Manufacturer: MEN Mikro Elektronik
- Key Features
- COM Express® basic AMD V1000 APU
- VITA 59 in process
- Compliant with COM Express® Basic, type 6
- Up to 32 GB DDR4 DRAM, ECC, soldered
- 1x PCIe g3 x4, 7x PCIe g3 x1
- -40°C to +85°:C Tcase screened
Manufacturer: MEN Mikro Elektronik
The CB71C is an ultra-rugged COM Express module for rail, public transportation and industry applications, e.g. data acquisition, infotainment, transcoding, live 3D. It is 100% compatible to COM Express Type 6 Pin-Out and conforms to the VITA 59 standard which specifies the mechanics to ensure reliable operation even under the harshest environmental conditions.
The modules are embedded in a closed aluminum frame, which ensures optimum EMC protection and efficient conduction cooling. Direct air cooling is possible by placing a heat sink on the cover. The CB71C is designed for operation from -40°C to +85°C (housing). To withstand serious shock and vibration, only soldered components are used. The design is optimized for conformal coating.
The CB71C is based on AMD's V1000 APU family. It is equipped with a Radeon Vega next-generation 3D graphics engine and supports up to 4 displays with a resolution of up to 4k without the need for additional graphics hardware. With up to four high-performance processor cores and AMD-V extension, the CB71C is also suitable for virtualization.
The CB71C can be equipped with a wide range of long-term available processors with scalable performance, all supporting ECC. Passive cooling is possible with low-power versions.
The board features an advanced board management controller with monitoring functions for safety-relevant applications. In addition, the CB71C has a Trusted Platform Module and supports hardware memory encryption, providing protection against both physical and inter-VM storage attacks. This is essential for security-critical applications such as payment and ticketing terminals, fleet management or monitoring.
The CB71C can be equipped with up to 32 GB of directly soldered DDR4 main memory and a 16 GB eMMC. Available high-speed interfaces include PCI Express 3.0 links, DDI (DP, eDP, HDMI), SATA 3.0, Gigabit Ethernet and USB 3.0.
|CPU Spec||AMD V1404I, 4 cores, 4 threads, tbd GHz, 15W, 2 MB cache|
AMD V1807B, 4 cores, 8 threads, 3.35 GHz, 35-54W, 2 MB cache
|Memory||Soldered DDR4, ECC|
32 GB max.
|Graphics||Integrated in processor and chipset|
|Storage||2x SATA Revision 3.x|
eMMC (soldered); 16 GB max
|USB||3x USB 3.1|
3x USB 2.0
|Serial||2x UART, TTL|
|Other||4x general purpose inputs|
4x general purpose outputs
|Common||Board management controller|
|BIOS||AMI UEFI Firmware|
|Expansion||7x PCIe 3.0, x1|
1x PCIe 3.0, x4
CB71C: VITA 59 RCE: Rugged COM Express in process
• With conduction cooling cover and frame
• Rugged COM Express Basic, Module Pin-out Type 6
CB71: PICMG COM.0 COM Express Module Base Specification
• COM Express Basic, Module Pin-out Type 6
|Electrical||+12 V (9.5 to 15.5 V)|
|Mechanical||135 mm x 105 mm x 18 mm (models conforming to VITA 59 RCE Basic format, PCB mounted between a cover and a frame)|
125 mm x 95 mm (models conforming to PICMG COM.0 COM Express Basic format)
|Conformal Coating||On request|
|Temperature||Operation (standard): -40 to 85°C (VITA 59 cover/frame), compliant with EN 50155:2007, class TX (model 15CB71C00)|
Storage:(extended): -40 to +85°C, compliant with EN 50155:2007
• Conduction-cooled versions according to VITA 59 RCE: Rugged COM Express in process
• Air-cooled versions according to PICMG COM.0 COM Express standard
|Humidity||EN 50155:2007 (+25/+55°C, 90-100 %)|
|Altitude||-300 m to +3000 m|
|Vibration||EN 61373:2010, location: Vehicle body (Cat. 1; Class B)|
|Shock||EN 61373:2010, location: Vehicle body (Cat. 1; Class B)|
• EN 50155:2007
• EN 50153:2014
• EN 50124-1:2001 + A1:2003 + A2:2005
• EN 45545-2, hazard level HL3
• EMC behavior depends on the system and housing surrounding the COM Express module.
• Radiated Emission: EN 50121-3-2:2015
• Conducted Emission: EN 50121-3-2:2015
• Immunity: EN 50121-3-2:2015
Automotive): ECE R10 Rev.5 (E-mark)
COM Express "Basic", type 6, AMD V1404I, TBD GHz, 16 GB RAM, -40°C to +75°C (10 min +85°C), without VITA-59 conduction cooling frame
Rugged COM Express "Basic", type 6, AMD V1807B, 3.35 GHz, 32 GB RAM, -40..+85°C Tcase screened; with VITA-59 conduction cooling frame
|Accessories||05CB00-00 Cooling-kit for COM Express® Basic and COM Express® Compact: heat sink with fan; to be used with module specific heat spreader |
08XC15-00 XC15, evaluation and development board for COM Express® and Rugged COM Express® (VITA-59) modules