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MEN Mikro F701 - 3U cPCI/MEN Mikro F701 - 3U CompactPCI® MVB Interface CardCompactPCI® MVB Interface Card

MVB Interface EMD/ESD+ according to IEC 61375, -40 to +70°C Operation


The F701 is a MVB (Multifunction Vehicle Bus) to CompactPCI® interface and consists of a MVB controller, a local CPU and a CompactPCI® slave interface. It supports the wire based physical layers EMD (Electrical Middle Distance) or ESD+ (Electrical Short Distance), with galvanic isolation. As part of the TCN (Train Communication Network) railway standard IEC 61375, the F701 is designed to operate under harsh environmental conditions of -40 to +70°C, as is in accordance with EN 50155.

All features of the MVB architecture are supported and the F701 is available in the configurations 'MDFULL', the passive MVB interface for Process Data (PD) communication, or 'SERVER', the active MVB interface for both Process Data and Message Data (MD) communication. A full range MVB bus administrator is available for all configurations.

The F701 is designed to be mounted in a 19" rack CompactPCI® slot and features two D-Sub connectors which are accessible on the front panel and are used for the MVB connection. The F701 also provides a Serial Line interface as well as a JTAG interface, accessible directly on the board, for debugging and loading the flash memory.

The F701 supports the operating systems Windows® XP, Windows® 7 and Linux. VxWorks® and QNX® are also available on request.

The F701 is designed for use in railway applications, is fully compliant to the EN50155/EN50121 standards.



FeaturesData rate: 1.5 Mbit/s

Data frame size: 16 - 256 bits

Cyclic transmission of process data (PD) (broadcast)
• Control and status information
• Periodic broadcast communication: 16-512 ms, 1 ms possible (real-time)
• Up to 4096 telegrams (ports), at max. 32 bytes each

Event driven message data transfer (MD) (point-to-point)
• For online diagnostics, passenger information in normal operation
• For firmware download and collecting debugging data in field service
• On demand communication
• Destination addressed
• Response time: > 0,5 sec

Bus Administrator communication manager (BA)
• Synchronous, time-multiplexed communication
• Transmission data sequence organization (master_frame - slave_frame)

Full redundancy support

Physical layers
• ESD + (Electrical Short Distance) or EMD (Electrical Middle Distance)
• 20 m (ESD+) or 200 m (ESD+ and EMD), 32 nodes
• Galvanic isolation
• Compliant to TCN standard IEC 61375

MVB Connectors
• Two 9-pin D-Sub connectors on the front panel
• Both male (MVB 1) and female (MVB 2) D-Sub connectors
• Direct connection between D-Subs is possible
• M3 metric inner threading

Serial Line Interface
• For software debugging
• Transmission parameters: 115 kBaud
• Handshake lines: None

JTAG Interface
• For debugging and loading the flash memory

• 256 KB SRAM
• Traffic Memory for MVB interface
• 256 - 1280 KB SRAM
• General purpose memory
• 1 MB Flash

Software Structure Configurations
• MDFULL: Passive interface / Communication capabilities: PD and BA
• SERVER: Active interface / Communication capabilities: PD, MD and BA

Diagnostic by LED
• 8 diagnostic LEDs
• Used for self test purposes
• Displays the test number
• Indicates reason for failure

Reset Mechanism
• Onboard under-voltage supervision circuitry

Power Up (PLD Loading)
• Automatically loads the PLD chips after power-on


Expansion32-bit/33-MHz at connector J1
Signaling voltage: +5.0 V
Compliant with PICMG 2.0 R3.0
For data communication path between F701 and host
ElectricalSupply voltage/power consumption:
• +5 V (-3%/+5%), tbd typ./max.
MechanicalDimensions: 160 mm x 100 mm x 20.32 mm
Conformal CoatingConformal coating (standard)
SoftwareWindows® XP
Windows® 7
Linux (tested with Ubuntu 14.04 LTS)
VxWorks® (on request)
QNX® (on request)
TemperatureTemperature range (operation): -40°C to 70°C with screened components
Temperature range (storage): -40..+85°C
HumidityRelative humidity range (operation): max. 95% non-condensing
Relative humidity range (storage): max. 95% non-condensing
Weight158 g
Vibration• 2 mm for 5 - 25 Hz
• 50 m/s² for 25 - 150 Hz
Shock50 m/s² (duration 50 ms)
Safety/CertificationPCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMCEN 50121-3-2:2006: Electromagnetic compatibility
IEC 61375-1:2007: MVB physical layer isolation
EN 50155:2007 12.2.9: Isolation measurement test/voltage resistance test
EN 50155:2007 4.1.3: Shock and vibration
IEC 61375-1:2007: MVB (Clause 3, Multifunction Vehicle Bus)
EN 60068-2-30:2006: Humidity
Warranty2 Years

Ordering Details

MVB ESD+ Device, Process and Message Data, -40..+70°C screened, conformal coating

MVB ESD+ Bus Administrator, Process and Message Data, -40..+70°C screened, conformal coating

MVB EMD Device, Process and Message Data, -40..+70°C screened, conformal coating

MVB EMD Bus Administrator, Process and Message Data, -40..+70°C screened, conformal coating