Mbits boot Flash
Serial EEPROM 2kbits for factory settings
GraphicsIntegrated in QM77 chipset
• 650 MHz graphics base frequency
• 1.2 GHz graphics maximum dynamic frequency

VGA connector at front panel

Two digital display interface ports available via side-card connector
• DisplayPort®, HDMI and SDVO (SDVO only on one interface)
• One additional DVI connector at front panel optional via side card
• Simultaneous connection of two monitors
• Two 10/100/1000Base-T Ethernet channels at the front
• RJ45 connectors at front panel
• Ethernet controllers are connected by two x1 PCIe® links
• Onboard LEDs to signal activity status and connection speed
• One 10/100/1000Base-T Ethernet channel via rear I/O
• Ethernet controller is connected by one x1 PCIe® link
StoragemicroSD™ card interface
• Connected via one USB port

mSATA disk slot
• Connected via one SATA channel

Serial ATA (SATA)
• Four channels via rear I/O, one channel via side-card connector, one channel for mSATA disk
• 4 SATA 3 Gbit/s interfaces, 2 SATA 6 Gbit/s interfaces (rear I/O)
• RAID level 0/1/5/10 support
• Two USB 2.0 ports via Series A connectors at front panel
• Four USB 2.0 ports via side-card connector
• Four USB 2.0 ports via rear I/O
• One USB for connection of microSD™
• EHCI implementation
• Data rates up to 480 Mbit/s
Front I/OVGA
Two USB 2.0 (Series A)
Two Ethernet (RJ45)
Rear I/OFour SATA
Four USB
One Gigabit Ethernet (second rear interface instead of one front interface as an assembly option)
Four PCI Express® x1 links
Compatible with PICMG 2.30 CompactPCI® PlusIO
• 1PCI33/4PCIE5/2SATA3/2SATA6/4USB2/1(2)ETH1G
AudioHigh Definition (HD) audio
• Accessible via side-card connector
OtherOther I/O (onboard, side card): SATA, SDVO, HD audio, USB, UART etc.

Busless Operation
• Board can be supplied with +5 V only, all other voltages are generated on the board
• Backplane connectors used only for power supply

Intel® Active Management Technology
Manageability Engine in Chipset
Network Filters in Chipset
Dedicated Flash Storage Area
Out of Band (OOB) Access
• Power off Access
• Independent of OS status
• Power status control
• Keyboard-Video-Mouse (KVM) Viewer (VNC-compatible)
• IDE-Redirect
• Serial-over-LAN
CommonBoard controller
Real-time clock, buffered by a GoldCap or alternatively a battery (5 years life cycle)
Watchdog timer
Temperature measurement
One user LED
Reset button
BIOSInsydeH2O™ UEFI Framework


ElectricalSupply voltage/power consumption (board versions with i7-2715QE processor)
• +5V (-3%/+5%), 9.6 A typ., 14.4 A max.
• +3.3V (-3%/+5%), 1.8 A (3 Gb Ethernet), 1.4 A (2 Gb Ethernet), 1 A (1 Gb Ethernet)
• +12V (-10%/+10%), approx. 10 mA
• If the board is supplied with 5V only (typically without a bus connection), the 3.3V are generated on the board and fed to the backplane (3A max.) No external 3.3 V voltage may be applied in that case!
MechanicalDimensions: conforming to CompactPCI® specification for 3U boards
Front panel: 4HP with ejector
Conformal Coatingon request
SoftwareNote that 64-bit hardware technology can be used in an optimal way with 64-bit operating system support
VxWorks® (on request)
QNX® (on request)
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems
TemperatureTemperature range (operation):
• Depends on system configuration (CPU, hard disk, heat sink...)
• Maximum: +85°C
• Minimum: -40°C (all processors)
• Conditions: airflow 1.5m/s, typical power dissipation: 12 W (board versions with i7-2715QE processor) with Windows® XP operating system and 1 Gb Ethernet connection
Temperature range (storage): -40..+85°C
HumidityRelative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Weight204 g (w/o heat sink)
VibrationVibration (function): 1 m/s², 5 Hz - 150 Hz
Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz
ShockShock: 50 m/s², 30 ms
MTBF549 414 h @ 40°C according to IEC/TR 62380 (RDF2000)
Safety/CertificationPCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMCTested according to EN 55022 (radio disturbance), IEC 61000-4-3 (electromagnetic field immunity), IEC 61000-4-4 (burst) and IEC 61000-4-6 (conducted disturbances)
Warranty2 Years

Ordering Details

F22P, 3U CompactPCI® (PICMG 2.0) and CompactPCI® PlusIO (PICMG 2.30) SBC, Intel® Celeron1047UE 1.4 GHz, 2 GB DDR3 DRAM with ECC, -40..+85°C screened

F22P, 3U CompactPCI® (PICMG 2.0) and CompactPCI® PlusIO (PICMG 2.30) SBC, Intel® Core™ i7-3615QE, 2.3 GHz, 4 GB DDR3 DRAM with ECC, 0..+45°C
2 COM extensions and SATA hard disk slot, for F14 and compatible SBCs, -40..+85°C screened

1 DVI-D and 1 audio at front, SATA hard disk slot, for F14 and compatible SBCs, 4HP, 0..+60°C

3U CompactPCI® side card with 2 USB and 1 COM extension, SATA hard disk and CompactFlash® slot, for F14 and compatible SBCs, mounted to the right of the SBC, 0..+60°C

2 Gigabit Ethernet on Lemo railway compliant connectors, 1 COM extension (SA-Adapter not included), SATA hard disk slot, for F14 and compatible SBCs, conformally coated, -40...+85°C screened

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